Abstract: A casing of an oven includes a base, two first plates and two second plates. The base has two first pivot portions and two second pivot portions. Two first axes and two second axes are defined. Each of the two first axes passes through one of the two first pivot portions. Each of the two second axes passes through one of the two second pivot portions. Each of the two first axes and the two second axes re spaced apart from one another in a height direction of the base. Each of the two first plates is pivotally connected to one of the two first pivot portions. Each of the two second plates is pivotally connected to one of the two second pivot portions. As the four axes are respectively located at different positions in the height direction of the base, the two first plates could be stacked and the two second plates could be stacked upon folding the casing.

Abstract: A projection apparatus, an illumination apparatus thereof, and a light source driving method thereof are provided. A control module converts a bit control signal into first light source timing signals, converts the first light source timing signals into second light source timing signals according to a lookup table, generates a driving current corresponding to each light source according to the lookup table, outputs second light source driving signals corresponding to the light sources according to the second light source timing signals. The lookup table includes a driving current ratio corresponding to the light sources. A driving module drives the light sources according to the second light source driving signals and the driving current for the light sources to have overlapping light-emitting timings.

Abstract: An interconnection structure, along with methods of forming such, are described. The structure includes a dielectric layer, a first conductive feature disposed in the dielectric layer, a second conductive feature disposed over the first conductive feature, a third conductive feature disposed adjacent the second conductive feature, a first dielectric material disposed between the second and third conductive features, a first one or more graphene layers disposed between the second conductive feature and the first dielectric material, and a second one or more graphene layers disposed between the third conductive feature and the first dielectric material.

Abstract: A semiconductor device package, along with methods of forming such, are described. The semiconductor device package includes a first semiconductor device structure having a first substrate, two first devices disposed on the first substrate, a first interconnection structure disposed over the first substrate and the two first devices, and a first thermal feature disposed through the first substrate and the first interconnection structure. The semiconductor device package further includes a second semiconductor device structure disposed over the first semiconductor device structure having a second interconnection structure disposed over the first interconnection structure, a second substrate disposed over the second interconnection structure, two second devices disposed between the second substrate and the second interconnection structure, and a second thermal feature disposed through the second substrate and the second interconnection structure.

Abstract: An interconnection structure, along with methods of forming such, are described. The structure includes a first conductive feature, a first liner having a first top surface disposed on the first conductive feature, a second conductive feature disposed adjacent the first conductive feature, and a second liner disposed on at least a portion of the second conductive feature. The second liner has a second top surface, and the first liner and the second liner each comprises a two-dimensional material. The structure further includes a first dielectric material disposed between the first and second conductive features and a dielectric layer disposed on the first dielectric material. The dielectric layer has a third top surface, and the first, second, and third top surfaces are substantially co-planar.

Abstract: An interconnection structure, along with methods of forming such, are described. The structure includes a dielectric layer, a first conductive feature disposed in the dielectric layer, a second conductive feature disposed over the first conductive feature, a third conductive feature disposed adjacent the second conductive feature, a first dielectric material disposed between the second and third conductive features, a first one or more graphene layers disposed between the second conductive feature and the first dielectric material, and a second one or more graphene layers disposed between the third conductive feature and the first dielectric material.

Abstract: An interconnection structure, along with methods of forming such, are described. The structure includes a dielectric layer, a first conductive feature disposed in the dielectric layer, and a conductive layer disposed over the dielectric layer. The conductive layer includes a first portion and a second portion adjacent the first portion, and the second portion of the conductive layer is disposed over the first conductive feature. The structure further includes a first barrier layer in contact with the first portion of the conductive layer, a second barrier layer in contact with the second portion of the conductive layer, and a support layer in contact with the first and second barrier layers. An air gap is located between the first and second barrier layers, and the dielectric layer and the support layer are exposed to the air gap.

Abstract: A method of inspecting an outer surface of a mask pod includes moving a stage holding a mask pod such that the stage stops at each location of a plurality of locations under an outer surface of the mask pod for a predefined amount of time. At each location of the plurality of locations, the method further includes directing a stream of air to the outer surface of the mask pod, capturing an image of scattered air from each location of the plurality of locations of the outer surface of the mask pod, and determining a number of particles in the scattered air as a sampled number of particles based on the captured image. The method also includes generating a map of particles on the outer surface of the mask pod based on the sampled number of particles at each of the plurality of locations.

Abstract: An interconnection structure, along with methods of forming such, are described. The structure includes a first conductive feature, a first liner having a first top surface disposed on the first conductive feature, a second conductive feature disposed adjacent the first conductive feature, and a second liner disposed on at least a portion of the second conductive feature. The second liner has a second top surface, and the first liner and the second liner each comprises a two-dimensional material. The structure further includes a first dielectric material disposed between the first and second conductive features and a dielectric layer disposed on the first dielectric material. The dielectric layer has a third top surface, and the first, second, and third top surfaces are substantially co-planar.

Abstract: An interconnect structure includes a dielectric layer, a conductive feature, a conductive layer, a capping layer, a support layer and an etch stop layer. The conductive feature is disposed in the dielectric layer. A first portion of the conductive layer is disposed over the first conductive feature, and a second portion of the conductive layer is disposed over the dielectric layer. A first portion of the capping layer is in contact with the first portion of the conductive layer, a second portion of the capping layer is in contact with the second portion of the conductive layer, and a third portion of the capping layer is in contact with the dielectric layer. An air gap is defined by the support layer and the capping layer. The etch stop layer is disposed over the second portion of the conductive layer, the second portion of the capping layer and the support layer.

