Abstract: A method for forming semiconductor devices includes providing a substrate with a conductive pad formed thereon; forming a transparent structure over the substrate, wherein the transparent structure includes a plurality of collimating pillars adjacent to the conductive pad; forming a light-shielding structure over the plurality of collimating pillars and the conductive pad; performing a cutting process to remove one or more materials directly above the conductive pad, while leaving remaining material to cover the conductive pad, wherein the material includes a portion of the light-shielding structure; and performing an etching process to remove the remaining material to expose the conductive pad.

Abstract: An organic active-layer solution for a polymer solar cell and a method for preparing the same are provided, wherein the organic active-layer solution comprises an organic active-layer material, a first organic solvent and a second organic solvent. The first organic solvent has a boiling point ranging from 50° C. to 200° C. while the second organic solvent has a boiling point ranging from 150° C. to 300° C. The second organic solvent is added into the first organic solvent to dissolve the organic active-layer material. As the second organic solvent has a higher boiling point (a lower evaporation speed), it can directly lower an evaporation speed of the organic active-layer solution, thereby simplifying a manufacturing process of the polymer solar cell and increasing a power conversion efficiency of the polymer solar cell.