Abstract: In some embodiments, the present disclosure relates to an integrated chip. The integrated chip may comprise a first metal line disposed over a substrate. A via may be disposed directly over a top of the first metal line and the via may comprise a first lower surface and a second lower surface above the first lower surface. A first dielectric structure may be disposed laterally adjacent to the first metal line and may be disposed along a sidewall of the first metal line. A first protective etch-stop structure may be disposed directly over a top of the first dielectric structure and the first protective etch-stop structure may vertically separate the second lower surface of the via from the top of the first dielectric structure.

Abstract: Examples of an integrated circuit with an interconnect structure and a method for forming the integrated circuit are provided herein. In some examples, the method includes receiving a workpiece that includes a substrate and an interconnect structure. The interconnect structure includes a first conductive feature disposed within a first inter-level dielectric layer. A blocking layer is selectively formed on the first conductive feature without forming the blocking layer on the first inter-level dielectric layer. An alignment feature is selectively formed on the first inter-level dielectric layer without forming the alignment feature on the blocking layer. The blocking layer is removed from the first conductive feature, and a second inter-level dielectric layer is formed on the alignment feature and on the first conductive feature. The second inter-level dielectric layer is patterned to define a recess for a second conductive feature, and the second conductive feature is formed within the recess.

Abstract: An interconnect structure includes a dielectric layer, a first conductive feature, a hard mask layer, a conductive layer, and a capping layer. The first conductive feature is disposed in the dielectric layer. The hard mask layer is disposed on the first conductive feature. The conductive layer includes a first portion and a second portion, the first portion of the conductive layer is disposed over at least a first portion of the hard mask layer, and the second portion of the conductive layer is disposed over the dielectric layer. The hard mask layer and the conductive layer are formed by different materials. The capping layer is disposed on the dielectric layer and the conductive layer.

Abstract: A method for manufacturing a semiconductor structure includes preparing a dielectric structure formed with trenches respectively defined by lateral surfaces of the dielectric structure, forming spacer layers on the lateral surfaces, filling an electrically conductive material into the trenches to form electrically conductive features, selectively depositing a blocking layer on the dielectric structure, selectively depositing a dielectric material on the electrically conductive features to form a capping layer, removing the blocking layer and the dielectric structure to form recesses, forming sacrificial features in the recesses, forming a sustaining layer to cover the sacrificial features; and removing the sacrificial features to obtain the semiconductor structure formed with air gaps confined by the sustaining layer and the spacer layers.

Abstract: An ultraviolet C (UVC) unit, comprises a Light Emitting Diode (LED) module containing a series of UVC LEDs that provide UVC emission, a lens that linearly focuses the UVC emission of the LED module and a controllable baffle that directs UVC light that passes from the LED module through the lens. The UVC light emitted from the LED module is directed toward the lens for linearly focusing the emission of the LED module in order to propagate the light throughout a top portion of a room in which the UVC unit is positioned, when the baffle is in a first position, and wherein the light is propagated downward from the UVC unit when the baffle is in a second position.

Abstract: The present random access PCR reactor for biological analysis, comprises of a number of PCR reactors held on a platform, and one optical system to be shared by all of the PCR reactors on the platform. The optical system is held on a traverse mechanism to move it over any one of the PCR reactors that are ready to be imaged. Other PCR reactors on the platform can be accesses and replaced. The optical system has a lightpipe and a lightguide that distributes a uniform light over all the samples held on the reactor. The lightguide of the present optical system has a set of light reflecting structures that are strategically located to uniformly reflect an incoming light towards all the samples held in the PCR reactor that is being tested.

Abstract: A spherical camera is disclosed. The camera includes an imaging unit. A base of the camera includes a track. A spherical housing includes a first housing part for containing the imaging unit. A second housing part includes a dove tail shaped to be slidably received within the track of the base. A loop is positionable around a periphery surface of the base, the loop being tightenable from a first position wherein the spherical housing is tiltable along the track to a second position wherein the spherical housing is locked in position.

Abstract: A spherical camera is disclosed. The camera includes an imaging unit. A base of the camera includes a track. A spherical housing includes a first housing part for containing the imaging unit. A second housing part includes a dove tail shaped to be slidably received within the track of the base. A loop is positionable around a periphery surface of the base, the loop being tightenable from a first position wherein the spherical housing is tiltable along the track to a second position wherein the spherical housing is locked in position.

