Abstract: A device includes: a complementary transistor including: a first transistor having a first source/drain region and a second source/drain region; and a second transistor stacked on the first transistor, and having a third source/drain region and a fourth source/drain region, the third source/drain region overlapping the first source/drain region, the fourth source/drain region overlapping the second source/drain region. The device further includes: a first source/drain contact electrically coupled to the third source/drain region; a second source/drain contact electrically coupled to the second source/drain region; a gate isolation structure adjacent the first and second transistors; and an interconnect structure electrically coupled to the first source/drain contact and the second source/drain contact.

Abstract: An assortment planning method, an assortment planning system and a processing apparatus thereof for a smart store are provided. The assortment planning system includes at least one tracking apparatus, a plurality of detecting apparatuses, and a processing apparatus. The tracking apparatus is used to identify a plurality of consumer tracks. The detecting apparatuses are used to detect a plurality of consumer interactive behaviors of a plurality of products. The processing apparatus includes a binding device, an intention analyzing device and an estimating device. The binding device is used to bind the consumer interactive behaviors with the consumer tracks to obtain a number of interactive behavior time sequence records. The intention analyzing device is used to obtain a plurality of consumption intentions for the products according to the interactive behavior time sequence records. The estimating device is used to estimate a best product combination according to the consumption intentions.

Abstract: An intelligent storage device and an intelligent storage method are provided. The intelligent storage device includes a storage space, an infrared sensor, a weight sensor, a transceiver, and a processor. The storage space is suitable for storing an object. The infrared sensor senses the storage space to generate infrared sensing data. The weight sensor senses the object in the storage space to generate weight sensing data. The processor is coupled to the infrared sensor, the weight sensor, and the transceiver, determines whether the object is placed in or removed from the storage space according to the infrared sensing data and the weight sensing data to generate an event record, and transmits the event record via the transceiver.

Abstract: An intelligent store system and an intelligent store method are provided. The method includes: sensing, by a proximity sensor, whether there is a first customer approaching the proximity sensor; sensing, by an image sensor, a movement trajectory of the first customer; and determining whether the first customer is entering or leaving a store in response to the first customer approaching the proximity sensor sensed by the proximity sensor. If the first customer is entering the store, a first virtual identity and a first virtual shopping cart corresponding to the first virtual identity are generated for the first customer, and a first product list of the first virtual shopping cart is updated according to the movement trajectory. If the first customer is leaving the store, a first operation of the first customer is received by a human machine interface, and the first product list according to the first operation is updated.

Abstract: Provided is a method for cancer treatment in a patient comprising extracorporeal dialysis of blood, plasma or peritoneal fluid of the patient with a dialysis system for removing a target amino acid, and the dialysis system comprising: a dialysis machine, a dialyzer having a dialysis membrane, and a dialysate; wherein the dialyzer is connected to the dialysis machine and the dialysate flows within the dialysis machine and the dialyzer; and an enzyme for degrading the target amino acid is provided to the dialysis membrane and/or the dialysate, and the target amino acid includes asparagine, glutamine, arginine, serine, methionine or any combination thereof. By modifying dialysis to achieve in vitro amino acid deprivation and incorporating personalized diagnosis, the present invention not only provides a novel precision medicine with better anticancer efficacy and less side effects, but also requires less time and cost for development.

Abstract: An intelligent store system and an intelligent store method are provided. The method includes: sensing, by a proximity sensor, whether there is a first customer approaching the proximity sensor; sensing, by an image sensor, a movement trajectory of the first customer; and determining whether the first customer is entering or leaving a store in response to the first customer approaching the proximity sensor sensed by the proximity sensor. If the first customer is entering the store, a first virtual identity and a first virtual shopping cart corresponding to the first virtual identity are generated for the first customer, and a first product list of the first virtual shopping cart is updated according to the movement trajectory. If the first customer is leaving the store, a first operation of the first customer is received by a human machine interface, and the first product list according to the first operation is updated.

Abstract: An intelligent storage device and an intelligent storage method are provided. The intelligent storage device includes a storage space, an infrared sensor, a weight sensor, a transceiver, and a processor. The storage space is suitable for storing an object. The infrared sensor senses the storage space to generate infrared sensing data. The weight sensor senses the object in the storage space to generate weight sensing data. The processor is coupled to the infrared sensor, the weight sensor, and the transceiver, determines whether the object is placed in or removed from the storage space according to the infrared sensing data and the weight sensing data to generate an event record, and transmits the event record via the transceiver.

Abstract: A method and a device for analyzing data are provided. The method includes following steps. A plurality of queries for an event stored in a database are integrated to obtain a plurality of features. Each feature is limited at a searching condition. A plurality of items of searched data are obtained from the database according to respective searching condition of each feature. Whether a data volume of the searched data is higher or lower than a predetermined range is determined. If the data volume is higher than the predetermined range, the data volume of the searched data is reduced according to the features. If the data volume is lower than the predetermined range, the data volume of the searched data is increased according to the features. A correlation between the features and the event is analyzed according to the searched data.

Abstract: An intelligent planogram producing system and a method thereof are provided. The intelligent planogram producing method includes the following steps: obtaining a relevance between each of a plurality of objects and producing a relevance array; re-weighting the relevance array according to the displacing limitation of each object and producing at least one complete graph; obtaining a representing route of the at least one complete graph; outputting a planogram of the disposing location of each object on a shelf according to the representing route.

