Patents by Inventor Hsin Chen Yang
Hsin Chen Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145381Abstract: In some embodiments, the present disclosure relates an integrated chip including a substrate. A conductive interconnect feature is arranged over the substrate. The conductive interconnect feature has a base feature portion with a base feature width and an upper feature portion with an upper feature width. The upper feature width is narrower than the base feature width such that the conductive interconnect feature has tapered outer feature sidewalls. An interconnect via is arranged over the conductive interconnect feature. The interconnect via has a base via portion with a base via width and an upper via portion with an upper via width. The upper via width is wider than the base via width such that the interconnect via has tapered outer via sidewalls.Type: ApplicationFiled: January 9, 2024Publication date: May 2, 2024Inventors: Shin-Yi Yang, Hsin-Yen Huang, Ming-Han Lee, Shau-Lin Shue, Yu-Chen Chan, Meng-Pei Lu
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Publication number: 20240068124Abstract: An apparatus for producing silicon carbide crystal is provided and includes a composite structure formed by a plurality of graphite layers and silicon carbide seed crystals, wherein a density or thickness of each layer of graphite is gradually adjusted to reduce a difference of a thermal expansion coefficient and Young's modulus between the graphite layers and silicon carbide. The composite structure can be stabilized on a top portion or an upper cover of a crucible made of graphite, thereby preventing the silicon carbide crystal from falling off.Type: ApplicationFiled: August 23, 2023Publication date: February 29, 2024Inventors: CHIH-LUNG LIN, PO-FEI YANG, CHIE-SHENG LIU, CHUNG-HAO LIN, HSIN-CHEN YEH, HAO-WEN WU
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Patent number: 11914106Abstract: A photographing optical lens assembly includes, in order from an object side to an image side along an optical axis, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element has positive refractive power. The second lens element has negative refractive power. The third lens element has an object-side surface being convex in a paraxial region thereof.Type: GrantFiled: September 3, 2020Date of Patent: February 27, 2024Assignee: LARGAN PRECISION CO., LTD.Inventors: Cheng-Chen Lin, Hsin-Hsuan Huang, Shu-Yun Yang
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Patent number: 7850021Abstract: An iron pipe furniture assembly structure employs a pipe connector as a connection construction component for connecting a supporting shaft and a pipe element. The assembly utilizes an elongated round-shaped fastening shaft of the pipe connector for connecting the pipe element. The pipe element is connected to the fastening shaft via an insertion cork of the pipe element. Embedded ribs on the insertion cork engage embedded grooves on the fastening shaft to secure the pipe element to the pipe connector. A tool engages a groove in the pipe element to rotate the pipe element to cause the embedded ribs to engage and disengage with the embedded grooves.Type: GrantFiled: February 5, 2008Date of Patent: December 14, 2010Inventors: Cheng-En Yang, Hsin Chen Yang
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Publication number: 20090194991Abstract: This invention provides an iron pipe furniture assembly structure principally using the pipe connector as the connection construction component of the supporting shaft and the pipe element, and utilizing the elongated round-shaped fastening shaft of the pipe connector at the insertion center for connection with the pipe element and coupled with the diamond round-shaped insertion hole of the insertion cork of the pipe element end portion and the long diameter direction slot of the insertion hole to give sufficient room for movement, and further supplemented with the indent groove on the lateral side near the end portion of the pipe element for the tool to operate and spiral turn the pipe element, thereby the assembly operation of the pipe element and the pipe connector can be easily and speedily accomplished with certain simple insertions and spiral turning operations.Type: ApplicationFiled: February 5, 2008Publication date: August 6, 2009Inventors: Cheng-En Yang, Hsin-Chen Yang
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Patent number: 7242083Abstract: A packaging substrate is formed of an array of packaging units. Each packaging unit has a chip pad carrying a chip, a plurality of pins arranged around the chip pad and spaced from one another and the chip pad by an open space, an insulative member formed of a plurality of insulative member layers and filled up the open space, and a set of electrical elements, which includes a plurality of plated through holes cut through the insulative member layers, first lead wires embedded in the insulative member to electrically connect the plated through holes to one another, and second lead wires that connect the plated through holes to a respective adjacent pin.Type: GrantFiled: April 20, 2005Date of Patent: July 10, 2007Assignee: Lingsen Precision Industries Ltd.Inventor: Hsin-Chen Yang
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Patent number: 7154169Abstract: A packaging substrate is formed of an array of packaging units. Each packaging unit includes a chip pad on which a chip is carried, a plurality of pins arranged around the chip pad and spaced from one another and the chip pad by an open space, an insulative member filling up the open space and forming with the pins and the chip pad a platform, and lead wires located at the insulative member for connecting pins directly or through a passive component.Type: GrantFiled: April 20, 2005Date of Patent: December 26, 2006Assignee: Lingsen Precision Industries, Ltd.Inventor: Hsin-Chen Yang
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Publication number: 20060249819Abstract: A lead frame has contacting pins of different thickness arranged around a die pad and spaced from one another and the die pad to fit the demands of the designed integrated circuit, for enabling the fabricated integrated circuit to have the desired optimum electric characteristics.Type: ApplicationFiled: June 6, 2005Publication date: November 9, 2006Applicant: LINGSEN PRECISION INDUSTRIES, LTD.Inventor: Hsin-Chen Yang
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Publication number: 20060223240Abstract: A method of making an IC substrate includes the steps of: a) preparing a substrate having a front side and a back side and half-etching the substrate to form a filling space in the front side of the substrate subject to a predetermined depth and area, b) putting the substrate thus obtained from step a) in a cavity of a mold and employing a polymer filling and mold pressing procedure to fill up the filling space with an insulative polymer, and c) removing the substrate from the mold and half-etching the back side of the substrate body so as to obtain an IC substrate.Type: ApplicationFiled: April 20, 2005Publication date: October 5, 2006Applicant: Lingsen Precision Industries, Ltd.Inventor: Hsin-Chen Yang
