Patents by Inventor Hsin-An Hou

Hsin-An Hou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11537222
    Abstract: A touchpad device includes a substrate, a touch panel, and a light-curing adhesive film. The substrate includes a top surface, the touch panel is disposed above the top surface of the substrate, and the touch panel includes a touchpad and a circuit board stacked with each other. The light-curing adhesive film is bonded between the touch board and the circuit board, and the light-curing adhesive film is in a cured state.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: December 27, 2022
    Assignee: CHICONY ELECTRONICS CO., LTD.
    Inventors: Po-Chun Hou, Po-Hsin Li
  • Publication number: 20220408538
    Abstract: Some implementations described herein provide techniques and apparatuses for inspecting interior surfaces of a vessel of a radiation source for an accumulation of a target material. An inspection tool, including a laser-scanning system and a motor system supported by an elongated supported member, may be inserted into the vessel to generate an accurate three-dimensional profile of the interior surfaces. Use of the inspection tool is efficient, with short setup and scan times that substantially reduce a duration associated with evaluating the interior surfaces of the vessel for the accumulation.
    Type: Application
    Filed: April 11, 2022
    Publication date: December 22, 2022
    Inventors: Jou-Hsuan LU, Chiao-Hua CHENG, Cheng-Hsuan WU, Ko-Ching HOU, Jyun-Yan CHUANG, Cheng-Hao LAI, Yu-Kuang SUN, Sheng-Kang YU, Shang-Chieh CHIEN, Li-Jui CHEN, Heng-Hsin LIU
  • Patent number: 11527454
    Abstract: An embodiment is a method including: attaching a first die to a first side of a first component using first electrical connectors, attaching a first side of a second die to first side of the first component using second electrical connectors, attaching a dummy die to the first side of the first component in a scribe line region of the first component, adhering a cover structure to a second side of the second die, and singulating the first component and the dummy die to form a package structure.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: December 13, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Wen-Hsin Wei, Chi-Hsi Wu, Shang-Yun Hou, Jing-Cheng Lin, Hsien-Pin Hu, Ying-Ching Shih, Szu-Wei Lu
  • Publication number: 20220367335
    Abstract: A semiconductor device includes a dielectric interposer, a first redistribution layer, a second redistribution layer and conductive structures. The conductive structures are through the dielectric interposer, wherein the conductive structures are electrically connected to the first redistribution layer and the second redistribution layer. Each of the conductive structures has a tapered profile. A width of each of the conductive structures proximal to the first redistribution layer is narrower than a width of each of the conductive structure proximal to the second redistribution layer.
    Type: Application
    Filed: July 29, 2022
    Publication date: November 17, 2022
    Inventors: KUO-CHIANG TING, CHI-HSI WU, SHANG-YUN HOU, TU-HAO YU, CHIA-HAO HSU, PIN-TSO LIN, CHIA-HSIN CHEN
  • Publication number: 20220359433
    Abstract: A method includes performing a first light-exposure and a second a second light-exposure on a photo resist. The first light-exposure is performed using a first lithograph mask, which covers a first portion of the photo resist. The first portion of the photo resist has a first strip portion exposed in the first light-exposure. The second light-exposure is performed using a second lithograph mask, which covers a second portion of the photo resist. The second portion of the photo resist has a second strip portion exposed in the second light-exposure. The first strip portion and the second strip portion have an overlapping portion that is double exposed. The method further includes developing the photo resist to remove the first strip portion and the second strip portion, etching a dielectric layer underlying the photo resist to form a trench, and filling the trench with a conductive feature.
    Type: Application
    Filed: July 20, 2022
    Publication date: November 10, 2022
    Inventors: Wen Hsin Wei, Hsien-Pin Hu, Shang-Yun Hou, Weiming Chris Chen
  • Publication number: 20220359355
    Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.
    Type: Application
    Filed: July 21, 2022
    Publication date: November 10, 2022
    Inventors: Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang, Chih-Ta Shen, Szu-Wei Lu, Ying-Ching Shih, Wen-Chih Chiou, Chi-Hsi Wu, Chen-Hua Yu
  • Publication number: 20220356594
    Abstract: A plating apparatus for electroplating a wafer includes a housing defining a plating chamber for housing a plating solution. A voltage source of the apparatus has a first terminal having a first polarity and a second terminal having a second polarity different than the first polarity. The first terminal is electrically coupled to the wafer. An anode is within the plating chamber, and the second terminal is electrically coupled to the anode. A membrane support is within the plating chamber and over the anode. The membrane support defines apertures, wherein in a first zone of the membrane support a first aperture-area to surface-area ratio is a first ratio, and in a second zone of the membrane support a second aperture-area to surface-area ratio is a second ratio, different than the first ratio.
