Patents by Inventor Hsin-An Lin

Hsin-An Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240155535
    Abstract: A method of handling de-registration and EPS mobility management (EMM) parameter for 3GPP when UE receives a de-registration request message via non-3GPP is proposed. There is an access type in the de-registration type IE in the de-registration request message. In one novel aspect, a UE handles EMM parameters of the de-registration procedure depending on the received access type in the de-registration type IE. Upon receiving a DEREGISTRATION REQUEST message, if the de-registration request is for 3GPP access or for 3GPP access and non-3GPP access, the UE performs a local release of the PDU sessions over 3GPP access and non-3GPP access, if any. Based on the 5GMM cause, UE also handles the corresponding EMM parameters including EMM state, EPS update status, 4G-GUTI, last visited registered TAI, TAI list, eKSI and attach attempt counter.
    Type: Application
    Filed: October 24, 2023
    Publication date: May 9, 2024
    Inventors: Yu-Hsin Lin, YUAN-CHIEH LIN
  • Publication number: 20240148753
    Abstract: The present invention pertains to a method for alleviating atherosclerosis in a subject comprising administrating to said subject a composition or pharmaceutical composition comprising Antcin K.
    Type: Application
    Filed: January 10, 2024
    Publication date: May 9, 2024
    Applicant: ARJIL BIOTECH HOLDING COMPANY LIMITED
    Inventors: Yeh B WU, Jir-Mehng LO, Hui Ju LIANG, Pei-Hsin LIN, Chieh-Hsi WU, Chung-Hsin WU
  • Publication number: 20240155721
    Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a UE. The UE initiates a mobile originated (MO) procedure for modifying an Evolved Packet System (EPS) bearer to release all traffic flows associated with the EPS bearer. The UE receives a request to initiate a mobile terminated (MT) procedure for modifying the EPS bearer. The UE, in response to receiving the request, aborts the MO procedure. The UE locally deactivates the EPS bearer.
    Type: Application
    Filed: October 23, 2023
    Publication date: May 9, 2024
    Inventors: Yu-Hsin Lin, Po-Kuang Lu, YUAN-CHIEH LIN
  • Publication number: 20240154870
    Abstract: Methods and apparatus are provided for the UE handling RSD parameters for MA preferences when the UE is in S1 mode. In one novel aspect, the MA PDU preference is applicable for a UE attached to EPS if the UE supports MA PDU session and procedures for PDN connection establishment and a mapped EPS parameter description of an MA preference type of the selected RSD indicates the MA preference. In one embodiment, the selected RSD indicates MA preference when the EPS parameter description of an MA preference type indicates that the PDN connection should be established as a user-plane resource of a multi-access PDU session if the UE supports MA PDU session and procedures for PDN connection establishment. In one embodiment, the PDN connection is established via a PDN connectivity procedure in an EPS or an EPC.
    Type: Application
    Filed: October 29, 2023
    Publication date: May 9, 2024
    Inventors: YUAN-CHIEH Lin, Yu-Hsin LIN
  • Publication number: 20240155700
    Abstract: In an aspect of the disclosure, a method, a computer-readable medium, and an apparatus are provided. The apparatus may be a UE. The UE performs an establishment of a multi-access protocol data unit (MA PDU) session for a first access and a second access. The UE is registered in a same network over the first access and the second access. The UE determines that the establishment is completed for the first access and is ongoing for the second access. In response to determining that the establishment is completed for the first access and is ongoing for the second access, the UE sends, over the second access, a mobility management signaling. The mobility management signaling includes an indication that the MA PDU session is in a state other than an inactive state during the establishment that is ongoing on the second access.
    Type: Application
    Filed: November 1, 2023
    Publication date: May 9, 2024
    Inventors: Marko Niemi, Jaakko Sitomaniemi, Yuan-Chieh Lin, Yu-Hsin Lin
  • Publication number: 20240154015
    Abstract: A method includes forming a first fin and a second fin protruding from a frontside of a substrate, forming a gate stack over the first and second fins, forming a dielectric feature dividing the gate stack into a first segment engaging the first fin and a second segment engaging the second fin, and growing a first epitaxial feature on the first fin and a second epitaxial feature on the second fin. The dielectric feature is disposed between the first and second epitaxial features. The method also includes performing an etching process on a backside of the substrate to form a backside trench, and forming a backside via in the backside trench. The backside trench exposes the dielectric feature and the first and second epitaxial features. The backside via straddles the dielectric feature and is in electrical connection with the first and second epitaxial features.
