Patents by Inventor HSIN-DI WU

HSIN-DI WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip card assembly for electronic device
    Patent number: 10779428
    Abstract: A chip card assembly of an electronic device includes a casing defining an opening, a connector received inside the casing and including a tray, an electromagnet driving assembly including at least one electromagnet and a pushing member, and a control unit configured to control the electromagnet driving assembly to drive the pushing member to push the tray out of the opening. The tray includes a cover for covering the opening.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: September 15, 2020
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Hsin-Di Wu
  • CHIP CARD ASSEMBLY FOR ELECTRONIC DEVICE
    Publication number: 20190082548
    Abstract: A chip card assembly of an electronic device includes a casing defining an opening, a connector received inside the casing and including a tray, an electromagnet driving assembly including at least one electromagnet and a pushing member, and a control unit configured to control the electromagnet driving assembly to drive the pushing member to push the tray out of the opening. The tray includes a cover for covering the opening.
    Type: Application
    Filed: January 11, 2018
    Publication date: March 14, 2019
    Inventor: HSIN-DI WU