    Type: Application
    Filed: July 25, 2022
    Publication date: November 10, 2022
    Inventors: Che-Min LIN, Hung-San Lu, Chao-Lung Chen, Chao Yuan Chang, Chun-An Kung, Chin-Hsin Hsiao, Wen-Chun Hou, Szu-Hung Yang, Ping-Ching Jiang
  • Publication number: 20220352021
    Abstract: An apparatus for electroplating includes a cup configured to support a substrate, and a cone including at least three distance measuring devices arranged on a lower surface thereof and facing the substrate. Each distance measuring device is configured to transmit a laser pulse towards the substrate, the laser pulse impinging the substrate, receive a reflected laser pulse from the substrate, calculate a turnaround time of the laser pulse, and calculate a distance between the distance measuring device and the substrate using the turnaround time for determining an inclination of the substrate.
    Type: Application
    Filed: July 14, 2022
    Publication date: November 3, 2022
    Inventors: Kuo-Lung HOU, Ming-Hsien LIN, Che-I KUO, Yung Hsin LU
  • Publication number: 20220342496
    Abstract: A touchpad device includes a substrate, a touch panel, and a light-curing adhesive film. The substrate includes a top surface, the touch panel is disposed above the top surface of the substrate, and the touch panel includes a touchpad and a circuit board stacked with each other. The light-curing adhesive film is bonded between the touch board and the circuit board, and the light-curing adhesive film is in a cured state.
    Type: Application
    Filed: January 24, 2022
    Publication date: October 27, 2022
    Inventors: Po-Chun Hou, Po-Hsin Li
  • Publication number: 20220336272
    Abstract: An apparatus for electroplating includes a cup configured to support a substrate, and a cone including at least three distance measuring devices arranged on a lower surface thereof and facing the substrate. Each distance measuring device is configured to transmit a laser pulse towards the substrate, the laser pulse impinging the substrate, receive a reflected laser pulse from the substrate, calculate a turnaround time of the laser pulse, and calculate a distance between the distance measuring device and the substrate using the turnaround time for determining an inclination of the substrate.
    Type: Application
    Filed: April 15, 2021
    Publication date: October 20, 2022
    Inventors: Kuo-Lung HOU, Ming-Hsien LIN, Che-I KUO, Yung Hsin LU
  • Patent number: 11476063
    Abstract: A touchpad device includes a bottom board, at least one supporting board, a circuit board, a first extending structure, and a second extending structure. The bottom board is configured to be fixed to a housing. The supporting board is coupled to the bottom board and configured to swing relative to the bottom board. The circuit board is attached to a side of the supporting board away from the bottom board. The first extending structure is disposed on the bottom board and extends toward the supporting board. The second extending structure is disposed on the supporting board and extends toward the bottom board. The first extending structure partially extends to a side of the second extending structure adjacent to the supporting board, or the second extending structure partially extends to a side of the first extending structure adjacent to the bottom board.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: October 18, 2022
    Assignee: Chicony Electronics Co., Ltd.
    Inventors: Po-Hsin Li, Po-Chun Hou
  • Patent number: 11476184
    Abstract: A semiconductor device includes a dielectric interposer, a first interconnection layer, an electronic component, a plurality of electrical conductors and a plurality of conductive structures. The dielectric interposer has a first surface and a second surface opposite to the first surface. The first interconnection layer is over the first surface of the dielectric interposer. The electronic component is over and electrically connected to the first interconnection layer. The electrical conductors are over the second surface of the dielectric interposer. The conductive structures are through the dielectric interposer, wherein the conductive structures are electrically connected to the first interconnection layer and the electrical conductors.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: October 18, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Tu-Hao Yu, Chia-Hao Hsu, Pin-Tso Lin, Chia-Hsin Chen
  • Patent number: 11444038
    Abstract: A method includes performing a first light-exposure and a second a second light-exposure on a photo resist. The first light-exposure is performed using a first lithograph mask, which covers a first portion of the photo resist. The first portion of the photo resist has a first strip portion exposed in the first light-exposure. The second light-exposure is performed using a second lithograph mask, which covers a second portion of the photo resist. The second portion of the photo resist has a second strip portion exposed in the second light-exposure. The first strip portion and the second strip portion have an overlapping portion that is double exposed. The method further includes developing the photo resist to remove the first strip portion and the second strip portion, etching a dielectric layer underlying the photo resist to form a trench, and filling the trench with a conductive feature.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: September 13, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wen Hsin Wei, Hsien-Pin Hu, Shang-Yun Hou, Weiming Chris Chen
  • Publication number: 20220270535
    Abstract: A display method and a display device using the same is disclosed. In the display method, an image is received. The image has an indicative object and a display background that surrounds the indicative object. Then, the original color of the indicative object is changed into a first color and the image that has the indicative object with the first color is displayed based on the average hue of a part of the display background. The part of the display background surrounds the indicative object. The average hue corresponds to a second color. The first color and the second color are complementary colors.
