Abstract: A layer stack including a first bonding dielectric material layer, a dielectric metal oxide layer, and a second bonding dielectric material layer is formed over a top surface of a substrate including a substrate semiconductor layer. A conductive material layer is formed by depositing a conductive material over the second bonding dielectric material layer. The substrate semiconductor layer is thinned by removing portions of the substrate semiconductor layer that are distal from the layer stack, whereby a remaining portion of the substrate semiconductor layer includes a top semiconductor layer. A semiconductor device may be formed on the top semiconductor layer.

Abstract: The disclosure provides a semiconductor structure and a method of forming the same. The semiconductor structure includes a base pattern including a channel region and a drain region, a first semiconductor layer on the channel region of the base pattern, and a gate structure on the first semiconductor layer. The gate structure includes a first stack disposed on the first semiconductor layer and a second stack disposed on the first stack. The first stack includes a first sidewall adjacent to the drain region and a second sidewall opposite to the first sidewall in a first direction parallel to a top surface of the base pattern. The first sidewall is at a first distance from the second stack in the first direction, and the second sidewall is at a second distance from the second stack in the first direction. The first distance is greater than the second distance.

Abstract: An image sensor device has a first number of first pixels disposed in a substrate and a second number of second pixels disposed in the substrate. The first number is substantially equal to the second number. A light-blocking structure disposed over the first pixels and the second pixels. The light-blocking structure defines a plurality of first openings and second openings through which light can pass. The first openings are disposed over the first pixels. The second openings are disposed over the second pixels. The second openings are smaller than the first openings. A microcontroller is configured to turn on different ones of the second pixels at different points in time.

Abstract: A method of fabricating a device includes providing a fin element in a device region and forming a dummy gate over the fin element. In some embodiments, the method further includes forming a source/drain feature within a source/drain region adjacent to the dummy gate. In some cases, the source/drain feature includes a bottom region and a top region contacting the bottom region at an interface interposing the top and bottom regions. In some embodiments, the method further includes performing a plurality of dopant implants into the source/drain feature. In some examples, the plurality of dopant implants includes implantation of a first dopant within the bottom region and implantation of a second dopant within the top region. In some embodiments, the first dopant has a first graded doping profile within the bottom region, and the second dopant has a second graded doping profile within the top region.

Abstract: An analysis method and an electronic apparatus for breast image are provided. The method includes the following steps. One or more breast ultrasound images are obtained. The breast ultrasound images are used for forming a three-dimensional (3D) breast model. A volume of interest (VOI) in the breast ultrasound image is obtained by applying a detection model on the 3D breast model. The VOI is compared with a tissue segmentation result. The VOI is determined as a false positive according to a compared result between the VOI and the tissue segmentation result. The compared result includes that the VOI is located at a glandular tissue based on the tissue segmentation result. In response to the VOI being located in the glandular tissue of the tissue segmentation result, the VOI is compared with the lactiferous duct in the 3D breast model.

Abstract: A method for fabricating semiconductor device includes the steps of: providing a substrate having a first region and a second region; forming a first fin-shaped structure on the first region and a second fin-shaped structure on the second region; forming a patterned mask on the second region; and performing a process to enlarge the first fin-shaped structure so that the top surfaces of the first fin-shaped structure and the second fin-shaped structure are different.

Abstract: A semiconductor die package includes a high dielectric constant (high-k) dielectric layer over a device region of a first semiconductor die that is bonded with a second semiconductor die in a wafer on wafer (WoW) configuration. A through silicon via (TSV) structure may be formed through the device region. The high-k dielectric layer has an intrinsic negative charge polarity that provides a coupling voltage to modify the electric potential in the device region. In particular, the electron carriers in high-k dielectric layer attracts hole charge carriers in device region, which suppresses trap-assist tunnels that result from surface defects formed during etching of the recess for the TSV structure. Accordingly, the high-k dielectric layer described herein reduces the likelihood of (and/or the magnitude of) current leakage in semiconductor devices that are included in the device region of the first semiconductor die.

Abstract: A control circuit of a buck-boost converting apparatus is disclosed. The control circuit includes a current sensing circuit and a mode determination circuit. The current sensing circuit senses an output current of the buck-boost converting apparatus and provides a current sensing signal. The mode determination circuit is coupled to the current sensing circuit and receives the current sensing signal. The mode determination circuit generates a default voltage according to the current sensing signal and a default current, and the mode determination circuit generates a switching control signal according to the default voltage and the current sensing signal to control the buck-boost converting apparatus to be operated in a buck mode, a boost mode or a buck-boost mode.

Abstract: A testing apparatus for providing per pin level setting is disclosed, and the testing apparatus includes a control unit and a filter circuit, where the control unit is electrically connected to the filter circuit. The control unit includes a field programmable gate array (FPGA) for providing a PWM signal. The filter circuit receives the PWM signal and outputs at least one DC voltage.

