Patents by Inventor Hsin-Chi Hu

Hsin-Chi Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing circuit board
    Patent number: 11419222
    Abstract: A method of manufacturing a circuit board includes: providing a substrate including a bottom layer and a resin layer over the bottom layer, the resin layer including a first surface in contact with the bottom layer and a second surface opposite to the first surface; forming a plurality of vias through the resin layer; depositing a first metal layer in the vias, the first metal layer filling a portion of each of the vias; depositing a second metal layer over the first metal layer and in the vias; forming a patterned metal layer over the second metal layer and extending from each of the vias to a position over the second surface; separating the bottom layer and the resin layer; and removing a portion of the resin layer from the first surface, so that the first metal layer protrudes from the resin layer.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: August 16, 2022
    Assignee: Unimicron Technology Corp.
    Inventor: Hsin-Chi Hu
  • METHOD OF MANUFACTURING CIRCUIT BOARD
    Publication number: 20200178400
    Abstract: A method of manufacturing a circuit board includes: providing a substrate including a bottom layer and a resin layer over the bottom layer, the resin layer including a first surface in contact with the bottom layer and a second surface opposite to the first surface; forming a plurality of vias through the resin layer; depositing a first metal layer in the vias, the first metal layer filling a portion of each of the vias; depositing a second metal layer over the first metal layer and in the vias; forming a patterned metal layer over the second metal layer and extending from each of the vias to a position over the second surface; separating the bottom layer and the resin layer; and removing a portion of the resin layer from the first surface, so that the first metal layer protrudes from the resin layer.
    Type: Application
    Filed: February 6, 2020
    Publication date: June 4, 2020
    Inventor: Hsin-Chi HU
  • Method of manufacturing circuit board
    Patent number: 10602621
    Abstract: A method of manufacturing a circuit board includes: providing a substrate including a bottom layer and a resin layer over the bottom layer, the resin layer including a first surface in contact with the bottom layer and a second surface opposite to the first surface; forming a plurality of vias through the resin layer; depositing a first metal layer in the vias, the first metal layer filling a portion of each of the vias; depositing a second metal layer over the first metal layer and in the vias; forming a patterned metal layer over the second metal layer and extending from each of the vias to a position over the second surface; separating the bottom layer and the resin layer; and removing a portion of the resin layer from the first surface, so that the first metal layer protrudes from the resin layer.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: March 24, 2020
    Assignee: UNIMICRON TECHNOLOGY CORP.
    Inventor: Hsin-Chi Hu