Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A method for manufacturing a semiconductor structure is provided. The method includes: providing a substrate and a dielectric layer on the substrate; forming a hole in the dielectric layer; forming an initial barrier material layer and a conductive layer on an upper surface of the dielectric layer and in the hole; removing part of the initial barrier material layer and part of the conductive layer to form a barrier material layer and a via element in the hole respectively and expose the upper surface of the dielectric layer. An upper surface of the barrier material layer is higher than the upper surface of the dielectric layer.

Abstract: A computer device includes a holding structure, a motherboard module and a cover plate. The holding structure includes a holder and a frame. The holder includes a supporting face and an end edge. The frame is connected to the supporting face and arranged adjacent to the end edge. The frame includes an opening and a top bar. The motherboard module, including I/O ports disposed in the opening, is installed on the supporting face. The cover plate covers the opening, a bottom portion of the cover plate is detachably connected to the end edge with a positioning structure, a top portion of the cover plate is detachably connected to the top bar with a fastening structure, the cover plate includes through slots, and the I/O ports are inserted through or disposed corresponding to the through slots respectively, so that the computer device facilitates easy and flexible assembly.