Patents by Inventor Hsin-An Chiang

Hsin-An Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11973275
    Abstract: An antenna for multi-broadband and multi-polarization communication, may include a plurality of radiators configured to jointly function as one or more dipoles, a first feed terminal for a first signal of a first polarization, and a second feed terminal for a second signal of a second polarization different from the first polarization. Each radiator may be configured to contribute to resonances at two or more nonoverlapping bands. In an embodiment, the antenna may further include a third feed terminal for a third signal of the first polarization, and a fourth feed terminal for a fourth signal of the second polarization.
    Type: Grant
    Filed: June 13, 2022
    Date of Patent: April 30, 2024
    Assignee: MEDIATEK INC.
    Inventors: Chung-Hsin Chiang, Li-Yu Chen, Shih-Huang Yeh
  • Publication number: 20240134239
    Abstract: A display device including a substrate, a cholesteric liquid crystal layer, and a transparent electrode layer that are sequentially stacked is provided. The cholesteric liquid crystal layer includes cholesteric liquid crystal molecules and a plurality of transparent photoresist structures. Each of the transparent photoresist structures is a closed structure, and the cholesteric liquid crystal molecules are respectively accommodated in a plurality of patterned areas respectively surrounded by the transparent photoresist structures, so as to form a plurality of cholesteric liquid crystal patterns. The transparent electrode layer includes a plurality of sub-electrodes. The cholesteric liquid crystal patterns are respectively driven by the sub-electrodes. An orthogonal projection of each of the transparent photoresist structures on the substrate falls in an orthogonal projection of a corresponding sub-electrode of the sub-electrodes on the substrate.
    Type: Application
    Filed: October 22, 2023
    Publication date: April 25, 2024
    Applicant: AUO Corporation
    Inventors: Chun-Han Lee, Chien-Chuan Chen, Ju-Wen Chang, Hsin Chiang Chiang, Peng-Yu Chen
  • Patent number: 11955507
    Abstract: A light-emitting device, including a first type semiconductor layer, a patterned insulating layer, a light-emitting layer, and a second type semiconductor layer, is provided. The patterned insulating layer covers the first type semiconductor layer and has a plurality of insulating openings. The insulating openings are separated from each other. The light-emitting layer is located in the plurality of insulating openings and covers a portion of the first type semiconductor layer. The second type semiconductor layer is located on the light-emitting layer.
    Type: Grant
    Filed: September 9, 2021
    Date of Patent: April 9, 2024
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Hsin-Hung Li, Wei-Syun Wang, Chih-Chiang Chen, Yu-Cheng Shih, Cheng-Chan Wang, Chia-Hsin Chung, Ming-Jui Wang, Sheng-Ming Huang
  • Publication number: 20240097336
    Abstract: An antenna device is provided, which includes a ground plate, a patterned radiating layer and a wall structure. The patterned radiating layer is arranged above the ground plate. The wall structure is formed above the ground plate. On a first reference plane substantially parallel with the ground plate, a projection of the wall structure overlaps a projection of the patterned radiating layer. With respect to a first reference axis substantially perpendicular to the ground plate, an upper surface of the wall structure is lower than the patterned radiating layer.
    Type: Application
    Filed: September 7, 2023
    Publication date: March 21, 2024
    Inventor: Chung-Hsin CHIANG
  • Patent number: 11934027
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Patent number: 11937371
    Abstract: A radio frequency (RF) system and a communication device are provided. The RF system includes a flexible circuit board, a first antenna module and a RF module. The flexible circuit board has a first surface and a second surface, and the first surface and the second surface are located at different sides of the flexible circuit board. The first antenna module is disposed on the first surface of the flexible circuit board. The first antenna module includes a first carrier, a first antenna element disposed on or in the first carrier, and a first conductive member between the first carrier and the flexible circuit board. The RF module is disposed on the second surface of the flexible circuit board and electrically connected to the first antenna module.
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: March 19, 2024
    Assignee: MEDIATEK INC.
    Inventors: Wun-Jian Lin, Chung-Hsin Chiang, Yeh-Chun Kao, Shih-Huang Yeh
  • Publication number: 20240088561
    Abstract: An antenna structure is provided. The antenna structure includes a first metal layer and a second metal layer disposed over the first metal layer. The second metal layer forms a first antenna resonating element operating at a first band and has a first opening. The antenna structure also includes a third metal layer disposed over the second metal layer. The third metal layer forms a second antenna resonating element operating at a second band, which is different from the first band. The antenna structure further includes a first transmission line extending from the first metal layer to the second metal layer and a second transmission line extending from the first metal layer through the first opening to the third metal layer.