    Type: Application
    Filed: March 22, 2023
    Publication date: May 9, 2024
    Inventors: Jui-Lin CHEN, Hsin-Wen SU, Chih-Ching WANG, Chen-Ming LEE, Chung-I YANG, Yi-Feng TING, Jon-Hsu HO, Lien-Jung HUNG, Ping-Wei WANG
  • Patent number: 11975958
    Abstract: An automatic fluid replacement device is adapted to be mounted on an opening of a storage barrel. The automatic fluid replacement device includes a robotic arm, at least one fluid convey joint and a controller. The robotic arm has a gripper. The fluid convey joint includes a convey pipe, a sleeve and a sealing bag. The convey pipe is configured to deliver a fluid. The sleeve is sleeved on the convey pipe. The gripper clamps the sleeve. The sealing bag is sleeved on the sleeve. The controller is configured for automatically controlling the robotic arm to move the fluid convey joint into the opening and controlling the sealing bag to be inflated to seal the opening.
    Type: Grant
    Filed: October 27, 2022
    Date of Patent: May 7, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Cheng-Han Tsai, Wei-Lung Pan, Chih-Ta Wu, I-hsin Lin
  • Patent number: 11975243
    Abstract: The present disclosure is relates to a TPU ball structure and a manufacturing method thereof. The TPU ball structure includes a ball bladder layer, a yarn layer and a surface layer. The ball bladder layer is made of TPU material. The yarn layer is made of TPU material, and the yarn layer is disposed to cover the ball bladder layer. The surface layer is made of TPU material, and the surface layer is disposed to cover the yarn layer. The above layers of the TPU ball structure are made of TPU material to satisfy a requirement for environmental protection, and are recyclable. There is no need to use adhesive to adhere the above layers of the TPU ball structure. Therefore, the peeling strength between the layers of the TPU ball structure can be increased so that the whole peeling strength of the TPU ball structure can be increased.
    Type: Grant
    Filed: April 22, 2021
    Date of Patent: May 7, 2024
    Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chih-Yi Lin, Kuo-Kuang Cheng, Chi-Chin Chiang, Wen-Hsin Tai
  • Patent number: 11977367
    Abstract: A command script editing method, a command script editor and a graphic user interface are provided. The command script editing method includes the following steps. The command node is edited according to at least one inputting action or at least one image identifying action performed on the operation frame when the command script editor is at an image editing mode. The command node is edited according to a setting content of at least one process action when the command script editor is at a process editing mode.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: May 7, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Yu-Chi Lin, Li-Hsin Yang, Yu-Shan Hsu
  • Publication number: 20240145385
    Abstract: A memory device includes a plurality of memory cells disposed over a substrate and formed as an array that has a plurality of rows and a plurality of columns. Each of the plurality of memory cells includes a plurality of transistors. A first subset of the plurality of memory cells, that are disposed in first neighboring ones of the plurality of rows, are physically coupled to a corresponding one of a plurality of second interconnect structures that carries a supply voltage through a corresponding one of a plurality of first interconnect structures. The plurality of first interconnect structures extend along a first lateral direction in parallel with a lengthwise direction of a channel of each of the transistors of the memory cells, and the plurality of second interconnect structures, disposed above the plurality of first interconnect structures, extend along a second lateral direction perpendicular to the first lateral direction.