Abstract: Provided is a storage method including the following. An object is stored in a storage space. The object is sensed to generate sensing data. An identification model is generated according to the sensing data. In addition, the identification model is uploaded to a server.

Abstract: Provided is a storage method including the following. An object is stored in a storage space. The object is sensed to generate sensing data. An identification model is generated according to the sensing data. In addition, the identification model is uploaded to a server.

Abstract: A data analysis method is provided. The data analysis method includes collecting a user data; generating a number of situation conditions from the user data; calculating a distribution ratio of each of the situation conditions to obtain a first data; calculating a success ratio of information association of an information association algorithm under each of the situation conditions to obtain a second data; obtaining at least one evaluating parameter of the information association algorithm under the situation conditions according to the first data and the second data; and generating a suggestion information relating to the information association algorithm according to the at least one evaluating parameter.

Abstract: A method and a device for analyzing data are provided. The method includes following steps. A plurality of queries for an event stored in a database are integrated to obtain a plurality of features. Each feature is limited at a searching condition. A plurality of items of searched data are obtained from the database according to respective searching condition of each feature. Whether a data volume of the searched data is higher or lower than a predetermined range is determined. If the data volume is higher than the predetermined range, the data volume of the searched data is reduced according to the features. If the data volume is lower than the predetermined range, the data volume of the searched data is increased according to the features. A correlation between the features and the event is analyzed according to the searched data.

Abstract: A method is provided for forming wafer level package that incorporates dual compliant layers and a metal cap layer on top of I/O pads. The wafer level package includes a plurality of metal cap layers formed on top of a plurality of I/O pads to function as stress buffering and avoiding sharp corners in metal traces formed on top of the metal cap layers. A first compliant layer and a second compliant layer are formed under the metal trace to provide the necessary standoff and to accommodate differences in coefficients of thermal expansion of the various materials on an IC die. The wafer level package is particularly suitable for copper devices or in devices wherein copper lines are used.

Abstract: A method is provided for forming wafer level package that incorporates dual compliant layers and a metal cap layer on top of I/O pads. The wafer level package includes a plurality of metal cap layers formed on top of a plurality of I/O pads to function as stress buffering and avoiding sharp corners in metal traces formed on top of the metal cap layers. A first compliant layer and a second compliant layer are formed under the metal trace to provide the necessary standoff and to accommodate differences in coefficients of thermal expansion of the various materials on an IC die. The wafer level package is particularly suitable for copper devices or in devices wherein copper lines are used.

Abstract: The present invention discloses a method for assembling carbon nanotubes and microprobe, which employs the Electrophoresis or Dielectrophoresis principles to drive the carbon nanotubes self-assembling the microprobe under an electric field. The method comprises the steps of: forming at least one microprobe, the microprobe being covered by a conductive layer; exposing the microprobe to a solution having carbon nanotubes spreading therein, the solution being furnished with an electrode; applying a predetermined voltage between the conductive layer and the electrode, making at least one carbon nanotube to move and attach onto the top of the microprobe.

Abstract: A wafer level package that incorporates dual compliant layers and a metal cap layer on top of I/O pads and a method for forming the package. The wafer level package includes a plurality of metal cap layers formed on top of a plurality of I/O pads to function as stress buffering and avoiding sharp corners in metal traces formed on top of the metal cap layers. A first compliant layer and a second compliant layer are formed under the metal trace to provide the necessary standoff and to accommodate differences in coefficients of thermal expansion of the various materials on an IC die. The wafer level package is particularly suitable for copper devices or in devices wherein copper lines are used.

Abstract: A wafer level package that incorporates dual compliant layers and a metal cap layer on top of I/O pads and a method for forming the package. The wafer level package includes a plurality of metal cap layers formed on top of a plurality of I/O pads to function as stress buffering and avoiding sharp corners in metal traces formed on top of the metal cap layers. A first compliant layer and a second compliant layer are formed under the metal trace to provide the necessary standoff and to accommodate differences in coefficients of thermal expansion of the various materials on an IC die. The wafer level package is particularly suitable for copper devices or in devices wherein copper lines are used.

Abstract: A single-step bumping/bonding method for forming a semiconductor package of two electronic substrates electrically connected together by solder bumps. In the method, a first electronic substrate is provided equipped with a first plurality of conductive pads formed in an insulating material layer, the plurality of conductive pads each having an aperture formed therethrough for receiving a solder material when the first electronic substrate is positioned juxtaposed to a second electronic substrate equipped with a second plurality of conductive pads such that solder bumps may be formed bonding the first plurality of conductive pads to the second plurality of conductive pads. One of the two electronic substrates may be a silicon wafer, while the other may be a printed circuit board or a silicon wafer.

Abstract: A wafer level package that incorporates dual stress buffer layers for achieving I/O pad redistribution and a method for forming the package are disclosed. In the package, a first stress buffer layer and a second stress buffer layer are sequentially deposited on top of an IC die by a method such as spin coating, laminating, screen printing or stencil printing of an elastic material which has a Young's modulus of less than 10 MPa. A suitable thickness for the first and the second stress buffer layer is between about 10 &mgr;m and about 70 &mgr;m. Metal traces are formed on top of the first and the second stress buffer layer for connecting a first plurality of I/O pads and a second plurality of I/O pads to achieve I/O redistribution.