    Type: Application
    Filed: February 19, 2021
    Publication date: August 25, 2022
    Inventors: HSIN-TSO CHIANG, TSUN-HOU CHOU, PO-HSIANG HUANG
  • Patent number: 11417580
    Abstract: An embodiment is a method including: attaching a first die to a first side of a first component using first electrical connectors, attaching a first side of a second die to first side of the first component using second electrical connectors, attaching a dummy die to the first side of the first component in a scribe line region of the first component, adhering a cover structure to a second side of the second die, and singulating the first component and the dummy die to form a package structure.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: August 16, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chen-Hua Yu, Wen-Hsin Wei, Chi-Hsi Wu, Shang-Yun Hou, Jing-Cheng Lin, Hsien-Pin Hu, Ying-Ching Shih, Szu-Wei Lu
  • Patent number: 11410592
    Abstract: A display method and a display device using the same is disclosed. In the display method, an image is received. The image has an indicative object and a display background that surrounds the indicative object. Then, the original color of the indicative object is changed into a first color and the image that has the indicative object with the first color is displayed based on the average hue of a part of the display background. The part of the display background surrounds the indicative object. The average hue corresponds to a second color. The first color and the second color are complementary colors.
    Type: Grant
    Filed: February 19, 2021
    Date of Patent: August 9, 2022
    Assignee: Novatek Microelectronics Corp
    Inventors: Hsin-Tso Chiang, Tsun-Hou Chou, Po-Hsiang Huang
  • Publication number: 20220246581
    Abstract: A semiconductor device and a method of forming the device are provided. The semiconductor device includes a first die having a first plurality of contact pads and a second die having a second plurality of contact pads. A substrate is bonded to a first contact pad of the first plurality of contact pads and a first contact pad of the second plurality of contact pads in a face-to-face orientation with the first die and the second die. A first through via extends through the substrate. Molding material is interposed between the first die, the second die and the substrate, the molding material extending along sidewalls of the first die, the second die, and the substrate. A second through via is positioned over a second contact pad of the first plurality of contact pads, the second through via extending through the molding material.
    Type: Application
    Filed: April 21, 2022
    Publication date: August 4, 2022
    Inventors: Wei-Ming Chen, Hsien-Pin Hu, Shang-Yun Hou, Wen-Hsin Wei
  • Patent number: 11401624
    Abstract: A plating apparatus for electroplating a wafer includes a housing defining a plating chamber for housing a plating solution. A voltage source of the apparatus has a first terminal having a first polarity and a second terminal having a second polarity different than the first polarity. The first terminal is electrically coupled to the wafer. An anode is within the plating chamber, and the second terminal is electrically coupled to the anode. A membrane support is within the plating chamber and over the anode. The membrane support defines apertures, wherein in a first zone of the membrane support a first aperture-area to surface-area ratio is a first ratio, and in a second zone of the membrane support a second aperture-area to surface-area ratio is a second ratio, different than the first ratio.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: August 2, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Che-Min Lin, Hung-San Lu, Chao-Lung Chen, Chao Yuan Chang, Chun-An Kung, Chin-Hsin Hsiao, Wen-Chun Hou, Szu-Hung Yang, Ping-Ching Jiang
  • Publication number: 20220152129
    Abstract: The present disclosure relates to as external composition for wound healing containing a Lactobacillus fermentation product, which comprises a Lactobacillus fermentation product as an effective component. The Lactobacillus fermentation product is a bacteria-free concentrated filtrate from fermentation of Lactobacillus plantarum and the effective component is loaded onto a pharmaceutically acceptable absorbent carrier or carrying agent. The external composition for wound healing has anti-inflammatory and healing promoting effects on a skin wound after applied directly onto the skin wound.
    Type: Application
    Filed: October 29, 2021
    Publication date: May 19, 2022
    Inventors: Hsing-Chun KUO, Chin-Chu CHEN, Yen-Lien CHEN, Shih-Wei LIN, Yen-Po CHEN, Ci-Sian WANG, Yu-Hsin HOU, Yang-Tzu SHIH, Ching-Wen LIN, Ya-Jyun CHEN, Jia-Lin JIANG, You-Shan TSAI, Zi-He WU
  • Publication number: 20220143114
    Abstract: The present invention provides an active substance of Lactic Acid Bacteria, a composition comprising thereof and its use for promoting longevity, especially for increasing Cisd2 gene expression, reducing mitochondrial damage and delaying aging conditions such as nerve degeneration and sarcopenia.
    Type: Application
    Filed: January 25, 2022
    Publication date: May 12, 2022
    Applicant: GRAPE KING BIO LTD.
    Inventors: Chin-Chu CHEN, Yen-Lien CHEN, Shin-Wei LIN, Yen-Po CHEN, Ci-Sian WANG, Yu-Hsin HOU, Yang-Tzu SHIH, Ching-Wen LIN, Ya-Jyun CHEN, Jia-Lin JIANG