    Type: Application
    Filed: February 16, 2023
    Publication date: May 2, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Hsin Nien, Hidehiro Fujiwara, Chih-Yu Lin, Yen-Huei Chen
  • Publication number: 20240144430
    Abstract: A computing system performs artificial-intelligence (AI) super-resolution (SR). The computing system includes multiple processors, which further includes a graphics processing unit (GPU) and an AI processing unit (APU). The computing system also includes a memory to store AI models. When detecting an indication that the loading of the GPU exceeds a threshold, the processors reduce the resolution of a video output from the GPU in response to the indication. One of the AI models is selected based on graphics scenes in the video and the respective power consumption estimates of the AI models. The processors then perform AI SR operations on the video using the selected AI model to restore the resolution of the video for display.
    Type: Application
    Filed: October 24, 2023
    Publication date: May 2, 2024
    Inventors: Chien-Nan Lin, You-Ming Tsao, Yung-Hsin Chu, An-Li Wang
  • Publication number: 20240145260
    Abstract: An airflow heating module for an equipment front-end module, including: a first perforated plate including a first plurality of holes used as airflow inlets; a second perforated plate including a second plurality of holes used as airflow outlets; a plurality of heaters provided between the first and the second perforated plates; and an active air intake device provided on the first perforated plate to accelerate airflow flowing through the first plurality of holes and past the plurality of heaters, such that the airflow carries heat generated by the heaters and passes through the second plurality of holes. Each of the heaters includes a heating tube and a fin. The fin is formed helically around the heating tube and attached thereto.
    Type: Application
    Filed: December 27, 2022
    Publication date: May 2, 2024
    Inventors: Yueh-Lin CHIANG, Hsin-Jan PAI, Ying-Feng LEE, Ling-Chiao HUANG
  • Publication number: 20240139262
    Abstract: The present disclosure relates to a complex probiotic composition and a method for improving exercise performance of a subject with low intrinsic aerobic exercise capacity. The complex probiotic composition, which includes Lactobacillus rhamnosus GKLC1, Bifidobacterium lactis GKK24 and Clostridium butyricum GKB7, administered to the subject with the low intrinsic aerobic exercise capacity in a continuation period, can effectively reduce serum lactic acid and serum urea nitrogen after aerobic exercise, reduce proportion of offal fat and/or increase liver and muscle glycogen contents, thereby being as an effective ingredient for preparation of various compositions.
    Type: Application
    Filed: October 13, 2023
    Publication date: May 2, 2024
    Inventors: Chin-Chu CHEN, Yen-Lien CHEN, Shih-Wei LIN, Yen-Po CHEN, Ci-Sian WANG, Yu-Hsin HOU, Yang-Tzu SHIH, Ching-Wen LIN, Ya-Jyun CHEN, Jia-Lin JIANG, You-Shan TSAI, Zi-He WU
  • Publication number: 20240142932
    Abstract: A script creation method for robot process automation and an electronic device using the same are provided. The electronic device includes an area defining unit, a recording unit, an analysis unit and a creation unit. The area defining unit is configured to obtain a recording area of a screen. The recording unit is configured to record a video according to the recording area. The analysis unit is configured to analyze a plurality of actions according to the video. The creation unit is configured to build a plurality of steps of a script according to the actions.
    Type: Application
    Filed: November 28, 2022
    Publication date: May 2, 2024
    Inventors: Yu-Chi LIN, Li-Hsin YANG
  • Publication number: 20240145453
    Abstract: A display panel includes a circuit substrate, light emitting elements, a side wire, and a chip-on-film package structure. The circuit substrate includes a circuit structure located on a first surface. The side wire includes a first bonding portion disposed on the first surface of the circuit substrate and bonded to the circuit structure, a first extension portion, a second extension portion, and a second bonding portion that are sequentially connected and have the same resistivity. The first extension portion is disposed on a side surface of the circuit substrate. The second extension portion is disposed on a second surface of the circuit substrate and overlapped with a peripheral region. The second bonding portion is disposed on the second surface of the circuit substrate. An orthogonal projection of the second bonding portion is overlapped with a display region. The chip-on-film package structure is bonded to the second bonding portion.
