Patents by Inventor Hsin-Chen Lee

Hsin-Chen Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250136218
    Abstract: A vehicle seat assembly, suitable for vehicles such as locomotives and the like, includes a main cushion body and a lifting cushion. The main cushion body has a sliding cushion connected to a vehicle body with a sliding structure. The lifting cushion is connected to the vehicle body with a linkage mechanism. The lifting cushion is moved into a carriage when the sliding cushion is in a first position, and when the sliding cushion slides laterally into a second position to form a space portion, the lifting cushion can be lifted from the carriage and moved into the space portion and then positioned, or can be lowered into the carriage again, so that the sliding cushion can be moved back to the first position, thereby allowing the user to adjust seat cushion length according to their needs.
    Type: Application
    Filed: October 22, 2024
    Publication date: May 1, 2025
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: HSIN CHEN, TUNG-YING WU, KUAN-CHANG LEE, SHI-KUAN CHEN
  • Publication number: 20250118595
    Abstract: Semiconductor structures and methods of forming the same are provided. An exemplary method incudes forming a first dielectric layer over a first conductive feature, forming a conductive via extending through the first dielectric layer and coupled to the first conductive feature, forming a hard mask layer over the conductive via, patterning the hard mask layer to form a first opening exposing the first dielectric layer; forming a sacrificial layer to partially fill the first opening, forming a porous dielectric layer on the sacrificial layer, after the forming of the porous dielectric layer, selectively removing the sacrificial layer to form an air gap, forming a second dielectric layer over the porous dielectric layer, and replacing a portion of the patterned hard mask layer disposed directly over the conductive via with a second conductive feature.
    Type: Application
    Filed: February 1, 2024
    Publication date: April 10, 2025
    Inventors: Shao-Kuan Lee, Ting-Ya Lo, Hsin-Yen Huang, Chia Chen Lee, Hsiao-Kang Chang
  • Publication number: 20250118598
    Abstract: An interconnection structure and a manufacturing method thereof are provided. The interconnection structure includes a first dielectric layer, a first conductive feature, a second dielectric layer, and a barrier layer. The first conductive feature is disposed on the first dielectric layer, the second dielectric layer is disposed on the first dielectric layer and surrounds the sidewalls of the first conductive feature, the barrier layer is disposed between the first dielectric layer and the second dielectric layer and between the sidewalls of the first conductive feature and the second dielectric layer.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 10, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Chin LEE, Ting-Ya LO, Chi-Lin TENG, Shao-Kuan LEE, Kuang-Wei YANG, Gary HSU WEI LIU, Yen-Ju WU, Jing-Ting SU, Hsin-Yen HUANG, Hsiao-Kang CHANG, Wei-Chen CHU, Shu-Yun KU, Chia-Tien WU, Ming-Han LEE, Hsin-Ping CHEN
  • Publication number: 20250112088
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a first low dielectric constant (low-k) layer, a first metal layer, a metal cap layer, a dielectric on dielectric (DoD) layer, an etch stop layer (ESL), a second low-k layer, a metal via and a second metal layer. The dielectric constant of the first low-k layer is less than 4. The first metal layer is embodied in the first low-k layer. The first low-k layer exposes the first metal layer. The metal cap layer is disposed on the first metal layer. The DoD layer is disposed on the first low-k layer. The etch stop layer is disposed on the metal cap layer and the DoD layer. The second low-k layer is disposed above the etch stop layer. The metal via is embodied in the second low-k layer and connected to the first metal layer.
    Type: Application
    Filed: September 28, 2023
    Publication date: April 3, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Chin LEE, Yen Ju WU, Shao-Kuan LEE, Kuang-Wei YANG, Hsin-Yen HUANG, Jing Ting SU, Kai-Fang CHENG, Hsiao-Kang CHANG, Wei-Chen CHU, Shu-Yun KU, Chia-Tien WU, Ming-Han LEE, Hsin-Ping CHEN
  • Publication number: 20250032621
    Abstract: A drug conjugate includes a structure shown by the following formula: Z-(linker-[R]m)n. In the formula, Z is a drug compound, R is a sugar, and m and n are independently an integer from 1 to 6. The drug compound Z is a hepatitis virus targeting drug, a hepatitis B virus (HBV) drug, an inhibitor of apoptosis protein (IAP) antagonist, a multidrug resistance (MDR) inhibitor, or analogues, precursors, prodrugs, derivatives thereof.
    Type: Application
    Filed: May 30, 2024
    Publication date: January 30, 2025
    Applicant: SeeCure Taiwan Co., Ltd.
