Patents by Inventor Hsin-Chang Chiang

Hsin-Chang Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8734000
    Abstract: A light module and an assembling method thereof are disclosed. The light module includes a first circuit board, a second circuit board, and a light source, wherein the first circuit board has a first opening and a second opening, and the second circuit board has a first bending portion. The light source is disposed on the first circuit board. The second circuit board passes through the first opening and the second opening of the first circuit board to form the first bending portion and the first circuit board and the second circuit board are fixed together to complete the light module assembling.
    Type: Grant
    Filed: June 2, 2011
    Date of Patent: May 27, 2014
    Assignee: Au Optronics Corporation
    Inventors: Hsin-Chang Chiang, Chieh-Jen Cheng, Chien-Ting Liao
  • Patent number: 8267567
    Abstract: A bezel assembly, which is applied to a backlight module, includes a first bezel and a second bezel. The first bezel has a first side wall and a second side wall. A first hole structure is formed on a corner between the first and second side walls. The second bezel has a third side wall. A second hole structure and a third hole structure are formed on opposite sides of the third side wall. When the first bezel is disposed in the second bezel, the third side wall can completely cover the first hole structure of the first bezel from the outside of the first bezel, and the second and third hole structures are close to the first hole structure.
    Type: Grant
    Filed: January 14, 2010
    Date of Patent: September 18, 2012
    Assignee: AU Optronics Corp.
    Inventors: Ching-Hung Cheng, Hsin-Chang Chiang
  • Publication number: 20120020096
    Abstract: A light module and an assembling method thereof are disclosed. The light module includes a first circuit board, a second circuit board, and a light source, wherein the first circuit board has a first opening and a second opening, and the second circuit board has a first bending portion. The light source is disposed on the first circuit board. The second circuit board passes through the first opening and the second opening of the first circuit board to form the first bending portion and the first circuit board and the second circuit board are fixed together to complete the light module assembling.
    Type: Application
    Filed: June 2, 2011
    Publication date: January 26, 2012
    Applicant: AU OPTRONICS CORPORATION
    Inventors: Hsin-Chang Chiang, Chieh-Jen Cheng, Chien-Ting Liao
  • Publication number: 20110134661
    Abstract: A bezel assembly, which is applied to a backlight module, includes a first bezel and a second bezel. The first bezel has a first side wall and a second side wall. A first hole structure is formed on a corner between the first and second side walls. The second bezel has a third side wall. A second hole structure and a third hole structure are formed on opposite sides of the third side wall. When the first bezel is disposed in the second bezel, the third side wall can completely cover the first hole structure of the first bezel from the outside of the first bezel, and the second and third hole structures are close to the first hole structure.
    Type: Application
    Filed: January 14, 2010
    Publication date: June 9, 2011
    Inventors: Ching-Hung Cheng, Hsin-Chang Chiang