Patents by Inventor Hsin-Chih WANG

Hsin-Chih WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11915755
    Abstract: A layout of a semiconductor memory device includes a substrate and a ternary content addressable memory (TCAM). The TCAM is disposed on the substrate and includes a plurality of TCAM bit cells, where at least two of the TCAM bit cells are mirror-symmetrical along an axis of symmetry, and each of the TCAM bit cells includes two storage units electrically connected to two word lines respectively, and a logic circuit electrically connected to the storage units. The logic circuit includes two first reading transistors, and two second reading transistors, where each of the second reading transistors includes a gate and source and drain regions, the source and drain regions of the second reading transistors are electrically connected to two matching lines and the first reading transistors, respectively, where the word lines are disposed parallel to and between the matching lines.
    Type: Grant
    Filed: January 20, 2022
    Date of Patent: February 27, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chun-Yen Tseng, Yu-Tse Kuo, Shu-Ru Wang, Chun-Hsien Huang, Hsin-Chih Yu, Meng-Ping Chuang, Li-Ping Huang, Yu-Fang Chen
  • Publication number: 20230023152
    Abstract: A critical dimension uniformity control method is provided. The method includes gathering a first CDU by a first critical dimension from a first wafer after being processed by a first surface process. The method includes determining a first calibration process based on the first CDU. The determining includes an intra dose correction step for correcting reticle-dependent deviation, a thru-slit dose sensitivity correction step for correcting time-dependent deviation, and an inter dose correction step for correcting process-dependent deviation. The method includes calibrating the first surface process by the first calibration process to determine a second surface process different from the first surface process.
    Type: Application
    Filed: January 4, 2022
    Publication date: January 26, 2023
    Inventors: Hsin-Chih WANG, Yu-Tien SHEN, Yu-Tse LAI, Chih-Kai YANG, Hsiang-Ming CHANG, Chun-Yen CHANG, Ya-Hui CHANG
  • Patent number: 10096541
    Abstract: A substrate structure is provided, which includes: a substrate body having a first surface and a second surface opposite to the first surface; and a plurality of conductive posts disposed on the first surface of the substrate body and electrically connected to the substrate body. By replacing conventional through silicon vias (TSVs) with the conductive posts, the present disclosure greatly reduces the fabrication cost. The present disclosure further provides an electronic package having the substrate structure and a method for fabricating the electronic package.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: October 9, 2018
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Ching-Wen Chiang, Hsin-Chih Wang, Chih-Yuan Shih, Shih-Ching Chen
  • Patent number: 9994790
    Abstract: A method and an apparatus of extracting lipids from microalgae are provided. In the method, pressurized carbon dioxide (CO2) is dissolved in a liquid alcohol to form a CO2-expanded alcohol solution at a pressure of about 400-1500 psi and a temperature of about 30-65° C. Next, the CO2-expanded alcohol solution contacts microalgae to extract the lipids from the microalgae. A method and an apparatus of preparing fatty acid esters from microalgae are disclosed as well.
    Type: Grant
    Filed: April 15, 2015
    Date of Patent: June 12, 2018
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Chung-Sung Tan, Hsin-Chih Wang
  • Publication number: 20170330826
    Abstract: A substrate structure is provided, which includes: a substrate body having a first surface and a second surface opposite to the first surface; and a plurality of conductive posts disposed on the first surface of the substrate body and electrically connected to the substrate body. By replacing conventional through silicon vias (TSVs) with the conductive posts, the present disclosure greatly reduces the fabrication cost. The present disclosure further provides an electronic package having the substrate structure and a method for fabricating the electronic package.
    Type: Application
    Filed: August 1, 2017
    Publication date: November 16, 2017
    Inventors: Ching-Wen Chiang, Hsin-Chih Wang, Chih-Yuan Shih, Shih-Ching Chen
  • Patent number: 9754868
    Abstract: A substrate structure is provided, which includes: a substrate body having a first surface and a second surface opposite to the first surface; and a plurality of conductive posts disposed on the first surface of the substrate body and electrically connected to the substrate body. By replacing conventional through silicon vias (TSVs) with the conductive posts, the present disclosure greatly reduces the fabrication cost. The present disclosure further provides an electronic package having the substrate structure and a method for fabricating the electronic package.
    Type: Grant
    Filed: March 14, 2016
    Date of Patent: September 5, 2017
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Ching-Wen Chiang, Hsin-Chih Wang, Chih-Yuan Shih, Shih-Ching Chen
  • Publication number: 20170194238
    Abstract: A substrate structure is provided, which includes: a substrate body having a first surface and a second surface opposite to the first surface; and a plurality of conductive posts disposed on the first surface of the substrate body and electrically connected to the substrate body. By replacing conventional through silicon vias (TSVs) with the conductive posts, the present disclosure greatly reduces the fabrication cost. The present disclosure further provides an electronic package having the substrate structure and a method for fabricating the electronic package.
    Type: Application
    Filed: March 14, 2016
    Publication date: July 6, 2017
    Inventors: Ching-Wen Chiang, Hsin-Chih Wang, Chih-Yuan Shih, Shih-Ching Chen
  • Publication number: 20150322373
    Abstract: A method and an apparatus of extracting lipids from microalgae are provided. In the method, pressurized carbon dioxide (CO2) is dissolved in a liquid alcohol to form a CO2-expanded alcohol solution at a pressure of about 400-1500 psi and a temperature of about 30-65° C. Next, the CO2-expanded alcohol solution contacts microalgae to extract the lipids from the microalgae. A method and an apparatus of preparing fatty acid esters from microalgae are disclosed as well.
    Type: Application
    Filed: April 15, 2015
    Publication date: November 12, 2015
    Inventors: Chung-Sung TAN, Hsin-Chih WANG