Abstract: A rapid heat dissipation device is provided to use for a heat source, and includes a heat conducting plate, a heat dissipating fin group, one or a plurality of heat pipes and a siphon heat-dissipating device. The heat conducting plate is thermally attached to the heat source. The heat dissipating fin group is arranged on one side of the heat conducting plate. One end of the heat pipe is fixed to the heat conducting plate, and another end is fixed to the heat dissipating fin group. The siphon heat-dissipating device is stacked above the heat pipe, and one end is fixed to the heat-conducting plate and another end is fixed to the heat-dissipating fin group. Through the siphon heat-dissipating device overlapping up and down with the heat pipe and having the same direction to achieve uniformly heat dissipating and cooling.

Abstract: A rapid heat dissipation device is provided to use for a heat source, and includes a heat conducting plate, a heat dissipating fin group, one or a plurality of heat pipes and a siphon heat-dissipating device. The heat conducting plate is thermally attached to the heat source. The heat dissipating fin group is arranged on one side of the heat conducting plate. One end of the heat pipe is fixed to the heat conducting plate, and another end is fixed to the heat dissipating fin group. The siphon heat-dissipating device is stacked above the heat pipe, and one end is fixed to the heat-conducting plate and another end is fixed to the heat-dissipating fin group. Through the siphon heat-dissipating device overlapping up and down with the heat pipe and having the same direction to achieve uniformly heat dissipating and cooling.

Abstract: A heat dissipation apparatus includes a vapor chamber and multiple flow field fins. The vapor chamber includes a lower plate part and an upper plate part. The lower plate part includes multiple flow channels, a first and a second confluence areas formed on the flow channels. The upper plate part covers on the lower plate part to enclose the flow channels, the first and second confluence areas. Each flow field fin includes an inlet channel, an outlet channel, and a circuitous channel. The inlet channel communicates with the first confluence area, the outlet channel communicates with the second confluence area, and the circuitous channel communicates between the inlet channel and the outlet channel in a single flow direction. The flow field fins are collectively as an inlet surface at one side adjacent to the outlet channel and as an outlet surface at another side adjacent to the inlet channel.

Abstract: A temperature controlling method of a liquid cooling device includes a providing step, a disposing step and a processing and controlling step. In the providing step: a microprocessor and multiple flexible micro sensors are provided. In the disposing step: the microprocessor is disposed on the liquid cooling device (including an evaporator, a condenser, a cold water tube, a hot water tube, a pumping motor and a cooling fan motor), and the micro sensors are separately disposed in the cold water tube and the hot water tube to directly contact with the liquid. In the processing and controlling step: the microprocessor receives data sensed in the cold water tube and the hot water tube by the micro sensors to calculate, and controls the pumping motor and the cooling fan motor to modulate an operating performance according to a calculated result.

Abstract: A heat dissipation apparatus includes a heat sink unit, a flow guiding structure and a fan. In addition, the heat sink unit includes a base and a fin set arranged on the base. The flow guiding structure includes an air shield and an engagement frame arranged at one end of the air shield. The air shield includes an enclosure space formed at an internal thereof. The enclosure space includes an opening formed at two ends of the air shield respectively, and the air shield covers an exterior of the fin set with the enclosure space. The engagement frame is selectively arranged at an exterior of any one of the openings of the air shield; and a fan is arranged on the engagement frame.

Abstract: A hard drive rack ventilation structure includes a primary rack, a plurality of secondary racks and hard drive units. The secondary racks are stacked in layers and assembled inside the primary rack. Each secondary rack includes a top portion and side portions extended downward from two sides thereof, and the two side portions include corresponding sliding tracks thereon. The hard drive units are installed on the sliding tracks of the secondary racks. Each hard drive unit includes a hard drive main body and a handle installed at a front thereof. A gap is formed between the handle and the hard drive main body. A top front edge of each secondary rack includes a hollow portion formed corresponding to the gap of each hard drive unit. The hollow portions and the gaps of the hard drive units are fluidly and vertically connected to form an airflow ventilation channel.

Abstract: A hard drive rack ventilation structure includes a primary rack, a plurality of secondary racks and hard drive units. The secondary racks are stacked in layers and assembled inside the primary rack. Each secondary rack includes a top portion and side portions extended downward from two sides thereof, and the two side portions include corresponding sliding tracks thereon. The hard drive units are installed on the sliding tracks of the secondary racks. Each hard drive unit includes a hard drive main body and a handle installed at a front thereof. A gap is formed between the handle and the hard drive main body. A top front edge of each secondary rack includes a hollow portion formed corresponding to the gap of each hard drive unit. The hollow portions and the gaps of the hard drive units are fluidly and vertically connected to form an airflow ventilation channel.

Abstract: A server heat dissipation channel structure, used in a server having a plurality of heat generating sources installed therein, includes an upper guiding shield, a lower guiding shield and a fan. The upper guiding shield includes an upper entrance section and a flow guiding channel extended therefrom. The lower guiding shield includes a lower entrance section and a first heat dissipation channel extended therefrom. The fan includes an air output plane facing toward the upper entrance section and the lower entrance section correspondingly at the same time. In addition, the upper guiding shield includes a downward slanted channel at a rear end of the flow guiding channel opposite from a rear end of the first heat dissipation channel and a second heat dissipation channel extended from the first heat dissipation channel. The first and second heat dissipating channels respectively pass through different heat generating sources installed inside the server.