Patents by Inventor Hsin Chang

Hsin Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153952
    Abstract: In an embodiment, a device includes: a channel region; a gate dielectric layer on the channel region; a first work function tuning layer on the gate dielectric layer, the first work function tuning layer including a n-type work function metal; a barrier layer on the first work function tuning layer; a second work function tuning layer on the barrier layer, the second work function tuning layer including a p-type work function metal, the p-type work function metal different from the n-type work function metal; and a fill layer on the second work function tuning layer.
    Type: Application
    Filed: January 4, 2024
    Publication date: May 9, 2024
    Inventors: Hsin-Yi Lee, Weng Chang, Chi On Chui
  • Publication number: 20240155758
    Abstract: An electronic device is provided. The electronic device includes a first dielectric layer, an electronic element, an encapsulant, and a second dielectric layer. The first dielectric layer has a first coefficient of thermal expansion (CTE). The electronic element is disposed over the first dielectric layer. The encapsulant encapsulates the electronic element and has a second CTE. The second dielectric layer is disposed over the encapsulant and having a third CTE. The second CTE ranges between the first CTE and the third CTE.
    Type: Application
    Filed: November 4, 2022
    Publication date: May 9, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien Lin CHANG CHIEN, Yuan-Chun TAI, Yu Hsin CHANG CHIEN, Chiu-Wen LEE, Chang Chi LEE
  • Publication number: 20240147606
    Abstract: An electronic device includes a first substrate structure, multiple electronic elements and a second substrate structure. The first substrate structure includes a first substrate. The electronic elements are disposed on the first substrate. The second substrate structure is coupled to the first substrate structure. The second substrate structure includes a second substrate, a protection circuit, a driving circuit and a bonding pad. The protection circuit is disposed on the second substrate. The driving circuit is disposed on the second substrate and configured to drive at least a part of the electronic elements. The bonding pad is disposed on the second substrate. The protection circuit is respectively coupled to the bonding pad and the driving circuit. The electronic device may reduce the damage caused by electrostatic discharge or reduce the impact of the bonding process of the bonding pad on signal conduction.
    Type: Application
    Filed: September 14, 2023
    Publication date: May 2, 2024
    Applicant: Innolux Corporation
    Inventors: Mu-Fan Chang, Yi-Hua Hsu, Hung-Sheng Liao, Min-Hsin Lo, Ming-Chun Tseng, Ker-Yih Kao
  • Publication number: 20240139897
    Abstract: A method for evaluating tool health with the temperature rising signal, applied to a machine tool that utilizes a tool to perform a removal process upon a workpiece, comprises the steps of: setting a target machining instruction; utilizing a processor to divide the target machining instruction into a residual machining instruction and a micro machining instruction; performing the residual machining instruction; without any coolant or with little coolant, performing the micro machining instruction, and having at least one thermal image sensor to detect a thermal image of a contact area of the tool and the workpiece; having the processor to derive a temperature feature by evaluating the thermal image; and, having the processor to compare the temperature feature with at least one threshold for determining the tool health.
    Type: Application
    Filed: December 14, 2022
    Publication date: May 2, 2024
    Inventor: HSIN-CHANG CHANG
  • Publication number: 20240145627
    Abstract: An epitaxial structure of a semiconductor light-emitting element includes an n-type layer, a V-pit control layer, a light-emitting layer, and a p-type layer stacked from bottom to top. The light-emitting layer includes a plurality of well layers and a plurality of barrier layers stacked alternately. The V-pit control layer includes a first superlattice layer, and a distance between a bottom surface of the V-pit control layer and a bottom surface of the first superlattice layer is less than or equal to 0.15 ?m. The bottom surface of the first superlattice layer and a bottom surface of the light-emitting layer have a distance therebetween ranging from 0.05 ?m to 0.3 ?m, and each of the first superlattice layer and the light-emitting layer is an Indium (In)-containing layer. A semiconductor light-emitting element and a light-emitting device are also provided.
