Patents by Inventor Hsin-Chen Lin
Hsin-Chen Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12199139Abstract: Various embodiments of the present application are directed towards an integrated chip (IC). The IC comprises a trench capacitor overlying a substrate. The trench capacitor comprises a plurality of capacitor electrode structures, a plurality of warping reduction structures, and a plurality of capacitor dielectric structures. The plurality of capacitor electrode structures, the plurality of warping reduction structures, and the plurality of capacitor dielectric structures are alternatingly stacked and define a trench segment that extends vertically into the substrate. The plurality of capacitor electrode structures comprise a metal component and a nitrogen component. The plurality of warping reduction structures comprise the metal component, the nitrogen component, and an oxygen component.Type: GrantFiled: July 11, 2022Date of Patent: January 14, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ting-Chen Hsu, Hsin-Li Cheng, Jyun-Ying Lin, Yingkit Felix Tsui, Shu-Hui Su, Shi-Min Wu
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Patent number: 12188483Abstract: The disclosure provides a centrifugal fan including a housing and a blade module. The housing includes a lower cover, a side wall, and an upper cover. Two ends of the side wall are respectively connected to the lower cover and the upper cover to define an internal space. The lower cover includes a plurality of lower air inlets. The blade module is arranged in the internal space, and includes a hub and a plurality of blades. The hub is rotatably arranged on the lower cover. The blades are arranged around the hub. The lower air inlets are located on the periphery of the hub, and each lower air inlet includes an outer edge relative to a rotational axis of the hub. At least one of two ends of at least one of the lower air inlets includes a protruding portion at a position corresponding to the outer edge.Type: GrantFiled: March 3, 2023Date of Patent: January 7, 2025Assignee: ASUSTEK COMPUTER INC.Inventors: Hsin Chen Lin, Ing-Jer Chiou
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Patent number: 12176387Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a capacitor over a substrate. The capacitor includes a plurality of conductive layers and a plurality of dielectric layers. The plurality of conductive layers and dielectric layers define a base structure and a first protrusion structure extending downward from the base structure towards a bottom surface of the substrate. The first protrusion structure comprises one or more surfaces defining a first cavity. A top of the first cavity is disposed below the base structure.Type: GrantFiled: July 31, 2023Date of Patent: December 24, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hsin-Li Cheng, Jyun-Ying Lin, Alexander Kalnitsky, Shih-Fen Huang, Shu-Hui Su, Ting-Chen Hsu, Tuo-Hsin Chien, Felix Ying-Kit Tsui, Shi-Min Wu, Yu-Chi Chang
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Publication number: 20240421464Abstract: An electronic device includes a shell and an antenna assembly. The casing has an accommodating space. The antenna assembly is located in the accommodating space, and includes a substrate, a first antenna component, a second antenna component and a third antenna component. The first antenna component, the second antenna component and the third antenna component are disposed on the substrate. The first antenna component includes a first radiation portion and a first ground portion, which are disposed on two opposite sides of the substrate. The second antenna component includes a second radiation portion and a second ground portion, which are disposed on two opposite sides of the substrate. The third 10 antenna component includes a third radiation portion and a third ground portion, which are disposed on two opposite sides of the substrate.Type: ApplicationFiled: August 22, 2023Publication date: December 19, 2024Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Hsin-Hung LIN, Yu Shu TAI, Ssu-Yu LIU, Wei-Chen CHENG
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Patent number: 12156391Abstract: A signal isolation device includes an insulation layer, at least one metal foil unit, and a metal layer. The at least one metal foil unit is disposed on a top surface of the insulation layer, and the metal foil unit has a first recessed channel and a second recessed channel. The first recessed channel and the second recessed channel spirally extend inward from an edge of the metal foil unit, and the first recessed channel and the second recessed channel surrounding each other are spaced apart. The metal layer is disposed on a bottom surface of the insulation layer.Type: GrantFiled: March 3, 2022Date of Patent: November 26, 2024Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATIONInventors: Hsin-Hung Lin, Wei-Chen Cheng
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Patent number: 12137914Abstract: An anastomosis set for anastomosing a first end to be anastomosed with a second end to be anastomosed, such anastomosis set comprising: a first manipulator, with a first telescoping part at a distal end thereof, the first telescoping part is used for telescoping toward the first end to be anastomosed; a second manipulator, with a second telescoping part at a distal end thereof, the second telescoping part is used for telescoping toward the second end to be anastomosed; and an anastomosis mechanism for anastomosing the first end to be anastomosed with the second end to be anastomosed; the first manipulator including a first exit part through which the first manipulator will be removed from the first end to be anastomosed after anastomosing; the second manipulator has a second exit part, through which the second manipulator will be removed from the second end to be anastomosed after anastomosing.Type: GrantFiled: November 11, 2019Date of Patent: November 12, 2024Assignee: Vasocollar, IncInventors: Hsin-Lei Huang, Wei-Chen Hong, Cheng Tung Huang, Hang-Yi Lin, Hsin-Hui Huang