    Type: Application
    Filed: December 6, 2022
    Publication date: May 2, 2024
    Applicant: AUO Corporation
    Inventors: Yi-Hsin Lin, Wen-Lung Chen
  • Publication number: 20240145381
    Abstract: In some embodiments, the present disclosure relates an integrated chip including a substrate. A conductive interconnect feature is arranged over the substrate. The conductive interconnect feature has a base feature portion with a base feature width and an upper feature portion with an upper feature width. The upper feature width is narrower than the base feature width such that the conductive interconnect feature has tapered outer feature sidewalls. An interconnect via is arranged over the conductive interconnect feature. The interconnect via has a base via portion with a base via width and an upper via portion with an upper via width. The upper via width is wider than the base via width such that the interconnect via has tapered outer via sidewalls.
    Type: Application
    Filed: January 9, 2024
    Publication date: May 2, 2024
    Inventors: Shin-Yi Yang, Hsin-Yen Huang, Ming-Han Lee, Shau-Lin Shue, Yu-Chen Chan, Meng-Pei Lu
  • Publication number: 20240147825
    Abstract: Examples disclosed herein relate to device. The device includes a substrate, a plurality of adjacent pixel-defining layer (PDL structures disposed over the substrate, and a plurality of sub-pixels. The PDL structure have a top surface coupled to adjacent sidewalls of the PDL structure. The plurality of sub-pixels are defined by the PDL structures. Each sub-pixel includes an anode, an organic light emitting diode (OLED), a cathode, and an encapsulation layer. The organic light emitting diode (OLED) material disposed over the anode. The OLED material extends over the top surface of the PDL structure past the adjacent sidewalls. The cathode is disposed over the OLED material. The cathode extends over the top surface of the PDL structure past the adjacent sidewalls. The encapsulation layer is disposed over the cathode. The encapsulation layer has a first sidewall and a second sidewall.
    Type: Application
    Filed: October 26, 2022
    Publication date: May 2, 2024
    Inventors: Chung-chia CHEN, Yu-Hsin LIN, Ji Young CHOUNG, Jungmin LEE, Wen-Hao WU, Dieter HAAS
  • Publication number: 20240145475
    Abstract: A semiconductor device includes a first transistor and a second transistor. The first transistor is of a first type in a first layer and includes a gate extending in a first direction and a first active region extending in a second direction perpendicular to the first direction. The second transistor is of a second type arranged in a second layer over the first layer and includes the gate and a second active region extending in the second direction. The semiconductor device further includes a first conductive line in a third layer between the first and second layers. The first conductive line electrically connects a first source/drain region of the first active region to a second source/drain region of the second active region. The gate comprises an intermediate portion disposed between the first active region and the second active region, wherein the first conductive line crosses the gate at the intermediate portion.
    Type: Application
    Filed: January 4, 2024
    Publication date: May 2, 2024
    Inventors: SHIH-WEI PENG, TE-HSIN CHIU, WEI-CHENG LIN, JIANN-TYNG TZENG
  • Patent number: 11972975
    Abstract: A method of forming a semiconductor device structure is provided. The method includes forming a masking structure with first openings over a semiconductor substrate and correspondingly forming metal layers in the first openings. The method also includes recessing the masking structure to form second openings between the metal layers and forming a sacrificial layer surrounded by a first liner in each of the second openings. In addition, after forming a second liner over the sacrificial layer in each of the second openings, the method includes removing the sacrificial layer in each of the second openings to form a plurality of air gaps therefrom.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: April 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsi-Wen Tien, Wei-Hao Liao, Yu-Teng Dai, Hsin-Chieh Yao, Chih-Wei Lu, Chung-Ju Lee, Shau-Lin Shue
  • Patent number: 11974311
    Abstract: A method for wireless communication performed by a user equipment (UE) is provided. The method includes receiving, from a base station (BS), a Radio Resource Control (RRC) configuration to configure a first semi-persistent scheduling (SPS) physical downlink shared channel (PDSCH) and generating first uplink control information (UCI) in response to the first SPS PDSCH, where the RRC configuration includes a first parameter that indicates a priority of the first UCI.
    Type: Grant
    Filed: March 1, 2023
    Date of Patent: April 30, 2024
    Assignee: Hannibal IP LLC
    Inventors: Wan-Chen Lin, Yu-Hsin Cheng, Heng-Li Chin, Hsin-Hsi Tsai