    Type: Application
    Filed: October 31, 2023
    Publication date: May 2, 2024
    Inventors: Meng-Hsin YEH, Zhousheng JIANG, Bing-Yang CHEN, Dongpo CHEN, Chung-Ying CHANG
  • Patent number: 11973037
    Abstract: A package structure including a first die, a second die, a dielectric body, a conductive terminal, a circuit layer and a patterned insulating layer is provided. The second die is disposed on the first die. A second active surface of the second die faces a first active surface of the first die. The dielectric body covers the first die. The conductive terminal is disposed on the dielectric body and opposite to the second die. The circuit layer includes a first circuit portion and a second circuit portion. The first circuit portion penetrates the dielectric body. The first die is electrically connected to the conductive terminal through the first circuit portion. The second circuit portion is embedded in the dielectric body. The second die is electrically connected to the first die through the second circuit portion. The patterned insulating layer covers the circuit layer and is embedded in the dielectric body.
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: April 30, 2024
    Assignee: Powertech Technology Inc.
    Inventors: Shang-Yu Chang Chien, Nan-Chun Lin, Hung-Hsin Hsu
  • Patent number: 11974104
    Abstract: A linearity compensation method for a sound producing device (SPD) includes steps of: applying a test signal on a first SPD; obtaining an acoustic measurement result generated from the first SPD according to the test signal; generating a compensation curve according to the acoustic measurement result; and performing a linearity compensation operation on a second SPD according to the compensation curve.
    Type: Grant
    Filed: January 13, 2022
    Date of Patent: April 30, 2024
    Assignee: xMEMS Labs, Inc.
    Inventors: Jemm Yue Liang, Yanchen Lu, Hao-Hsin Chang
  • Publication number: 20240134268
    Abstract: A mask for use in a semiconductor lithography process includes a substrate, a mask pattern disposed on the substrate, and a light absorbing border surrounding the mask pattern. The light absorbing border is inset from at least two edges of the substrate to define a peripheral region outside of the light absorbing border. In some designs, a first peripheral region extends from an outer perimeter of the light absorbing border to a first edge of the substrate, and a second peripheral region that extends from the outer perimeter of the light absorbing border to a second edge of the substrate, where the first edge of the substrate and the second edge of the substrate are on opposite sides of the mask pattern.
    Type: Application
    Filed: January 3, 2024
    Publication date: April 25, 2024
    Inventors: Chien-Cheng Chen, Huan-Ling Lee, Ta-Cheng Lien, Chia-Jen Chen, Hsin-Chang Lee
  • Publication number: 20240134279
    Abstract: A photoresist includes a solvent, a polymer and an additive. The polymer is dissolved in the solvent, and the additive is dispersed in the solvent. The additive includes a double bond or includes an epoxy group. The additive has a surface tension different from a surface tension of the polymer.
    Type: Application
    Filed: March 27, 2023
    Publication date: April 25, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chieh-Hsin HSIEH, Wei-Han LAI, Ching-Yu CHANG
  • Patent number: 11968512
    Abstract: In an example, a speaker device may include a first transducer and a second transducer. The first transducer may include a first diaphragm, a first magnetic circuit, and a first voice coil disposed in a magnetic gap of the first magnetic circuit to cause vibration of the first diaphragm. The second transducer may include a second diaphragm, a second magnet circuit, and a second voice coil disposed in a magnetic gap of the second magnetic circuit to cause vibration of the second diaphragm. Further, the speaker device may include a magnetic plate having a first surface coupled to the first transducer and a second surface coupled to the second transducer. The first surface is opposite to the second surface.
