Abstract: A biological particle enrichment apparatus and a pico-droplet generator thereof are provided. The pico-droplet generator includes a container, a hollow needle connected to the container, a first piezoelectric member disposed on the container, and a second piezoelectric member disposed on the hollow needle. The container can receive a liquid specimen having biological particles. The hollow needle and the container are fluid communicated with each other, and an inner diameter of the container is within a range from 5 times to 30 times of an inner diameter of the hollow needle. The first piezoelectric member is annularly disposed on a surrounding lateral side of the container, and enables the biological particles in the container to move along a direction away from the surrounding lateral side by vibrating the container. The second piezoelectric member can squeeze the hollow needle, so that the liquid specimen flows outwardly to form a pico-droplet.

Abstract: A biological particle analysis method is provided and includes the following steps: fluorescence staining a liquid specimen through a fluorescence staining process so as to enable a target biological particle in the liquid specimen to becomes a fluorescence; accommodating the liquid specimen into a pico-droplet generator and using a camera device to take a real-time image of the liquid specimen; using the pico-droplet generator to output a target pico-droplet having the target biological particle onto a biochip according to the real-time image; removing the fluorescent color of the target biological particle in the target pico-droplet through a washing process; and fluorescence staining the target biological particle captured by the biochip at multiple times through the fluorescence staining process and the washing process, so as to obtain a plurality of fluorescence images respectively corresponding to multiple kinds of biological characterization expressions.

Abstract: This disclosure relates to a combined power module that includes a base structure, a terminal structure, a second terminal, and a cover. The terminal structure includes a mount assembly and a plurality of first terminals. The mount assembly is assembled on the base structure. The first terminals are disposed on the mount assembly. The second terminal is disposed on the base structure. The cover is disposed on the base structure and covers at least part of the first terminals and at least part of the second terminal.

Abstract: A light-emitting device, including a first type semiconductor layer, a patterned insulating layer, a light-emitting layer, and a second type semiconductor layer, is provided. The patterned insulating layer covers the first type semiconductor layer and has a plurality of insulating openings. The insulating openings are separated from each other. The light-emitting layer is located in the plurality of insulating openings and covers a portion of the first type semiconductor layer. The second type semiconductor layer is located on the light-emitting layer.

Abstract: A backlit-module-embedded illuminated keyswitch structure includes a baseplate, a mask film disposed below the baseplate and having a first coating configured to substantially reflect a light, a light guide sheet disposed at one side of the mask film and having a light source hole, a reflective layer disposed at one side of the light guide sheet opposite to the mask film and having an opening communicating with the light source hole, a top glue configured to connect the mask film and the light guide sheet around the light source hole, and a bottom glue configured to connect the light guide sheet and the reflective layer around the light source hole. The first coating covers the light source hole. In a stacked direction of the mask film, the light guide sheet, and the reflective layer, at least one of the top glue and the bottom glue overlaps the first coating.

Abstract: A backlight module configured to illuminate at least one key cap of a lighting keyboard. The backlight module comprises a lighting board, a light emitting unit and a light guide plate. The lighting board has a first reflective layer, a lighting circuit and two aligned micro-structure regions, all three at least partially being layered in parallel with each other. The two micro-structure regions reflect lights and are separated by the lighting circuit. The light emitting unit includes plural color dies connecting electrically with the lighting circuit. The light guide plate has a light guide hole for accommodating the light emitting unit. The color dies of the light emitting unit are aligned linearly, while the two micro-structure regions of the lighting board are aligned in perpendicular to the linearly-aligned color dies, with the micro-structure regions disposed at opposite sides the light emitting unit.

Abstract: An image sensor device includes a semiconductor substrate, a radiation sensing member, a shallow trench isolation, and a color filter layer. The radiation sensing member is in the semiconductor substrate. An interface between the radiation sensing member and the semiconductor substrate includes a direct band gap material. The shallow trench isolation is in the semiconductor substrate and surrounds the radiation sensing member. The color filter layer covers the radiation sensing member.

Abstract: A method includes forming a test pattern and a reference pattern in an absorption layer of a photomask structure. The test pattern has a first trench and a second trench, the reference pattern has a third trench and a fourth trench, the test pattern and the reference pattern have substantially the same dimension in a top view, and the second trench is deeper than the first trench, the third trench, and the fourth trench. The method further includes emitting a light beam to the test pattern to obtain a first interference pattern reflected from the test pattern, emitting the light beam to the reference pattern to obtain a second interference pattern reflected from the reference pattern; and comparing the first interference pattern with the second interference pattern to obtain a measured complex refractive index of the absorption layer.

Abstract: A lens adjusting mechanism including a base, a first fastening component, a first bracket, a second fastening component, a second bracket, and a lens is provided. The first fastening component is movably connected to the base along a first straight direction. The first bracket is movably connected to the base along the first straight direction through the first fastening component. The second fastening component is connected to the first bracket. The second bracket is movably connected to the first bracket along a second straight direction through the second fastening component, wherein the first straight direction is different from the second straight direction. The lens is disposed on the second bracket.

Abstract: A lens adjusting mechanism including a base, a first fastening component, a first bracket, a second fastening component, a second bracket, and a lens is provided. The first fastening component is movably connected to the base along a first straight direction. The first bracket is movably connected to the base along the first straight direction through the first fastening component. The second fastening component is connected to the first bracket. The second bracket is movably connected to the first bracket along a second straight direction through the second fastening component, wherein the first straight direction is different from the second straight direction. The lens is disposed on the second bracket.

Abstract: This invention is a method for cleaning a semiconductor manufacturing system, which passes a highly volatile liquid agent through the system to remove the impurities and to dissolve chemicals used in the system. The cleaning agent dissolves and washes the chemicals out of the system to keep the chemicals from combining with moisture in the air and forming oxide particles. By washing with a liquid, residual gases and impurities in the system are rapidly removed from the system. After washing the system, the cleaning agent is quickly dried because the cleaning agent is highly volatile. Thereby, the system is cleaned efficiently within a short time by using this method.