    Inventors: Wuu-Jyh Lin, Min-Ching Chung, Chi-Shiang Ke, Ya-Chen Tseng, Chin-Yu Liang, Yen-Chun Lee, Hsin-Jou Li, Tai-Yun Huang, Nai-Chen Hsueh, Yan-Feng Jiang
  • Patent number: 11093713
    Abstract: A method for generating a search index, applicable for a database system having a first database and a second database, includes the follow steps: receiving an access instruction corresponding to a first document, analyzing the first document to obtain a plurality of key character strings, writing the first document into the first database or the second database based on the access instruction and generating address information corresponding to the first document accordingly, and generating a search index corresponding to the first document based on the address information and the key character strings.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: August 17, 2021
    Assignee: AVISION INC.
    Inventor: Hsin-Chen Lee
  • Publication number: 20180024988
    Abstract: A method for generating a search index, applicable for a database system having a first database and a second database, includes the follow steps: receiving an access instruction corresponding to a first document, analyzing the first document to obtain a plurality of key character strings, writing the first document into the first database or the second database based on the access instruction and generating address information corresponding to the first document accordingly, and generating a search index corresponding to the first document based on the address information and the key character strings.
    Type: Application
    Filed: June 6, 2017
    Publication date: January 25, 2018
    Applicant: AVISION INC.
    Inventor: Hsin-Chen LEE
  • Patent number: D831694
    Type: Grant
    Filed: April 12, 2017
    Date of Patent: October 23, 2018
    Assignee: Avision Inc.
    Inventors: Ting-Kuo Chu, Hsin-Chen Lee, Yu-Ling Chen, Yung-Ting Hsu
  • Patent number: D831695
    Type: Grant
    Filed: September 18, 2017
    Date of Patent: October 23, 2018
    Assignee: Avision Inc.
    Inventors: Kai-Chieh Chuang, Ting-Kuo Chu, Hsin-Chen Lee, Yu-Ling Chen, Yung-Ting Hsu
  • Patent number: D832302
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: October 30, 2018
    Assignee: Avision Inc.
    Inventors: Ting-Kuo Chu, Hsin-Chen Lee, Yu-Ling Chen, Yung-Ting Hsu
  • Patent number: D837802
    Type: Grant
    Filed: May 2, 2017
    Date of Patent: January 8, 2019
    Assignee: Avision Inc.
    Inventors: Chao-Yu Peng, Chi-Yao Chen, Hsin-Chen Lee
  • Patent number: D837803
    Type: Grant
    Filed: May 2, 2017
    Date of Patent: January 8, 2019
    Assignee: Avision Inc.
    Inventors: Chao-Yu Peng, Chi-Yao Chen, Hsin-Chen Lee
  • Patent number: D837827
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: January 8, 2019
    Assignee: Avision Inc.
    Inventors: Ting-Kuo Chu, Hsin-Chen Lee, Yu-Ling Chen, Yung-Ting Hsu
  • Patent number: D836130
    Type: Grant
    Filed: September 21, 2016
    Date of Patent: December 18, 2018
    Assignee: Avision Inc.
    Inventors: Ting-Kuo Chu, Hsin-Chen Lee, Yu-Ling Chen, Yung-Ting Hsu
  • Patent number: D858568
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: September 3, 2019
    Assignee: AVISION INC.
    Inventors: Kai-Chieh Chuang, Ting-Kuo Chu, Hsin-Chen Lee, Yu-Ling Chen, Yung-Ting Hsu
  • Patent number: D865809
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: November 5, 2019
    Assignee: Avision Inc.
    Inventors: Ting-Kuo Chu, Hsin-Chen Lee, Yu-Ling Chen, Yung-Ting Hsu
  • Patent number: D870148
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: December 17, 2019
    Assignee: AVISION INC.
    Inventors: Kai-Chieh Chuang, Ting-Kuo Chu, Hsin-Chen Lee, Yu-Ling Chen, Yung-Ting Hsu
  • Patent number: D892860
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: August 11, 2020
    Assignee: AVISION INC.
    Inventor: Hsin-Chen Lee
  • Patent number: D898029
    Type: Grant
    Filed: May 2, 2017
    Date of Patent: October 6, 2020
    Assignee: AVISION INC.
    Inventors: Chao-Yu Peng, Chi-Yao Chen, Hsin-Chen Lee
  • Patent number: D913323
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: March 16, 2021
    Assignee: Avision Inc.
    Inventors: Ting-Kuo Chu, Hsin-Chen Lee, Yu-Ling Chen, Yung-Ting Hsu