    Type: Grant
    Filed: June 22, 2022
    Date of Patent: April 23, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Yen-Hsin Ho, Yi-Ying Lai, Chen-Hui Hu, Chen-Yu Chang
  • Publication number: 20240128876
    Abstract: A switching control circuit for use in controlling a resonant flyback power converter generates a first driving signal and a second driving signal. The first driving signal is configured to turn on the first transistor to generate a first current to magnetize a transformer and charge a resonant capacitor. The transformer and charge a resonant capacitor are connected in series. The second driving signal is configured to turn on the second transistor to generate a second current to discharge the resonant capacitor. During a power-on period of the resonant flyback power converter, the second driving signal includes a plurality of short-pulses configured to turn on the second transistor for discharging the resonant capacitor. A pulse-width of the short-pulses of the second driving signal is short to an extent that the second current does not exceed a current limit threshold.
    Type: Application
    Filed: June 15, 2023
    Publication date: April 18, 2024
    Inventors: Yu-Chang Chen, Ta-Yung Yang, Kun-Yu Lin, Fu-Ciao Syu, Chia-Hsien Yang, Hsin-Yi Wu
  • Publication number: 20240129766
    Abstract: A throttle control method for a mobile device include collecting input data, generating a first set of user experience indices according to the input data, and checking whether a user experience index of the first set of user experience indices satisfies a UEI threshold. The input data includes common information data, current configuration data and a plurality of throttle control parameters. Each user experience index of the first set of user experience indices is corresponding to at least one of throttle control parameter of the plurality of throttle control parameters.
    Type: Application
    Filed: April 10, 2023
    Publication date: April 18, 2024
    Applicant: MediaTek Singapore Pte. Ltd.
    Inventors: Hung-Yueh Chen, Byeng Hyun Kim, JUNG SHUP SHIN, Shih-Hsin Chen, Chih-Chieh Lai, Chung-Pi Lee, JUNGWOO LEE, Yu-Lun Chang
  • Publication number: 20240124844
    Abstract: The present disclosure provides a method for preparing a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors, the composition prepared by the method, and use of the composition for treating arthritis. The composition of the present disclosure achieves the effect of treating arthritis through various efficacy experiments.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 18, 2024
    Inventors: Chia-Hsin Lee, Po-Cheng Lin, Yong-Cheng Kao, Ming-Hsi Chuang, Chun-Hung Chen, Chao-Liang Chang, Kai-Ling Zhang
  • Patent number: 11958200
    Abstract: An automatic robotic arm system and a coordinating method for robotic arm and computer vision thereof are disclosed. A beam-splitting mirror splits an incident light into a visible light and a ranging light and respectively guides to an image capturing device and an optical ranging device arranged in the different reference axes. In a calibration mode, a transformation relation is computed based on a plurality of the calibration postures and corresponding calibration images. In an operation mode, a mechanical space coordinate is determined based on an operation image and the transformation relation, and the robotic arm is controlled to move based on the mechanical space coordinate.
    Type: Grant
    Filed: December 28, 2021
    Date of Patent: April 16, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Hung-Hsin Chen, Chia-Jun Yu, Qi-Ming Huang, Chin-Lun Chang, Keng-Ning Chang
  • Patent number: 11960201
    Abstract: The present disclosure describes a method of patterning a semiconductor wafer using extreme ultraviolet lithography (EUVL). The method includes receiving an EUVL mask that includes a substrate having a low temperature expansion material, a reflective multilayer over the substrate, a capping layer over the reflective multilayer, and an absorber layer over the capping layer. The method further includes patterning the absorber layer to form a trench on the EUVL mask, wherein the trench has a first width above a target width. The method further includes treating the EUVL mask with oxygen plasma to reduce the trench to a second width, wherein the second width is below the target width. The method may also include treating the EUVL mask with nitrogen plasma to protect the capping layer, wherein the treating of the EUVL mask with the nitrogen plasma expands the trench to a third width at the target width.
