Patents by Inventor Hsien-Yin Tsai

Hsien-Yin Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11661681
    Abstract: A multifunctional smart garment textile is disclosed herein. It comprises plural conductive yarns, wherein each of the plural conductive yarns includes cotton threads, multiwalled carbon nanotubes and iodine-modified polypyrrole, and wherein the cotton threads, the multiwalled carbon nanotubes and the iodine-modified polypyrrole are intermingled with each other in a weight ratio ranging from 1:1:1 to 3:1:1.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: May 30, 2023
    Inventors: Stephen Tsai, Hsien-Yin Tsai
  • Publication number: 20220056237
    Abstract: A method of manufacturing decoration foils and a release layer and an adhesive layer of the decoration foil, and decoration foils manufactured by the same are revealed. First take waste containing polyethylene terephthalate (PET) to react with an alcohol and get a first product. Then the first product is allowed to react with a compound containing isocyanate group and polyol to obtain polyurethane (PU) material. The PU material obtained is used for manufacturing at least one of a release layer and an adhesive of decoration foils to get the decoration foil.
    Type: Application
    Filed: August 10, 2021
    Publication date: February 24, 2022
    Inventors: KUO-LUNG TSAI, HSIEN-CHANG LEE, HSIEN-YIN TSAI, MING-CHIEH KUO, CHIEN-LIANG KUO
  • Publication number: 20220025557
    Abstract: A multifunctional smart garment textile is disclosed herein. It comprises plural conductive yarns, wherein each of the plural conductive yarns includes cotton threads, multiwalled carbon nanotubes and iodine-modified polypyrrole, and wherein the cotton threads, the multiwalled carbon nanotubes and the iodine-modified polypyrrole are interwoven with each other in a weight ratio ranging from 1:1:1 to 3:1:1.
    Type: Application
    Filed: September 23, 2020
    Publication date: January 27, 2022
    Inventors: STEPHEN TSAI, HSIEN-YIN TSAI
  • Publication number: 20040235636
    Abstract: Compositions for producing a glass substrate comprise SiO2 with a weight percentage (wt %) from 55% to 70%, Al2O3 from 10 wt % to 18 wt %, B2O3 from 10 wt % to 15 wt %, CaO from 0 wt % to 10 wt %, SrO from 0 wt % to 4 wt %, and a particular composition for forming a network structure of SiO2 from 0.01 wt % to 10 wt %, in which the particular composition can be selected from a group consisting of Y2O3 and La2O3.
    Type: Application
    Filed: December 29, 2003
    Publication date: November 25, 2004
    Applicant: Picvue Optoelectronics International, Inc.
    Inventors: Hsien-Yin Tsai, Chien-Sheng Yeh
  • Patent number: 6410142
    Abstract: Disclosed is a sPS nanocomposite with improved crystallization properties and higher mechanical strength, which comprises a polymer matrix containing syndiotactic polystyrene (sPS), and a layered clay material uniformly dispersed in the polymer matrix. The layered clay material is intercalated with an organic onium cation and optionally along with a polymer or oligomer which is compatible or partially compatible with sPS. The interlayer distances of the layered clay material are at least 20 Å. The sPS nanocomposite can be prepared by ways of in-situ polymerization, melt blending, or solution blending. According to the invention, the layered clay material dispersed in the sPS matrix not only leads to higher mechanical strength, but also, surprisingly, improves crystallization properties of sPS.
    Type: Grant
    Filed: July 14, 2000
    Date of Patent: June 25, 2002
    Assignee: Industrial Technology Research Institute
    Inventors: In-Mau Chen, Wen-Faa Kuo, Hsien-Yin Tsai, Jeng-Yue Wu
  • Publication number: 20020062926
    Abstract: A resin composition with a low dielectric constant comprises: (a) a functionalized cyclic olefin copolymer; (b) a mixture of epoxy resins; and (c) a curing agent. A laminate and a resin coated clad made of the resin composition exhibit reduced dielectric constants of 3.3 and 2.9 at 1 GHz, respectively.
    Type: Application
    Filed: May 16, 2001
    Publication date: May 30, 2002
    Applicant: Industrial Technology Research Institute
    Inventors: Hsien-Yin Tsai, Joung-Yei Chen, Hsi-Hsin Shih, Chi-Lan Li, Wei-Han Liao
  • Patent number: 6388009
    Abstract: A low dielectric constant composition used in electric circuit boards is disclosed. The composition includes (a) 20-99.9 parts by weight of a functionalized syndiotactic styrene/para-alkystyrene copolymer having microfoaming when being cured; (b) 0.01-80 parts by weight of a mixture of epoxy resins; and (c) less than 50 parts by weight of a curing agent.
    Type: Grant
    Filed: November 24, 1999
    Date of Patent: May 14, 2002
    Assignee: Industrial Technology Research Institute
    Inventors: Wei-Han Liao, Hsien-Yin Tsai, In-Mau Chen
  • Patent number: 6180725
    Abstract: A resin composition which increases the copper peeling strength and improves the dielectric properties of electric circuit boards is disclosed. The resin composition comprises: (a) 20-100 parts by weight of a syndiotactic polystyrene, (b) 1-40 parts by weight of a functionalized syndiotactic styrene-based copolymer having microfoaming when being cured, (c) 1-40 parts by weight of an epoxy-styrene copolymer, and (d) 0-40 parts by weight of an additive.
    Type: Grant
    Filed: July 29, 1999
    Date of Patent: January 30, 2001
    Assignee: Industrial Technology Research Institute
    Inventors: Hsien-Yin Tsai, In-Mau Chen, Wen-Faa Kuo