Abstract: A proximity sensor for an electronic device comprises a proximity module, a lens and an optical module secured in an air gap therebetween. The proximity module has an emitter and a detector and is configured to generate a signal that is a function of light emitted by the emitter, and light detected by the detector, some portion of the detected light having been reflected by a target external to the electronic device. A transmissive-reflective surface of the optical module is aligned with the emitter field of view (FOV) and the detector FOV. The optical module guides emitted light through a transmissive portion of the lens to the exterior of the electronic device, and guides target-reflected light collected by the transmissive portion to the detector. The emitter FOV and the detector FOV are substantially aligned with one another.

Abstract: A backlight module for illuminating a display or keypad is described. The backlight module may be provided in an electronic device along with a light source. In one embodiment, the backlight module comprises: a light diffuser; a light guide located directly below the light diffuser; a prism structure located directly below the light guide, the prism structure having a plurality of prisms extending towards the light guide, wherein an air gap is defined between the prism structure and the light guide; and a reflector located directly below the prism structure.

Abstract: A keypad with optical sensors is provided. The keypad comprises keycaps, each keycap having a top surface. One or more optical sensors are located beneath top surfaces of adjacent keycaps. One or more light guides extend from a respective optical sensor towards the top surfaces.

Abstract: A light assembly for providing a notification light on an electronic device is described. The light assembly comprises a first light source for providing a background portion for the notification light, a second light source for providing a patterned portion for the notification light, and at least one pattern element to generate the pattern portion.

Abstract: A backlight module for illuminating a display or keypad is described. The backlight module may be provided in an electronic device along with a light source. In one embodiment, the backlight module comprises: a light diffuser; a light guide located directly below the light diffuser; a prism structure located directly below the light guide, the prism structure having a plurality of prisms extending towards the light guide, wherein an air gap is defined between the prism structure and the light guide; and a reflector located directly below the prism structure.

Abstract: A proximity sensor for an electronic device comprises a proximity module, a lens and an optical module secured in an air gap therebetween. The proximity module has an emitter and a detector and is configured to generate a signal that is a function of light emitted by the emitter, and light detected by the detector, some portion of the detected light having been reflected by a target external to the electronic device. A transmissive-reflective surface of the optical module is aligned with the emitter field of view (FOV) and the detector FOV. The optical module guides emitted light through a transmissive portion of the lens to the exterior of the electronic device, and guides target-reflected light collected by the transmissive portion to the detector. The emitter FOV and the detector FOV are substantially aligned with one another.

Abstract: A keypad with optical sensors is provided. The keypad comprises keycaps, each keycap having a top surface. One or more optical sensors are located beneath top surfaces of adjacent keycaps. One or more light guides extend from a respective optical sensor towards the top surfaces.

Abstract: A backlight module for illuminating a display is described. The backlight module may be provided in an electronic device along with a light source for illuminating an LCD display. The backlight module includes a diffuser, a light guide having a top surface and a bottom surface, a reflector, and a prism structure positioned between the light guide bottom surface and the reflector. The prism structure has a plurality of prisms extending towards the light guide. The prism structure may include a film or a top portion of the reflector having a plurality of prisms extending towards the light guide.

Abstract: It is proposed herein to add a layer to the proximity detector lens of a smart phone. The layer, with beneficial qualities such as high transparency and high refractive index, may be seen to improve proximity sensor performance in the presence of matter deposited on an anti-fingerprint coating of the proximity detector lens.

Abstract: A keypad with optical sensors is provided. The keypad comprises keycaps, each keycap having a top surface. One or more optical sensors are located beneath top surfaces of adjacent keycaps. One or more light guides extend from a respective optical sensor towards the top surfaces.

Abstract: A light guide guides light from a light emitter that is adjacent to an aperture of an electronic device. The light is eventually emitted from the aperture, to thereby provide lighting. The light guide can include a plurality of prisms which can thereby permit reduction in the overall thickness of the electronic device.

Abstract: Electronic displays encounter visibility issues due to varying ambient light conditions. An ambient light sensor can be provided to sense ambient light and dynamically adjust display brightness to compensate for changes in ambient light. A wave guide for improving angular response in a light sensor is provided.