Abstract: A switching control circuit for use in controlling a resonant flyback power converter generates a first driving signal and a second driving signal. The first driving signal is configured to turn on the first transistor to generate a first current to magnetize a transformer and charge a resonant capacitor. The transformer and charge a resonant capacitor are connected in series. The second driving signal is configured to turn on the second transistor to generate a second current to discharge the resonant capacitor. During a power-on period of the resonant flyback power converter, the second driving signal includes a plurality of short-pulses configured to turn on the second transistor for discharging the resonant capacitor. A pulse-width of the short-pulses of the second driving signal is short to an extent that the second current does not exceed a current limit threshold.

Abstract: A resonant flyback power converter includes: a first and a second transistors which form a half-bridge circuit for switching a transformer and a resonant capacitor to generate an output voltage; a current-sense device for sensing a switching current of the half-bridge circuit to generate a current-sense signal; and a switching control circuit generating a first and a second driving signals for controlling the first and the second transistors. The turn-on of the first driving signal controls the half-bridge circuit to generate a positive current to magnetize the transformer and charge the resonant capacitor. The turn-on of the second driving signal controls the half-bridge circuit to generate a negative current to discharge the resonant capacitor. The switching control circuit turns off the first transistor when the positive current exceeds a positive-over-current threshold, and/or, turns off the second transistor when the negative current exceeds a negative-over-current threshold.

Abstract: A resonant flyback power converter includes: a first transistor and a second transistor which are configured to switch a transformer and a resonant capacitor for generating an output voltage; and a switching control circuit generating first and second driving signals for controlling the first and the second transistors. The turn-on of the first driving signal magnetizes the transformer. During a DCM (discontinuous conduction mode) operation, the second driving signal includes a resonant pulse for demagnetizing the transformer and a ZVS (zero voltage switching) pulse for achieving ZVS of the first transistor. The resonant pulse is skipped when the output voltage is lower than a low-voltage threshold.

Abstract: A resonant flyback power converter includes: a first transistor and a second transistor which are configured to switch a transformer and a resonant capacitor for generating an output voltage; and a switching control circuit generating first and second driving signals for controlling the first and the second transistors. The turn-on of the first driving signal magnetizes the transformer. The second driving signal includes a resonant pulse having a resonant pulse width and a ZVS pulse during the DCM operation. The resonant pulse is configured to demagnetize the transformer. The resonant pulse has a first minimum resonant period for a first level of the output load and a second minimum resonant period for a second level of the output load. The first level is higher than the second level and the second minimum resonant period is shorter than the first minimum resonant period.

Abstract: A method of making a semiconductor device includes forming at least one fiducial mark on a photomask. The method further includes defining a pattern including a plurality of sub-patterns on the photomask in a pattern region. The defining the pattern includes defining a first sub-pattern of the plurality of sub-patterns having a first spacing from a second sub-pattern of the plurality of sub-patterns, wherein the first spacing is different from a second spacing between the second sub-pattern and a third sub-pattern of the plurality of sub-patterns.

Abstract: An electronic device includes a first component and a second component. The first component includes a first housing and a protrusion element. The first housing has a first cover plate, and the protrusion element is disposed on the first cover plate. The second component is rotationally assembled with the first component along a first direction. The second component includes a second housing, an elastic structure, and a switching element. The elastic structure has an elastic post. The second housing has a second cover plate having a through hole. One part of the elastic post passes through the through hole and is exposed on the second cover plate. The protrusion element moves along a first direction relative to the elastic structure, such that the elastic post is squeezed by the protrusion element to move along a second direction and presses the switching element.

Abstract: A method includes forming a test pattern and a reference pattern in an absorption layer of a photomask structure. The test pattern has a first trench and a second trench, the reference pattern has a third trench and a fourth trench, the test pattern and the reference pattern have substantially the same dimension in a top view, and the second trench is deeper than the first trench, the third trench, and the fourth trench. The method further includes emitting a light beam to the test pattern to obtain a first interference pattern reflected from the test pattern, emitting the light beam to the reference pattern to obtain a second interference pattern reflected from the reference pattern; and comparing the first interference pattern with the second interference pattern to obtain a measured complex refractive index of the absorption layer.

Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.

Abstract: In a method of manufacturing an attenuated phase shift mask, a photo resist pattern is formed over a mask blank. The mask blank includes a transparent substrate, an etch stop layer on the transparent substrate, a phase shift material layer on the etch stop layer, a hard mask layer on the phase shift material layer and an intermediate layer on the hard mask layer. The intermediate layer is patterned by using the photo resist pattern as an etching mask, the hard mask layer is patterned by using the patterned intermediate layer as an etching mask, and the phase shift material layer is patterned by using the patterned hard mask layer as an etching mask. The intermediate layer includes at least one of a transition metal, a transition metal alloy, or a silicon containing material, and the hard mask layer is made of a different material than the intermediate layer.

Abstract: A temperature measurement calibration method without interference of a shutter of a thermal imaging module comprises steps: at a temperature of a core chip of a thermal imaging module, obtaining a response value generated by measuring a blackbody temperature after the shutter is started at a frame time; performing a linear regression analysis of the response value to obtain a correction response value equation; inputting the response value into the correction response value equation; and obtaining a correction response value of measuring the blackbody temperature.