Abstract: A testing apparatus with a back-drive protection function is disclosed, where the testing apparatus includes a driver and a field programmable gate array (FPGA), where the driver is electrically connected to the FPGA. The FPGA can monitor output current from the driver and perform the back-drive protection function on the driver to protect device-under-test (DUT).

Abstract: An expanding device for a portable electronic apparatus is disclosed. The expanding device includes a main body for placing the portable electronic apparatus and a sliding assembly disposed in the main body. The sliding assembly includes a slide track element disposed in the main body, a sliding element, and a cover. The sliding element is slidably coupled to the slide track element and slides between a receiving position and an extending position relative to the main body. The cover is pivotally connected to the sliding element and includes a fixing portion. When the sliding element is moved towards outside of the main body to the extending position, the cover can be rotated relative to the sliding element, and the portable electronic apparatus can be fixed on the main body via the fixing portion of the cover.

Abstract: A testing apparatus for providing per pin level setting is disclosed, and the testing apparatus includes a control unit and a filter circuit, where the control unit is electrically connected to the filter circuit. The control unit includes a field programmable gate array (FPGA) for providing a PWM signal. The filter circuit receives the PWM signal and outputs at least one DC voltage.

Abstract: A testing apparatus with a back-drive protection function is disclosed, where the testing apparatus includes a driver and a field programmable gate array (FPGA), where the driver is electrically connected to the FPGA. The FPGA can monitor output current from the driver and perform the back-drive protection function on the driver to protect device-under-test (DUT).

Abstract: A portable electronic device includes a device body and a hand tool. The hand tool includes a handle unit, a coupling unit, and a tool body. The coupling unit includes a coupling element attachable removably to the device body. The tool body is connected between the handle unit and the coupling unit, and includes a working head projecting from the coupling element. When not in use, the hand tool is attached to the device body, and can be easily carried together with the device body. When removed from the device body, the hand tool can be used.

Abstract: An electronic device with a cleaning mechanism that is capable of cleaning a display panel thereof is provided. The electronic device includes a display panel, a main portion, a hinge structure, a sliding device, and a first spring. The hinge structure includes a fixing portion, a rotating portion having a first contact surface, and a spring holder having a second contact surface. When the rotating portion rotates on the fixing portion, the first contact surface contacts the second contact surface and presses against the spring holder so that it rotates with the rotating portion. The sliding device includes a cleaning material contacting the display panel. Two end portions of the first spring are respectively fixed to the spring holder and the sliding device. When the spring holder stretches the first spring to move the sliding device, the cleaning material cleans the display panel.

Abstract: An electronic device with a cleaning mechanism that is capable of cleaning a display panel thereof is provided. The electronic device includes a display panel, a main portion, a hinge structure, a sliding device, and a first spring. The hinge structure includes a fixing portion, a rotating portion having a first contact surface, and a spring holder having a second contact surface. When the rotating portion rotates on the fixing portion, the first contact surface contacts the second contact surface and presses against the spring holder so that it rotates with the rotating portion. The sliding device includes a cleaning material contacting the display panel. Two end portions of the first spring are respectively fixed to the spring holder and the sliding device. When the spring holder stretches the first spring to move the sliding device, the cleaning material cleans the display panel.

Abstract: A portable electronic device includes a device body and a hand tool. The hand tool includes a handle unit, a coupling unit, and a tool body. The coupling unit includes a coupling element attachable removably to the device body. The tool body is connected between the handle unit and the coupling unit, and includes a working head projecting from the coupling element. When not in use, the hand tool is attached to the device body, and can be easily carried together with the device body. When removed from the device body, the hand tool can be used.

Abstract: A carrier device includes a supporting base, two frames pivotally attached to the supporting base with spindles and each having a pivot axle, a mounting seat attached to the pivot axles of the frames and pivotal relative to the pivot axles of the frames between an upwardly extended working position and a storing position, a lock device is attached to the pivot axle of each of the frames for locking the frame to the supporting base at the lower folded position, and a latch device is attached to the frames for latching the mounting seat to the frames at the storing position and for preventing the carrier device from being collapsed.

Abstract: A power supply device includes a transformer and a heat-dissipating mechanism. The heat-dissipating mechanism includes a heat-dissipating fan unit and an activating unit. The heat-dissipating fan unit is connected pivotally to the transformer, and is pivotable relative to the transformer to lie on a top surface of the transformer. An inclination angle of the heat-dissipating fan unit relative to the top surface of the transformer is adjustable. The activating unit includes a control switch for controlling activation of the heat-dissipating fan unit.

Abstract: A portable apparatus includes a base rotatable member having a chamber and a compartment, a cover rotatable member having a space and a cavity, one or more anchors engaged in the chamber of the base rotatable member and having a curved channel formed in an arm, the cover rotatable member includes a pivot shaft engaged in the channel of the arm for pivotally connecting the rotatable members together, a linking device includes two coupling devices attached to the rotatable members and pivotally connected together with a pivot axle for connecting the coupling devices together and for solidly and stably coupling the rotatable members together, and for receiving and protecting the linking device and the anchors.