    Type: Grant
    Filed: May 15, 2023
    Date of Patent: April 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Pei-Cheng Hsu, Chun-Fu Yang, Ta-Cheng Lien, Hsin-Chang Lee
  • Publication number: 20240120325
    Abstract: A stacked package structure and a manufacturing method thereof are provided. The stacked package structure includes an upper redistribution layer, a first chip, and an upper molding layer. The first chip is disposed on the upper redistribution layer and is electrically connected to the upper redistribution layer. The upper molding layer is disposed on the first chip and the upper redistribution layer, and is configured to package the first chip. The upper molding layer includes a recess, the recess is recessed relative to a surface of the upper molding layer away from the upper redistribution layer, and the recess is circumferentially formed around a periphery of the upper molding layer.
    Type: Application
    Filed: May 31, 2023
    Publication date: April 11, 2024
    Applicant: POWERTECH TECHNOLOGY INC.
    Inventors: Pei-chun TSAI, Hung-hsin HSU, Shang-yu CHANG CHIEN, Chia-ling LEE
  • Publication number: 20240115616
    Abstract: The present disclosure provides a method for treating liver cirrhosis by using a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors. The composition of the present disclosure achieves the effect of treating liver cirrhosis through various efficacy experiments.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 11, 2024
    Inventors: Po-Cheng Lin, Pi-Chun Huang, Zih-Han Hong, Ming-Hsi Chuang, Yi-Chun Lin, Chia-Hsin Lee, Chun-Hung Chen, Chao-Liang Chang, Kai-Ling Zhang
  • Publication number: 20240121685
    Abstract: A method of reducing gray energy consumption and achieving optimal gray energy saving for carbon neutralization is proposed. In a cellular network, each cell or BS (group of cells) has renewable (green) and non-renewable (gray, on-grid power) energy sources. The renewable (green) energy is highly variable and unpredictable, while non-renewable (gray, on-grid power) is stable but is not renewable and thus has more carbon impact. Each cell or BS (group of cells) services is associated UEs when it is on. In one novel aspect, a cell or BS (group of cells) that consumes more non-renewable energy can give some or all of its served UEs to another cell or BS (group of cells) that consumes less non-renewable energy.
    Type: Application
    Filed: September 21, 2023
    Publication date: April 11, 2024
    Inventors: Chien-Sheng Yang, I-Kang Fu, YUAN-CHIEH LIN, Chia-Lin Lai, Yu-Hsin Lin, Yun-Hsuan Chang
  • Publication number: 20240120845
    Abstract: A resonant flyback power converter includes: a first transistor and a second transistor which are configured to switch a transformer and a resonant capacitor for generating an output voltage; and a switching control circuit generating first and second driving signals for controlling the first and the second transistors. The turn-on of the first driving signal magnetizes the transformer. The second driving signal includes a resonant pulse having a resonant pulse width and a ZVS pulse during the DCM operation. The resonant pulse is configured to demagnetize the transformer. The resonant pulse has a first minimum resonant period for a first level of the output load and a second minimum resonant period for a second level of the output load. The first level is higher than the second level and the second minimum resonant period is shorter than the first minimum resonant period.
    Type: Application
    Filed: April 14, 2023
    Publication date: April 11, 2024
    Inventors: Yu-Chang Chen, Ta-Yung Yang, Kun-Yu Lin, Hsin-Yi Wu
  • Publication number: 20240120846
    Abstract: A resonant flyback power converter includes: a first transistor and a second transistor which are configured to switch a transformer and a resonant capacitor for generating an output voltage; and a switching control circuit generating first and second driving signals for controlling the first and the second transistors. The turn-on of the first driving signal magnetizes the transformer. During a DCM (discontinuous conduction mode) operation, the second driving signal includes a resonant pulse for demagnetizing the transformer and a ZVS (zero voltage switching) pulse for achieving ZVS of the first transistor. The resonant pulse is skipped when the output voltage is lower than a low-voltage threshold.
    Type: Application
    Filed: April 14, 2023
    Publication date: April 11, 2024
    Inventors: Yu-Chang Chen, Ta-Yung Yang, Kun-Yu Lin, Hsin-Yi Wu