Patents by Inventor Hsien Yu Wu

Hsien Yu Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Headphone of convenient assembly and package
    Patent number: 8275166
    Abstract: A headphone of convenient assembly and package includes a first earpiece and a second earpiece. The first earpiece has a tubular first casing and the first casing includes a first ear plug. The second earpiece has a tubular second casing and the second casing includes a second ear plug. The first casing has a clasping portion at an end opposite to the first ear plug. The second casing has a clasping recess at an end opposite to the second ear plug for receiving the clasping portion. Therefore, the first earpiece and the second earpiece can be assembled together into a tubular single piece, benefiting the first earpiece and the second earpiece for being packaged and carried, thus improving the convenience of the headphone.
    Type: Grant
    Filed: March 5, 2010
    Date of Patent: September 25, 2012
    Assignee: Multi-Direction Co., Ltd.
    Inventor: Hsien Yu Wu
  • Headphone of Convenient Assembly and Package
    Publication number: 20110216932
    Abstract: A headphone of convenient assembly and package includes a first earpiece and a second earpiece. The first earpiece has a tubular first casing and the first casing includes a first ear plug. The second earpiece has a tubular second casing and the second casing includes a second ear plug. The first casing has a clasping portion at an end opposite to the first ear plug. The second casing has a clasping recess at an end opposite to the second ear plug for receiving the clasping portion. Therefore, the first earpiece and the second earpiece can be assembled together into a tubular single piece, benefiting the first earpiece and the second earpiece for being packaged and carried, thus improving the convenience of the headphone.
    Type: Application
    Filed: March 5, 2010
    Publication date: September 8, 2011
    Inventor: Hsien-Yu WU