    Type: Application
    Filed: August 29, 2023
    Publication date: March 14, 2024
    Inventors: Yen-Ju LIN, Chung-Hsin CHIANG, Wun-Jian LIN, Shih-Huang YEH
  • Publication number: 20240072426
    Abstract: An antenna and an electronic device including the antenna are provided. The antenna includes a pair of radiators, a pair of feeding elements, first and second feeding ports. The radiators are located beside a geometric origin and separated from each other. The geometric origin is located between the radiators. The feeding elements are located below the pair of radiators and are configured to feed signals to the radiators. The pair of feeding elements includes a first feeding element and a second feeding element that are separated from each other. The first feeding element has a first geometric configuration. The second feeding element has a second geometric configuration that is asymmetric to the first geometric configuration. The first feeding port is electrically connected to the first feeding element. The second feeding port is separated from the first feeding port and electrically connected to the second feeding element.
    Type: Application
    Filed: August 22, 2023
    Publication date: February 29, 2024
    Inventors: Nai-Chen LIU, Chung-Hsin CHIANG, Wun-Jian LIN, Shih-Huang YEH
  • Patent number: 11912837
    Abstract: The present disclosure provides a thin film including a first thermoplastic polyolefin (TPO) elastomer which is anhydride-grafted. The present disclosure further provides a method for manufacturing the thin film, a laminated material and a method for adhesion.
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: February 27, 2024
    Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chih-Yi Lin, Kuo-Kuang Cheng, Chi-Chin Chiang, Wen-Hsin Tai, Ming-Chen Chang
  • Publication number: 20240047886
    Abstract: An antenna device with a tunable gain, includes a ground plane and a plurality of resonating units. A first resonating unit of the resonating units includes the following elements. A radiating plate, is arranged above the ground plane, and substantially parallel with the ground plane. A ground wall, is arranged between the radiating plate and the ground plane, and substantially perpendicular to the ground plane. A first connecting element, extends along a predefined direction substantially perpendicular to the ground plane. The first connecting element is adapted to couple the radiating plate to the ground plane.
    Type: Application
    Filed: July 14, 2023
    Publication date: February 8, 2024
    Inventors: Nai-Chen LIU, Chung-Hsin CHIANG, Yen-Ju LIN
  • Publication number: 20240047630
    Abstract: A micro LED display device includes a light emitting layer, a color conversion layer located on a light emitting surface of the light emitting layer, and a Bragg reflection element located on the color conversion layer. The Bragg reflection element includes a plurality of layer pairs. Each of the layer pairs includes at least one first layer and at least one second layer alternately stacked. The layer pairs include a top layer pair, a bottom layer pair and a plurality of middle layer pairs between the top layer pair and the bottom layer pair. A thickness of the first layer of each of the middle layer pairs is smaller than a thickness of the second layer of each of the middle layer pairs. A refractive index of the first layer is greater than a refractive index of the second layer.
    Type: Application
    Filed: October 13, 2022
    Publication date: February 8, 2024
    Inventors: Wen-Chien MIAO, Hsin CHIANG, Fu-He HSIAO, Chun-Yen PENG, Shih-Chen CHEN, Hao-Chung KUO
  • Publication number: 20240039165
    Abstract: An antenna is provided. The antenna includes a first radiator and a second radiator. The first radiator includes a first section and a second section. The first section includes a first grounding edge and a first bending edge. The second section is connected to the first bending edge. The first grounding edge is grounded. The first section is not parallel to the second section. A first slot is formed on the first section. The second radiator includes a third section and a fourth section. The third section includes a second grounding edge and a second bending edge. The fourth section is connected to the second bending edge. The second grounding edge is grounded. The third section is not parallel to the fourth section. The first section is parallel to the third section.
    Type: Application
    Filed: June 29, 2023
    Publication date: February 1, 2024
    Inventors: Hsuan-Jui CHANG, Nai-Chen LIU, Shih-Huang YEH, Chung-Hsin CHIANG, Wun-Jian LIN
  • Patent number: 11804410
    Abstract: A method for evaluation of thin film non-uniform stress using high order wafer warpage, the steps including measuring a net wafer warpage across a wafer area due to thin film deposition, fitting a two dimensional low-order polynomial to the wafer warpage measurements and subtracting the low-order polynomial from the net wafer warpage across the wafer area.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: October 31, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei-De Ho, Han-Wei Wu, Pei-Sheng Tang, Meng-Jung Lee, Hua-Tai Lin, Szu-Ping Tung, Lan-Hsin Chiang
  • Patent number: 11790954
    Abstract: A carrier is provided for a hard drive. The carrier includes a housing that receives a hard drive and a security chip. A locking component secures the hard drive within the housing. Securing the locking component prevents the hard drive from being removed from the housing. A release mechanism releases the locking component. A breaking component is in communication with the release mechanism such that upon actuation of the release mechanism to release the locking component, the breaking component breaks the security chip for the hard drive.