Abstract: A method of stabilizing temperature sensing in presence of temperature-sensing component temperature variation includes steps of: obtaining response value caused by black body at first temperature of a thermal imager core chip; obtaining high-temperature first-order linear function of high-temperature black body response value versus thermal imager core chip temperature; obtaining low-temperature first-order linear function of low-temperature black body response value versus thermal imager core chip temperature; obtaining response value of high-temperature first-order linear function at first temperature, response value of high-temperature first-order linear function at second temperature of the thermal imager core chip, response value of low-temperature first-order linear function at first temperature, response value of low-temperature first-order linear function at second temperature, and response value of black body and substituting the five values into an equation for correcting the response values; and o

Abstract: A joystick module includes a casing, a movable component, a circuit board, a base, a swing arm, a joystick and a sensor. The movable component is disposed inside or outside the casing. The base is disposed within the casing. The swing arm is disposed within the casing, pivotally connected to the base and connected to the movable component for driving the movable component to move. The joystick is connected to the swing arm for driving the swing arm to move. The sensor is disposed on the circuit board and opposite to the movable component, and configured to sense a plurality of received signals from the movable component. The received signals are different with the movement of the movable component.

Abstract: A sound recognition device includes a collecting module, an extracting module connected with the collecting module, a training module, a storage module, a decoding module and a processor module. The collecting module is for receiving sound information of a specific target and a target to be measured. The extracting module is used for extracting sound characteristics of the specific target and the target to be measured. The training module is connected with the extracting module. Regard the sound characteristics of the sound information of the specific target and the target to be measured as input data of a hidden vector state (HVS) model. The storage module is connected with the training module. The decoding module is used for proceeding a language decoding procedure on sound information of the target to be measured. The processor module is connected with the training module, the storage module and the decoding module.

Abstract: A display apparatus and a driving method of a display panel thereof are disclosed. The display apparatus includes the display panel and a common voltage setting circuit. The display panel has a plurality of pixels and a plurality of common electrode lines and receives a plurality of pixel voltages. Each of the pixels is coupled to the corresponding common electrode line and receives the corresponding pixel voltage. The common voltage setting circuit is coupled to the common electrode lines. A common voltage having a normal voltage level is supplied to the common electrode lines during a first frame period. The common voltage having a complementary high voltage level or a complementary low voltage level is supplied to the common electrode lines during a second frame period. Each of the pixels receives the same pixel voltage during the first frame period and the second frame period.

Abstract: A sound recognition device includes a collecting module, an extracting module connected with the collecting module, a training module, a storage module, a decoding module and a processor module. The collecting module is for receiving sound information of a specific target and a target to be measured. The extracting module is used for extracting sound characteristics of the specific target and the target to be measured. The training module is connected with the extracting module. Regard the sound characteristics of the sound information of the specific target and the target to be measured as input data of a hidden vector state (HVS) model. The storage module is connected with the training module. The decoding module is used for proceeding a language decoding procedure on sound information of the target to be measured. The processor module is connected with the training module, the storage module and the decoding module.

Abstract: An intelligent lamp holder includes a microprocessor, a memory controlled by the microprocessor, an acoustic reception and transmission element, a sound recognition module, a light modulation module controlled by the microprocessor, a sensing module controlled by the microprocessor, an internet of things transmission protocol module controlled by the microprocessor, a wireless communication module connected with the internet of things transmission protocol module and the microprocessor, and an instruction match and situation application module for comparing operation instructions recognized by the internet of things transmission protocol module with a plurality of preset instructions. The acoustic reception and transmission element is connected with an external ultrasonic device for receiving ultrasonic signals, and converts the ultrasonic signals into digital signals. The sound recognition module is controlled by the microprocessor, and connected with the acoustic reception and transmission element.

Abstract: An intelligent lamp holder includes a microprocessor, an acoustic reception and transmission element, a sound recognition module, a light modulation module and a sensing module. The acoustic reception and transmission element is connected with an external ultrasonic device for receiving ultrasonic signals, and the acoustic reception and transmission element converts the ultrasonic signals into digital signals. The sound recognition module is connected with and controlled by the microprocessor, and the sound recognition module is connected with the acoustic reception and transmission element. The digital signals are transmitted to the sound recognition module. The sound recognition module receives and recognizes the digital signals to generate execution instructions. The light modulation module is connected with and controlled by the microprocessor for controlling on-off statuses and a brightness modulation of a lamp according to different execution instructions.

Abstract: A display apparatus and a driving method of a display panel thereof are disclosed. The display apparatus includes the display panel and a common voltage setting circuit. The display panel has a plurality of pixels and a plurality of common electrode lines and receives a plurality of pixel voltages. Each of the pixels is coupled to the corresponding common electrode line and receives the corresponding pixel voltage. The common voltage setting circuit is coupled to the common electrode lines. A common voltage having a normal voltage level is supplied to the common electrode lines during a first frame period. The common voltage having a complementary high voltage level or a complementary low voltage level is supplied to the common electrode lines during a second frame period. Each of the pixels receives the same pixel voltage during the first frame period and the second frame period.

Abstract: A securing mechanism is provided for facilitating attaching a heat dissipation element. The securing mechanism includes a first fixing part, a second fixing part, a first arm and a second arm. The first arm and the second arm are connected with the first fixing part and the second fixing part. A first bent structure is protruded from the first arm and toward the second arm. A second bent structure is protruded from the second arm and toward the first arm. The securing mechanism is fixed on the heat dissipation element through the first fixing part and the second fixing part. The heat dissipation element is pressed by the first bent structure and the second bent structure. Consequently, the heat dissipation element is attached on the heat source.

Abstract: A securing mechanism is provided for facilitating attaching a heat dissipation element. The securing mechanism includes a first fixing part, a second fixing part, a first arm and a second arm. The first arm and the second arm are connected with the first fixing part and the second fixing part. A first bent structure is protruded from the first arm and toward the second arm. A second bent structure is protruded from the second arm and toward the first arm. The securing mechanism is fixed on the heat dissipation element through the first fixing part and the second fixing part. The heat dissipation element is pressed by the first bent structure and the second bent structure. Consequently, the heat dissipation element is attached on the heat source.