Abstract: A first and second patterned circuit layer are formed on a first surface and a second surface of a base material. A first adhesive layer is formed on the first patterned circuit layer. A portion of the first surface is exposed by the first patterned circuit layer. The metal reflection layer covers the first insulation layer and a reflectance thereof is greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer, and the first adhesive layer is disposed between the first patterned circuit layer and the first insulation layer. A transparent adhesive layer and a protection layer are formed on the metal reflection layer. The transparent adhesive layer is disposed between the metal reflection layer and the protection layer. The protection layer comprises a transparent polymer. The light transmittance is greater than or equal to 80%.

Abstract: An interconnect structure comprises a first dielectric layer, a first metal layer, a second dielectric layer, a metal via, and a second metal layer. The first dielectric layer is over a substrate. The first metal layer is over the first dielectric layer. The first metal layer comprises a first portion and a second portion spaced apart from the first portion. The second dielectric layer is over the first metal layer. The metal via has an upper portion in the second dielectric layer, a middle portion between the first and second portions of the first metal layer, and a lower portion in the first dielectric layer. The second metal layer is over the metal via. From a top view the second metal layer comprises a metal line having longitudinal sides respectively set back from opposite sides of the first portion of the first metal layer.

Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.

Abstract: An array type light-emitting device with high color rendering index includes: a substrate, an array type light-emitting module, a plurality of wavelength-converting layers, and a plurality of transparent layers. The array type light-emitting module is composed of a plurality of light-emitting chip rows, and each light-emitting chip row has a plurality of first light-emitting chips and at least one second light-emitting chip. The wavelength-converting layers are respectively covered on the first light-emitting chips. Therefore, a part of visible light emitted by the first light-emitting chips is absorbed and converted into visible light with another emission peak wavelength range via the wavelength-converting layers, and the visible light with another emission peak wavelength range mixes with projecting light projected from the second light-emitting chips to make the array type light-emitting device generate mixed white light with a color rendering index of between 90 and 95.

Abstract: An array type light-emitting module includes a blue, a red, a green, a yellow and an amber light-emitting chip sets. Wavelength-converting layer set covers the blue light-emitting chip set. Transparent layer sets cover the red, green, yellow, and amber light-emitting chip sets. A portion of the visible light emitted by the blue light-emitting chip set is converted into visible light with another emission peak wavelength range via the wavelength-converting layer set. The converted visible light mixes with light projected from the red, the green, the yellow and the amber light-emitting chip sets to generate white light with a color rendering index ranging between 90 and 96.

Abstract: An array type light-emitting device includes a substrate, an array type light-emitting module, a wavelength-converting layer set, and a plurality of transparent layer sets. The array type light-emitting module is composed of a blue, a red, a green, a yellow and an amber light-emitting chip sets. The wavelength-converting layer set is covered on the blue light-emitting chip set. The transparent layer sets are respectively covered on the red, the green, the yellow, the amber light-emitting chip sets. Therefore, a part of visible light emitted by the blue light-emitting chip set is absorbed and converted into visible light with another emission peak wavelength range via the wavelength-converting layer set, and the visible light mixes with projecting light projected from the red, the green, the yellow and the amber light-emitting chip sets to make the array type light-emitting device generate white light with a color rendering index of between 90 and 96.

Abstract: An array type light-emitting device with high color rendering index includes: a substrate, an array type light-emitting module, a plurality of wavelength-converting layers, and a plurality of transparent layers. The array type light-emitting module is composed of a plurality of light-emitting chip rows, and each light-emitting chip row has a plurality of first light-emitting chips and at least one second light-emitting chip. The wavelength-converting layers are respectively covered on the first light-emitting chips. Therefore, a part of visible light emitted by the first light-emitting chips is absorbed and converted into visible light with another emission peak wavelength range via the wavelength-converting layers, and the visible light with another emission peak wavelength range mixes with projecting light projected from the second light-emitting chips to make the array type light-emitting device generate mixed white light with a color rendering index of between 90 and 95.

Abstract: A ceramic light emitted diode (LED) package has a pair of discrete reflection walls to reflect light emission from the LED. With two opposite reflection walls and two opposite openings around the LED, light emitted from the LED package can be fanned out.