Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A method for manufacturing a semiconductor structure is provided. The method includes: providing a substrate and a dielectric layer on the substrate; forming a hole in the dielectric layer; forming an initial barrier material layer and a conductive layer on an upper surface of the dielectric layer and in the hole; removing part of the initial barrier material layer and part of the conductive layer to form a barrier material layer and a via element in the hole respectively and expose the upper surface of the dielectric layer. An upper surface of the barrier material layer is higher than the upper surface of the dielectric layer.

Abstract: A multi-band network node has selectable backhaul/fronthaul configurations. Network nodes provide multi-band operation to take advantage of higher Internet speeds and to support lower latency (> 2 Gbps, < 4 ms latency) applications. A greater Wi-Fi device count (capacity) is supported by implementing communication over additional bands. Increased bandwidth is made available between connected nodes by selectively combining backhaul throughputs. Hardware quality-of-service (QoS) is provided by splitting traffic flows for low latency and data applications. Network coverage is extended by dynamic assignment of backhaul connections and by configuring unused backhauls as fronthauls.

Abstract: A microstrip antenna is provided. The microstrip antenna includes a first substrate with a first surface and a second surface paralleled to each other, a metal ground plane with an aperture disposed on the first surface and exposing parts of the first substrate via the aperture and a metal feed line disposed on the second surface, the metal feed line has at least two intersections with the aperture on a horizontal projection plane, in order to feed a signal received or transmitted by the microstrip antenna.

Abstract: An antenna structure and a method for increasing an antenna bandwidth are provided. The antenna structure includes a feeding portion, a first resonating element electrically connected to the feeding portion, a protruding portion electrically connected to the feeding portion, and a second resonating element coupled with the protruding portion.

Abstract: An antenna structure and a method for increasing an antenna bandwidth are provided. The antenna structure includes a feeding portion, a first resonating element electrically connected to the feeding portion, a protruding portion electrically connected to the feeding portion, and a second resonating element coupled with the protruding portion.

Abstract: An microstrip antenna is provided. A microstrip antenna includes a first substrate with a first surface and a second surface paralleled to each other, a metal ground plane with an aperture deposed on the first surface and exposed parts of the first substrate via the aperture and a metal feed line deposed on the second surface, the metal feed line has at least two intersections with the aperture on a horizontal projection plane, in order to feed a signal received or transmitted by the microstrip antenna.