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Publication number: 20060221586Abstract: A packaging substrate includes an array of packaging units. Each packaging unit has a chip pad carrying a chip, a plurality of pins arranged around the chip pad and spaced from one another and the chip pad by an open space, an insulative member filling up the open space, passive components each connected between two pins, a bonding adhesive applied to the pins to which the passive components is connected to affix the connection between the passive components and the respective pins, and a plurality of overflow-preventive grooves respectively provided around the bonding adhesive at each of the pins to which the passive components are connected to prevent overflow of the bonding adhesive.Type: ApplicationFiled: April 29, 2005Publication date: October 5, 2006Applicant: Lingsen Precision Industries, Ltd.Inventor: Hsin-Chen Yang
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Publication number: 20060220200Abstract: A packaging substrate is formed of an array of packaging units. Each packaging unit includes a chip pad on which a chip is carried, a plurality of pins arranged around the chip pad and spaced from one another and the chip pad by an open space, an insulative member filling up the open space and forming with the pins and the chip pad a platform, and lead wires located at the insulative member for connecting pins directly or through a passive component.Type: ApplicationFiled: April 20, 2005Publication date: October 5, 2006Applicant: Lingsen Precision Industries, Ltd.Inventor: Hsin-Chen Yang
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Publication number: 20060220219Abstract: A packaging substrate is formed of an array of packaging units. Each packaging unit has a chip pad carrying a chip, a plurality of pins arranged around the chip pad and spaced from one another and the chip pad by an open space, an insulative member formed of a plurality of insulative member layers and filled up the open space, and a set of electrical elements, which includes a plurality of plated through holes cut through the insulative member layers, first lead wires embedded in the insulative member to electrically connect the plated through holes to one another, and second lead wires that connect the plated through holes to a respective adjacent pin.Type: ApplicationFiled: April 20, 2005Publication date: October 5, 2006Applicant: Lingsen Precision Industries, Ltd.Inventor: Hsin-Chen Yang
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Patent number: 7044312Abstract: A multi-purpose tubular frame structure that is assembled by an interlocking conjoinment and, furthermore, provides for height adjustment. A plurality of retaining holes are formed in the corner posts of the invention herein and each retaining hole is a semi-trapezoidal opening with the sides at the lower half gradually angled inward such that cleat blocks disposed on a horizontal tube can be positionally engaged therein.Type: GrantFiled: June 16, 2003Date of Patent: May 16, 2006Inventor: Hsin-Chen Yang
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Publication number: 20040251226Abstract: A multi-purpose tubular frame structure that is assembled by an interlocking conjoinment and, furthermore, provides for height adjustment. A plurality of retaining holes are formed in the corner posts of the invention herein and each retaining hole is a semi-trapezoidal opening with the sides at the lower half gradually angled inward such that cleat blocks disposed on a horizontal tube can be positionally engaged therein.Type: ApplicationFiled: June 16, 2003Publication date: December 16, 2004Inventor: Hsin-Chen Yang
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Patent number: 6402420Abstract: The present invention is directed toward a connector for knockdown furniture. The connector includes a hollow connecting block having an aperture at both ends of the connecting block. The aperture at the front end is for riveting a rod. The connecting block further includes a hole on both lateral sides. A pressing bracket is inside the connecting block, and has a diminishing opening at its front end. The front edge is pivoted outward to form a suppressing surface having a plurality of serrations and having a hole at the rear end. A locking member has an eccentric axle that passes through the aperture on the connecting block and the hole on the pressing bracket and rivets the front end of the pressing bracket to the connecting block. A rod is pivoted in the front end of the connecting block and is deposed at the back end of the diminishing opening of the pressing bracket.Type: GrantFiled: July 5, 2000Date of Patent: June 11, 2002Inventor: Hsin Chen Yang
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Patent number: 6253933Abstract: A rack with adjustable shelving may be assembled and disassembled through the engagement of plural locating pieces along the length of support rods and the securing of each locating piece to the rod by a holding piece which also has at least one retaining seat for engagement by a retaining piece carried on a corner of a rectangular shelf.Type: GrantFiled: October 13, 1999Date of Patent: July 3, 2001Inventor: Hsin Chen Yang
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Patent number: 6119881Abstract: A rack is formed of four upright support units and a plurality of horizontal support frames. Each of the horizontal support frames is provided at four corners thereof with a fastening plate which is provided with a threaded hole engageable with a fastening bolt. The horizontal support frames are fastened with the upright support units by a plurality of fastening blocks which are provided with a threaded hole engageable with the fastening bolt, and a retaining portion for retaining an upright bar of the upright support units.Type: GrantFiled: July 28, 1998Date of Patent: September 19, 2000Inventor: Hsin Chen Yang
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Patent number: 6044988Abstract: A modular rack comprises a plurality of upright support rods and shelves which are supported on various levels of the upright support rods in conjunction with a plurality of locating pieces, sleeves, and retaining pieces. The sleeves are fastened with the upright support rods in conjunction with the locating pieces and are provided with a retaining seat. The retaining pieces are fastened with four comers of the shelves. The shelves are releasably retained at various levels of the upright support rods such that the retaining pieces of the shelves are releasably retained by the retaining seats of the sleeves.Type: GrantFiled: May 4, 1999Date of Patent: April 4, 2000Inventor: Hsin-Chen Yang