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Publication number: 20240313419Abstract: An antenna device includes a substrate and four antenna units. The four antenna units are disposed on the substrate. Each of the four antenna units includes an L-shaped radiation portion, a hook-shaped coupling portion and a ground portion. The hook-shaped coupling portion is adjacent to the L-shaped radiation portion. The ground portion is disposed around the L-shaped radiation portion and the hook-shaped coupling portion. One end of the hook-shaped coupling portion is connected to the ground portion.Type: ApplicationFiled: June 5, 2023Publication date: September 19, 2024Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Hsin-Hung LIN, Yu Shu TAI, Wei-Chen CHENG
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Publication number: 20240313420Abstract: An antenna device includes a first substrate, a second substrate, a radiation portion and a cross-shaped exciter. The first substrate has a first top surface. The first substrate is stacked on the second substrate. The second substrate has a second top surface and a bottom surface. The second top surface faces away from the bottom surface. The radiation portion is disposed on the first top surface, and includes a first radiation component, a second radiation component, a third radiation component and a fourth radiation component. The first radiation component and the fourth radiation component are arranged on the first top surface symmetrically along a diagonal of the first top surface. The second radiation component and the third radiation component are arranged on the first top surface symmetrically along another diagonal of the first top surface. The cross-shaped exciter is disposed on the top surface.Type: ApplicationFiled: June 3, 2023Publication date: September 19, 2024Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Hsin-Hung LIN, Yu Shu TAI, Wei-Chen CHENG
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Publication number: 20240313421Abstract: An antenna device includes a first substrate, a second substrate, a radiation portion and an exciter. The second substrate is stacked on the first substrate. The exciter is disposed on the first substrate and includes a feeding transmission portion, an exciting portion, a connection portion and an impedance match portion. The feeding transmission portion is connected to a side of the exciting portion. The exciting portion and the impedance match portion are connected to two opposite sides of the connection portion, respectively. The radiation portion is located on the second substrate and includes a first radiation component, a second radiation component and a third radiation component. The first radiation component is disposed at a side of the second radiation component. The first radiation component and the second radiation component are disposed at a side of the third radiation component.Type: ApplicationFiled: June 5, 2023Publication date: September 19, 2024Applicants: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATIONInventors: Hsin-Hung LIN, Yu Shu TAI, Wei-Chen CHENG
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Patent number: 12089732Abstract: A system for detecting usage and position of a height adjustable work surface is disclosed that includes a smart hub device that uses a set of sensors to collect sensor data to determine whether a work area is occupied or unoccupied, and to also collect work area usage data for further analysis regarding the details of usage of the work area.Type: GrantFiled: July 7, 2021Date of Patent: September 17, 2024Assignees: XINADDA, INC., DEXATEK TECHNOLOGY LTD.Inventors: Han Chen, Yueh-Chen Lin, Manuel Alejandro Gomez De Los Santos, Hsin-Yu Chen
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Patent number: 12066031Abstract: A fan module includes a hub, a plurality of fan blades, and a ring frame. The hub is configured to rotate about a central axis. The plurality of fan blades surround the hub. Each of the plurality of fan blades includes a first end portion connected to the hub and a second end portion opposite to the first end portion. The ring frame is connected to the second end portion of each of the plurality of fan blades. The ring frame includes a first surface facing the plurality of fan blades and a second surface opposite to the first surface, and the first surface is a curved surface.Type: GrantFiled: April 9, 2023Date of Patent: August 20, 2024Assignee: ASUSTEK COMPUTER INC.Inventors: Hsin-Chen Lin, Ing-Jer Chiou
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Patent number: 12062151Abstract: An image processing circuit performs super-resolution (SR) operations. The image processing circuit includes memory to store multiple parameter sets of multiple artificial intelligence (AI) models. The image processing circuit further includes an image guidance module, a parameter decision module, and an SR engine. The image guidance module operates to detect a representative feature in an image sequence including a current frame and past frames within a time window. The parameter decision module operates to adjust parameters of one or more AI models based on a measurement of the representative feature. The SR engine operates to process the current frame using the one or more AI models with the adjusted parameters to thereby generate a high-resolution image for display.Type: GrantFiled: December 10, 2020Date of Patent: August 13, 2024Assignee: MediaTek Inc.Inventors: Ming-En Shih, Ping-Yuan Tsai, Yu-Cheng Tseng, Kuo-Chen Huang, Kuo-Chiang Lo, Hsin-Min Peng, Chun Hsien Wu, Pei-Kuei Tsung, Tung-Chien Chen, Yao-Sheng Wang, Cheng Lung Jen, Chih-Wei Chen, Chih-Wen Goo, Yu-Sheng Lin, Tsu Jui Hsu