Abstract: A projection system and a control method thereof are provided. The projection system includes a projection module, a mmWave sensor, and a control circuit. The projection module projects an image beam to a projection surface. The mmWave sensor is configured to sense an object entering a sensing range and obtain a sensing result. The control circuit is coupled to the projection module and the mmWave sensor, and the control circuit controls the projection module to provide the image beam according to the sensing result of the mmWave sensor.

Abstract: A projection apparatus, an illumination apparatus thereof, and a light source driving method thereof are provided. A control module converts a bit control signal into first light source timing signals, converts the first light source timing signals into second light source timing signals according to a lookup table, generates a driving current corresponding to each light source according to the lookup table, outputs second light source driving signals corresponding to the light sources according to the second light source timing signals. The lookup table includes a driving current ratio corresponding to the light sources. A driving module drives the light sources according to the second light source driving signals and the driving current for the light sources to have overlapping light-emitting timings.

Abstract: Provided is a method of making colloidal selenium nanoparticles. The method includes the steps as follows: Step (A): providing a reducing agent and an aqueous solution containing a selenium precursor; Step (B): mixing the aqueous solution containing the selenium precursor and the reducing agent to form a mixture solution in a reaction vessel and heating the mixture solution to undergo a reduction reaction and produce a composition containing selenium nanoparticles, residues and a gas, and guiding the gas out of the reaction vessel, wherein an amount of the residues is less than 20% by volume of the mixture solution; and Step (C): dispersing the selenium nanoparticles with a medium to obtain the colloidal selenium nanoparticles. The method has advantages of simplicity, safety, time-effectiveness, cost-effectiveness, high yield and eco-friendliness.

Abstract: Provided is a method of making colloidal selenium nanoparticles. The method includes the steps as follows: Step (A): providing a reducing agent and an aqueous solution containing a selenium precursor; Step (B): mixing the aqueous solution containing the selenium precursor and the reducing agent to form a mixture solution in a reaction vessel and heating the mixture solution to undergo a reduction reaction and produce a composition containing selenium nanoparticles, residues and a gas, and guiding the gas out of the reaction vessel, wherein an amount of the residues is less than 20% by volume of the mixture solution; and Step (C): dispersing the selenium nanoparticles with a medium to obtain the colloidal selenium nanoparticles. The method has advantages of simplicity, safety, time-effectiveness, cost-effectiveness, high yield and eco-friendliness.

Abstract: A projection device, a light source system and a projection method thereof are provided. A portion of the light-emitting units are controlled to provide a light beam as the first light beam. It is detected whether characteristic parameters of the light-emitting units providing the light beam reach a preset value. When the preset value is not reached, the light-emitting units providing the light beam are disabled, and the remaining light-emitting units are controlled to provide the back-up light beam as the first light beam. A portion of the first light beam is converted into a second light beam. The first light beam of which the wavelength is not converted and the second light beam are combined to generate an illumination beam. The illumination beam is converted into an image beam. The image beam is converted into a projection beam.

Abstract: Provided is a method of making a fiber comprising metal nanoparticles. The method includes steps of: Step (A): providing a fiber and a metal salt aqueous solution comprising first metal ions; Step (B): making the metal salt aqueous solution contact the fiber to form a fiber containing the first metal ions; and Step (C): contacting the fiber containing the first metal ions with a second metal, and performing a reduction reaction of the first metal ions to obtain the fiber comprising metal nanoparticles, wherein the fiber comprising metal nanoparticles comprises first metal nanoparticles from a reduction of the first metal ions; wherein a standard reduction potential of the first metal ions is greater than a standard reduction potential of an ionic state of the second metal, and a difference therebetween ranges from 0.4 V to 4.0 V.

Abstract: An illumination system, a projection apparatus and an illumination control method are provided. The illumination system includes an excitation light source, an optical component, a light source driver, a temperature sensing module and a controller. The excitation light source emits an excitation light beam. The optical component is located on a transmission path of the excitation light beam. The light source driver is configured to drive the excitation light source. The temperature sensing module is located in a neighboring region of the optical component and configured to sense a temperature of the neighboring region of the optical component to output a sensing voltage. The controller is configured to receive the sensing voltage to determine whether the sensing voltage falls out of a predetermined voltage range and configured to output a control signal to the light source driver to adjust the excitation light beam.

Abstract: A projection device, a light source system and a projection method thereof are provided. A portion of the light-emitting units are controlled to provide a light beam as the first light beam. It is detected whether characteristic parameters of the light-emitting units providing the light beam reach a preset value. When the preset value is not reached, the light-emitting units providing the light beam are disabled, and the remaining light-emitting units are controlled to provide the back-up light beam as the first light beam. A portion of the first light beam is converted into a second light beam. The first light beam of which the wavelength is not converted and the second light beam are combined to generate an illumination beam. The illumination beam is converted into an image beam. The image beam is converted into a projection beam.

Abstract: A display panel has a portion of a color filter or patterned color layer with a thickness of at least half of the cell gap of the display panel, wherein the repair method includes providing a energy light beam to the portion of the color filter or the patterned color layer in the sub-pixel region with a bright point defect to make the portion of the color filter or patterned color layer have porous structure so that bright point is repaired to become a grey point or a dark point.

Abstract: A display panel has a portion of a color filter or patterned color layer with a thickness of at least half of the cell gap of the display panel, wherein the repair method includes providing a energy light beam to the portion of the color filter or the patterned color layer in the sub-pixel region with a bright point defect to make the portion of the color filter or patterned color layer have porous structure so that bright point is repaired to become a grey point or a dark point.