    Type: Grant
    Filed: September 26, 2022
    Date of Patent: October 17, 2023
    Assignee: ZT GROUP INT'L, INC.
    Inventors: Jared Harlan, Tung Yi Hsieh, Hsin Chiang Tan, Yi-Chung Lin, LungSheng Tsai, Ryan Signer
  • Publication number: 20230291127
    Abstract: An antenna module, comprising: a substrate; at least one first antenna array, located on the substrate, comprising at least one first antenna and having a first maximum radiation direction; and at least one second antenna array, located on the substrate, comprising at least one second antenna and having a second maximum radiation direction. A communication device using the antenna module is also disclosed.
    Type: Application
    Filed: March 1, 2023
    Publication date: September 14, 2023
    Applicant: MEDIATEK INC.
    Inventors: Wun-Jian Lin, Chung-Hsin Chiang, Shyh-Tirng Fang, Shih-Huang Yeh
  • Publication number: 20230290700
    Abstract: An antenna package includes a redistribution layer (RDL) structure having a top surface and a bottom surface opposite to the top surface and a TSV die disposed on the top surface of the RDL structure and encapsulated by a molding compound. The TSV die includes an active side and a rear side, and a sidewall of the TSV die is covered with the molding compound. The TSV die includes a plurality of through-silicon-vias including RF signal vias and ground vias penetrating through an entire thickness of the TSV die. An antenna structure is disposed on the rear side of the TSV die and is connected to the RF signal vias and ground vias.
    Type: Application
    Filed: February 14, 2023
    Publication date: September 14, 2023
    Applicant: MEDIATEK INC.
    Inventor: Chung-Hsin Chiang
  • Publication number: 20230268656
    Abstract: An antenna is provided. The antenna includes a first radiator positioned at a first level and connected to a ground plane at a second level. In a top view, the first radiator has a first edge, a second edge, a third edge, a fourth edge and a first arc edge. The second edge and the third edge are connected to opposite ends of the first edge. The fourth edge is connected to an end of the third edge opposite to the first edge. The first arc edge with a first radius has opposite ends respectively connected to the second edge and the fourth edge. The first arc edge has a first arc length corresponding to a first central angle, which is less than 90 degrees.
    Type: Application
    Filed: January 31, 2023
    Publication date: August 24, 2023
    Inventors: Chung-Hsin CHIANG, Nai-Chen LIU, Shih-Huang YEH
  • Publication number: 20230268670
    Abstract: An antenna system includes a first antenna and a second antenna. The first antenna can include a first horizontal portion and be used to access a first wireless signal. The first wireless signal can be wirelessly transmitted and/or received over air through the first horizontal portion and a first reference layer. The second antenna can include a second horizontal portion and be used to access a second wireless signal. The second wireless signal can be wirelessly transmitted and/or received over the air through the second horizontal portion and a second reference layer different from the first reference layer. The first wireless signal can be in a first frequency band, the second wireless signal can be in a second frequency band, and frequencies in the second frequency band can be higher than frequencies in the first frequency band.
    Type: Application
    Filed: January 17, 2023
    Publication date: August 24, 2023
    Applicant: MEDIATEK INC.
    Inventor: Chung-Hsin Chiang
  • Publication number: 20230231305
    Abstract: An antenna module and a method for manufacturing an antenna module are provided. The antenna module includes a first dielectric substrate, a first antenna and a second antenna. The first dielectric substrate has a top surface, a bottom surface and a first side surface between the top surface and the bottom surface. The first antenna is formed on the top surface of the first dielectric substrate. The second antenna is formed on the first side surface of the first dielectric substrate.
    Type: Application
    Filed: December 21, 2022
    Publication date: July 20, 2023
    Inventor: Chung-Hsin CHIANG
  • Publication number: 20230231307
    Abstract: An antenna device includes a first antenna and a second antenna. The first antenna receives or transmits first radio frequency signals to a first direction. The second antenna receives or transmits second radio frequency signals to a second direction. The first direction is different from the second direction. The first antenna and the second antenna share radiators.
    Type: Application
    Filed: December 27, 2022
    Publication date: July 20, 2023
    Inventor: Chung-Hsin CHIANG