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Patent number: 12055157Abstract: A centrifugal fan includes upper and lower covers, a fan frame, and a fan blade module. The fan frame is located between the lower and upper covers. The fan frame, and the lower and upper covers form a space. The fan blade module disposed in the space includes a hub, a connecting ring, inner and outer ring blades. The connecting ring surrounding the hub forms an inner ring region and an outer ring region around the hub and has a ring height and a ring width greater than the ring height. The inner ring blades are connected to the hub and the connecting ring, and circularly arranged in the inner ring region. The outer ring blades are connected to the connecting ring, and circularly arranged in the outer ring region. A quantity of the outer ring blades is greater than a quantity of the inner ring blades.Type: GrantFiled: June 12, 2023Date of Patent: August 6, 2024Assignee: ASUSTEK COMPUTER INC.Inventors: Hsin Chen Lin, Ing-Jer Chiou
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Patent number: 12009275Abstract: A heat transfer device is provided. The heat transfer device includes a first heat conduction sheet and a second heat conduction sheet. The first heat conduction sheet includes two first rigid parts and a first bendable part connected between the two first rigid parts. The second heat conduction sheet includes two second rigid parts and a second bendable part connected between the two second rigid parts. The two first rigid parts are thermally coupled to the two second rigid parts, respectively. The first bendable portion includes a nonlinear section.Type: GrantFiled: July 21, 2021Date of Patent: June 11, 2024Assignee: ASUSTEK COMPUTER INC.Inventors: Hsin-Chen Lin, Ing-Jer Chiou
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Publication number: 20240102483Abstract: A fan module includes a hub, a plurality of fan blades, and a ring frame. The hub is configured to rotate about a central axis. The plurality of fan blades surround the hub. Each of the plurality of fan blades includes a first end portion connected to the hub and a second end portion opposite to the first end portion. The ring frame is connected to the second end portion of each of the plurality of fan blades. The ring frame includes a first surface facing the plurality of fan blades and a second surface opposite to the first surface, and the first surface is a curved surface.Type: ApplicationFiled: April 9, 2023Publication date: March 28, 2024Applicant: ASUSTeK COMPUTER INC.Inventors: Hsin-Chen Lin, Ing-Jer Chiou
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Patent number: 11903162Abstract: The disclosure provides a fan control method, applied to an electronic device. The electronic device includes a fan and a setting unit, the setting unit having a plurality of setting values, and each setting value being corresponding to a sampling number. The fan control method includes: continuously detecting a temperature of a heat source to obtain a plurality of temperature values; selecting one of the plurality of setting values based on variations of the temperature values; acquiring a value set from the temperature values based on the sampling number corresponding to the selected setting value, and generating an updated temperature value based on the value set; and controlling rotation of the fan based on the updated temperature value.Type: GrantFiled: January 21, 2022Date of Patent: February 13, 2024Assignee: ASUSTEK COMPUTER INC.Inventors: Hsin-Chen Lin, Ing-Jer Chiou
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Publication number: 20240035486Abstract: The disclosure provides a centrifugal fan including a housing and a blade module. The housing includes a lower cover, a side wall, and an upper cover. Two ends of the side wall are respectively connected to the lower cover and the upper cover to define an internal space. The lower cover includes a plurality of lower air inlets. The blade module is arranged in the internal space, and includes a hub and a plurality of blades. The hub is rotatably arranged on the lower cover. The blades are arranged around the hub. The lower air inlets are located on the periphery of the hub, and each lower air inlet includes an outer edge relative to a rotational axis of the hub. At least one of two ends of at least one of the lower air inlets includes a protruding portion at a position corresponding to the outer edge.Type: ApplicationFiled: March 3, 2023Publication date: February 1, 2024Inventors: Hsin Chen LIN, Ing-Jer CHIOU
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Patent number: 11859627Abstract: A fan control system includes a fan, a first temperature sensor, a calculating unit, a logic controller, and a memory unit. The first temperature sensor continuously senses temperatures of a device during a time period, in order to obtain a plurality of sampled temperatures. The calculating unit selects N1 latest sampled temperatures and N2 latest sampled temperatures from the sampled temperatures, and calculates a first average temperature according to the N1 sampled temperatures and a second average temperature according to the N2 sampled temperatures. N1 and N2 are positive integers. The logic controller is configured to select one of the first average temperature and the second average temperature to output as a compensation temperature. The memory unit is configured to store an operating table, and configured to output a rotational speed control signal to the fan corresponding to the operating table according to the compensation temperature.Type: GrantFiled: October 26, 2020Date of Patent: January 2, 2024Assignee: ASUSTEK COMPUTER INC.Inventors: Hsin-Chen Lin, Ing-Jer Chiou
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Patent number: D1044493Type: GrantFiled: April 20, 2021Date of Patent: October 1, 2024Assignees: HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Eddy Liu, Jun Yan, Chih-Yuan Cheng, Wei-Da Yang, Jun Chen, Er-Wei Chen, Xiao-Ming Lv, Qi Feng, Shu-Fa Jiang, Zhe-Qi Zhao, Hsin-Ta Lin, Han Yang, Jun-Hui Zhang
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Patent number: D1045595Type: GrantFiled: April 20, 2021Date of Patent: October 8, 2024Assignees: HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Eddy Liu, Jun Yan, Chih-Yuan Cheng, Wei-Da Yang, Jun Chen, Er-Wei Chen, Xiao-Ming Lv, Qi Feng, Shu-Fa Jiang, Zhe-Qi Zhao, Hsin-Ta Lin, Han Yang, Jun-Hui Zhang