Patents by Inventor Hsin Fu Chang

Hsin Fu Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240184354
    Abstract: In example implementations, an apparatus is provided. The apparatus includes an interface, an integrated graphical processing unit (GPU), a discrete GPU, and a controller. The interface is to receive a connection to an external display device. The integrated GPU and the discrete GPU are communicatively coupled to the interface. The controller is communicatively coupled to the integrated GPU and the discrete GPU and is to deactivate the discrete GPU and activate the integrated GPU in response to detection of the external display device connected to the interface.
    Type: Application
    Filed: June 29, 2021
    Publication date: June 6, 2024
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chia-Cheng Lin, Hsin-Jen Lin, Heng-Fu Chang, Chao-Shen Chen
  • Patent number: 11990454
    Abstract: An embodiment is a structure including a first package including a first die, and a molding compound at least laterally encapsulating the first die, a second package bonded to the first package with a first set of conductive connectors, the second package comprising a second die, and an underfill between the first package and the second package and surrounding the first set of conductive connectors, the underfill having a first portion extending up along a sidewall of the second package, the first portion having a first sidewall, the first sidewall having a curved portion and a planar portion.
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: May 21, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsi-Kuei Cheng, Ching Fu Chang, Chih-Kang Han, Hsin-Chieh Huang
  • Patent number: 11984342
    Abstract: A method includes forming a first polymer layer to cover a metal pad of a wafer, and patterning the first polymer layer to form a first opening. A first sidewall of the first polymer layer exposed to the first opening has a first tilt angle where the first sidewall is in contact with the metal pad. The method further includes forming a metal pillar in the first opening, sawing the wafer to generate a device die, encapsulating the device die in an encapsulating material, performing a planarization to reveal the metal pillar, forming a second polymer layer over the encapsulating material and the device die, and patterning the second polymer layer to form a second opening. The metal pillar is exposed through the second opening. A second sidewall of the second polymer layer exposed to the second opening has a second tilt angle greater than the first tilt angle.
    Type: Grant
    Filed: March 15, 2021
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsi-Kuei Cheng, Ching Fu Chang, Chih-Kang Han, Hsin-Chieh Huang
  • Publication number: 20240139944
    Abstract: The robotic arm operating system includes a control device, a plurality of joint devices and a brake release monitoring device. The control device is used to generate an operation instruction. The joint device is coupled to the control device. Each joint device includes a motor and a driver. The drivers of the joint devices receive the operation instruction to generate corresponding multiple unlocking signals. The unlocking signals are used to release a braking state of the motors of the corresponding joint devices. The brake release monitoring device is coupled to the control device and the joint devices, and includes a plurality of monitoring circuits. When one of the plurality of monitoring circuits does not receive the corresponding unlocking signal, the brake release monitoring device notifies the control device that the operation instruction is not allowed.
    Type: Application
    Filed: October 27, 2022
    Publication date: May 2, 2024
    Inventors: Hsin-Fu WANG, Shun-Kai CHANG, Yen-Shun HUANG
  • Patent number: 11948881
    Abstract: A semiconductor structure includes a die, a molding surrounding the die, a first dielectric layer disposed over the die and the molding, and a second dielectric layer disposed between the first dielectric layer and the die, and between the first dielectric layer and the molding. A material content ratio in the first dielectric layer is substantially greater than that in the second dielectric layer. In some embodiments, the material content ratio substantially inversely affects a mechanical strength of the first dielectric layer and the second dielectric layer.
    Type: Grant
    Filed: July 8, 2021
    Date of Patent: April 2, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Hsi-Kuei Cheng, Chih-Kang Han, Ching-Fu Chang, Hsin-Chieh Huang
  • Patent number: 6837600
    Abstract: An auxiliary vehicle lamp comprises an outer casing, a lower casing coupled to the outer casing and a rotary lamp. The rotary lamp further comprises: a seat portion, a rotary seat and an illuminating lamp. The seat portion has a bottom seat. The bottom seat is a cylinder with a chamfered portion. An upper side of the bottom seat is tapered and is extended with a rod portion. The rotary seat having one end which is formed with a coupling hole and is chamfered to be matched to the chamfered portion of the seat. An upper inner side of the coupling hole having a ball bearing which is exactly coupled to the rod. The rotary seat has a weight; and an upper side of the rotary seat has a lock screw for locking the illuminating lamp.
    Type: Grant
    Filed: December 5, 2002
    Date of Patent: January 4, 2005
    Inventor: Hsin Fu Chang
  • Publication number: 20040109323
    Abstract: An auxiliary vehicle lamp comprises an outer casing, a lower casing coupled to the outer casing and a rotary lamp. The rotary lamp further comprises: a seat portion, a rotary seat and an illuminating lamp. The seat portion has a bottom seat. The bottom seat is a cylinder with a chamfered portion. An upper side of the bottom seat is tapered and is extended with a rod portion. The rotary seat having one end which is formed with a coupling hole and is chamfered to be matched to the chamfered portion of the seat. An upper inner side of the coupling hole having a ball bearing which is exactly coupled to the rod. The rotary seat has a weight; and an upper side of the rotary seat has a lock screw for locking the illuminating lamp.
    Type: Application
    Filed: December 5, 2002
    Publication date: June 10, 2004
    Inventor: Hsin Fu Chang