Patents by Inventor Hsin-Hao Liao

Hsin-Hao Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150168362
    Abstract: A microfluidic channel detection system for environmental or biomedical detection includes a chip having a first surface where a sensing region is located, a substrate having a recess for containing the chip, in which the first surface is exposed, a first inactive layer filling gaps between the chip and the substrate in the recess, so as to form a plane with the first surface of the chip, an electrical connection member electrically connected to the chip, a cover having a microfluidic channel and disposed on the plane. The flow path in the microfluidic channel is smooth, and further the measurement accuracy is improved via the plane formed by the first inactive layer and the first surface.
    Type: Application
    Filed: February 20, 2014
    Publication date: June 18, 2015
    Applicant: National Applied Research Laboratories
    Inventors: Che-Hsin LIN, Jun-Jie WANG, Ying-Zong JUANG, Hann-Huei TSAI, Hsin-Hao LIAO
  • Patent number: 8704278
    Abstract: A structure for a metal-oxide-semiconductor field-effect transistor (MOSFET) sensor is provided. The structure includes a MOSFET, a sensing membrane, and a reference electrode. The reference electrode and the sensing membrane are formed on the first surface of the MOSFET and are arranged in such a way that the reference electrode and the sensing membrane are uniformly and electrically coupled to each other. Thus, the electric field between the sensing membrane and the reference electrode is uniformly distributed therebetween to stabilize the working signal of the MOSFET sensor.
    Type: Grant
    Filed: March 13, 2012
    Date of Patent: April 22, 2014
    Assignee: Seoul National University Industry Foundation
    Inventors: Ying-Zong Juang, Hann-Huei Tsai, Hsin-Hao Liao, Chen-Fu Lin
  • Publication number: 20130153969
    Abstract: A structure for a metal-oxide-semiconductor field-effect transistor (MOSFET) sensor is provided. The structure includes a MOSFET, a sensing membrane, and a reference electrode. The reference electrode and the sensing membrane are formed on the first surface of the MOSFET and are arranged in such a way that the reference electrode and the sensing membrane are uniformly and electrically coupled to each other. Thus, the electric field between the sensing membrane and the reference electrode is uniformly distributed therebetween to stabilize the working signal of the MOSFET sensor.
    Type: Application
    Filed: March 13, 2012
    Publication date: June 20, 2013
    Applicant: National Chip Implementation Center National Applied Research Laboratories
    Inventors: Ying-Zong JUANG, Hann-Huei Tsai, Hsin-Hao Liao, Chen-Fu Lin
  • Publication number: 20130146899
    Abstract: A complementary metal-oxide semiconductor (CMOS) sensor with an image sensing unit integrated therein is provided. The CMOS sensor includes a first substrate, a CMOS circuit, and a sensing device. The first substrate has the image sensing unit formed thereon. The CMOS circuit is disposed on the first substrate and has a receiving space. The sensing device is disposed in the receiving space. The image sensing unit is located at a position from which the image sensing unit can monitor the sensing device. Accordingly, the image sensing unit monitors the sensing device by sensing its image.
    Type: Application
    Filed: February 29, 2012
    Publication date: June 13, 2013
    Applicant: National Chip Implementation Center National Applied Research Laboratories
    Inventors: Ying-Zong JUANG, Hann-Huei Tsai, Hsin-Hao Liao, Chen-Fu Lin
  • Publication number: 20110117747
    Abstract: A method of fabricating a single chip for integrating a field-effect transistor into a microelectromechanical systems (MEMS) structure is provided. The method includes the steps of: providing a substrate having thereon at least one transistor structure, a MEMS structure and a blocking structure, wherein the blocking structure encircles the MEMS structure to separate the MEMS structure from the transistor structure; forming a masking layer for covering the transistor structure, the MEMS structure and the blocking structure; forming a patterned photoresist layer on the masking layer; performing a first etching process by using the patterned photoresist layer to remove the masking layer on the MEMS structure; and performing a second etching process by removing a portion of the MEMS structure to form a plurality of microstructures such that a relative motion among the microstructures takes place in a direction perpendicular to the substrate.
    Type: Application
    Filed: January 5, 2010
    Publication date: May 19, 2011
    Applicant: National Chip Implementation Center National Applied Research Laboratories
    Inventors: Chin-Long Wey, Chin-Fong Chiu, Ying-Zong Juang, Hann-Huei Tsai, Sheng-Hsiang Tseng, Hsin-Hao Liao