Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.

Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.

Abstract: A first and second patterned circuit layer are formed on a first surface and a second surface of a base material. A first adhesive layer is formed on the first patterned circuit layer. A portion of the first surface is exposed by the first patterned circuit layer. The metal reflection layer covers the first insulation layer and a reflectance thereof is greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer, and the first adhesive layer is disposed between the first patterned circuit layer and the first insulation layer. A transparent adhesive layer and a protection layer are formed on the metal reflection layer. The transparent adhesive layer is disposed between the metal reflection layer and the protection layer. The protection layer comprises a transparent polymer. The light transmittance is greater than or equal to 80%.

Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.

Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.

Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.

Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.

Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.

Abstract: A substrate structure with high reflectance includes a base material, a patterned circuit layer, an insulating layer and a metal reflecting layer. The base material includes a first surface and a second surface opposite to the first surface. The patterned circuit layer is disposed on the first surface. The insulating layer covers the patterned circuit layer and a part of the first surface exposed by the patterned circuit layer. The metal reflecting layer covers the insulating layer, and a reflectance of the metal reflecting layer is substantially greater than or equal to 85%. A manufacturing method of a substrate structure with high reflectance is also provided.

Abstract: A method for automatically inspecting positive and negative polar directions of a polar element on a substrate is provided. Firstly, an image of a standard substrate is retrieved to form a standard sample, and relevant data of the polar elements on a substrate to be inspected is obtained to form the inspected sample. Then, transforming the geometry coordinates to the pixel coordinates, using different shapes of frames to make each polar element be positioned within, and marking the positions, positive and negative polar directions of all the polar elements in the image of the standard substrate. A database is set up to record the relevant data of each polar element as the standard sample for inspecting. The standard sample is compared with all the samples to be inspected to inspect whether the polar directions of each polar element is correct or not.

Abstract: A circuit board detecting device and a detecting method are provided. The circuit board detecting device includes an image capture apparatus and a main unit. The image capture apparatus is coupled to the main unit to capture images of the surfaces of a sample circuit board and a test circuit board. In addition, the main unit is used to receive a sample frame and a test frame and compare the images of every object on the sample frame with the images of every object on the test frame to confirm if the test circuit board has flaws on the surface.

Abstract: A method for finding a specific pattern is used to find a specific pattern in an image to be tested. The method comprises the following steps of: acquiring an image to be tested; performing a binary thresholding process on the image to be tested, thereby transforming the image to be tested into a binary image; performing a mosaic process on the binary image, thereby transforming the binary image into a mosaic image; utilizing a correlation coefficient method to find the specific pattern most similar to an image template from the mosaic image, wherein the image template is a desired mosaic pattern of the specific pattern; and transforming the mosaic image back into the binary image so as to find the coordinate of the specific pattern accurately.

Abstract: A method for automatically inspecting positive and negative polar directions of a polar element on a substrate is provided. Firstly, an image of a standard substrate is retrieved to form a standard sample, and relevant data of the polar elements on a substrate to be inspected is obtained to form the inspected sample. Then, transforming the geometry coordinates to the pixel coordinates, using different shapes of frames to make each polar element be positioned within, and marking the positions, positive and negative polar directions of all the polar elements in the image of the standard substrate. A database is set up to record the relevant data of each polar element as the standard sample for inspecting. The standard sample is compared with all the samples to be inspected to inspect whether the polar directions of each polar element is correct or not.