Patents by Inventor Hsin-Chien Chao

Hsin-Chien Chao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100244081
    Abstract: The lighting device mainly contains a first material, a second material, at a light generation chip, and multiple metallic leads. The metallic leads are sandwiched between the first and second materials, and arranged in a radial manner around the indentation or the raised stand. The center of the first material has an obconical through channel and the center of the second material has either an indentation or a raised stand. The light generation chips are positioned in the center of the second material. High thermal conducting insulation paste is provided between the first material, the metallic leads, and the second material so that they are electrical insulated from each other. The present invention could achieve versatile color combinations and high brightness under superior heat dissipation effect, and could be applied in various types of packaging and welding.
    Type: Application
    Filed: March 25, 2009
    Publication date: September 30, 2010
    Inventor: HSIN-CHIEN CHAO
  • Patent number: 7791099
    Abstract: The lighting device mainly contains a first material, a second material, at a light generation chip, and multiple metallic leads. The metallic leads are sandwiched between the first and second materials, and arranged in a radial manner around the indentation or the raised stand. The center of the first material has an obconical through channel and the center of the second material has either an indentation or a raised stand. The light generation chips are positioned in the center of the second material. High thermal conducting insulation paste is provided between the first material, the metallic leads, and the second material so that they are electrical insulated from each other. The present invention could achieve versatile color combinations and high brightness under superior heat dissipation effect, and could be applied in various types of packaging and welding.
    Type: Grant
    Filed: March 25, 2009
    Date of Patent: September 7, 2010
    Assignee: Hsin-Sun Engineering Co., Ltd.
    Inventor: Hsin-Chien Chao