Abstract: The present invention relates to an optical clear resin and a method for producing a liquid optical clear photo-curable adhesive.

Abstract: A resin composition is provided. The resin composition includes a thermosetting resin component and a filler, wherein the thermosetting resin component has a dissipation factor (Df) of not higher than 0.006 at 1 GHz, and the filler is selected from the following group: strontium titanate, calcium titanate, barium titanate, magnesium titanate, combinations thereof and the sintered material of any of the combinations. The filler is doped or not doped with one or more elements selected from silicon, cobalt, nickel, manganese, and rare earth elements. The average particle size (D50) of the filler ranges from about 2 ?m to about 10 ?m. The amount of the filler is about 10 parts by weight to about 600 parts by weight per 100 parts by weight of the thermosetting resin component.

Abstract: Acrylate-terminated urethane polybutadienes are obtained by reaction of low-monomer 1:1 monoadducts of reactive olefinic compounds and diisocyanates with hydroxy-terminated polybutadienes.

Abstract: The present invention relates to an optical clear resin and a method for producing a liquid optical clear photo-curable adhesive.

Abstract: A stable solution of a ring-opened polymer is provided. The stable solution can be prepared using the following steps: (d) adding an N,O-heterocyclic compound of formula I or II and a DOPO-based compound into an organic solvent to provide a reaction solution: wherein R1 to R3, W1, W2, m, n, p and q are as defined in the specification. (e) heating the reaction solution to carry out a ring-opening reaction to provide a polymer solution; and (f) cooling the polymer solution to obtain the stable solution, wherein the organic solvent is unreactive to the N,O-heterocyclic compound and the DOPO-based compound, and the amount of the DOPO-based compound is about 0.01 wt % to about 50 wt % based on the total weight of the N,O-heterocyclic compound and the DOPO-based compound. The stable solution is useful as a self-crosslinkable resin or a hardener for hardening epoxies.

Abstract: A resin composition is provided. The resin composition includes a thermosetting resin component and a filler, wherein the thermosetting resin component has a dissipation factor (Df) of no more than 0.006 at 1 GHz, the filler is a ceramic powder obtained through a sintering process at a temperature ranging from 1300° C. to less than 1400° C., and the amount of the filler is 10 parts by weight to 600 parts by weight per 100 parts by weight of the thermosetting resin component.

Abstract: A resin composition is provided. The resin composition includes a thermosetting resin component and a filler, wherein the thermosetting resin component has a dissipation factor (Df) of no more than 0.006 at 1 GHz, the filler is a ceramic powder obtained through a sintering process at a temperature ranging from 1300° C. to less than 1400° C., and the amount of the filler is 10 parts by weight to 600 parts by weight per 100 parts by weight of the thermosetting resin component.

Abstract: A resin composition is provided. The resin composition includes a thermosetting resin component and a filler, wherein the thermosetting resin component has a dissipation factor (Df) of not higher than 0.006 at 1 GHz, and the filler is selected from the following group: strontium titanate, calcium titanate, barium titanate, magnesium titanate, combinations thereof and the sintered material of any of the combinations. The filler is doped or not doped with one or more elements selected from silicon, cobalt, nickel, manganese, and rare earth elements. The average particle size (D50) of the filler ranges from about 2 ?m to about 10 ?m. The amount of the filler is about 10 parts by weight to about 600 parts by weight per 100 parts by weight of the thermosetting resin component.

Abstract: A resin composition is provided. The resin composition comprises: an epoxy resin; and a hardener, which is a stable solution obtainable from the following steps: (a) adding a N,O-heterocyclic compound of formula I or II and a DOPO-based compound into an organic solvent to provide a reaction solution: wherein R1 to R3, W1, W2, m, n, p and q are as defined in the specification; (b) heating the reaction solution to carry out a ring-opening reaction to provide a polymer solution; and (c) cooling the polymer solution to obtain the stable solution, wherein the organic solvent is unreactive to the N,O-heterocyclic compound and the DOPO-based compound, and the amounts of the DOPO-based compound and the hardener are as defined in the specification.

Abstract: A resin composition is provided. The resin composition comprises: an epoxy resin; a hardener, which comprises a melamine compound of Formula I: wherein, R is the same with or different from each other and has the formula of R1 and R2 are individually selected from a group consisting of H, a halogen, a substituted or unsubstituted C1-C15 alkyl group, a substituted or unsubstituted C1-C15 aloxy group, a substituted or unsubstituted C3-C15 cycloalkyl group, a substituted or unsubstituted C6-C20 aryl group, a substituted or unsubstituted C6-C20 aryloxy group, a substituted or unsubstituted C1-C15 unsaturated hydrocarbyl group, a naphthol group, a phenanthrenol group, and a dicyclopentadiene group, with a proviso that R2 is not H; and m is 1 or 2, wherein the amount of the hardener is about 20 parts by weight to about 150 parts by weight per 100 parts by weight of the epoxy resin.

Abstract: A resin composition is provided. The resin composition comprises: an epoxy resin; and a hardener, which is a stable solution obtainable from the following steps: (a) adding a N,O-heterocyclic compound of formula I or II and a DOPO-based compound into an organic solvent to provide a reaction solution: wherein R1 to R3, W1, W2, m, n, p and q are as defined in the specification; (b) heating the reaction solution to carry out a ring-opening reaction to provide a polymer solution; and (c) cooling the polymer solution to obtain the stable solution, wherein the organic solvent is unreactive to the N,O-heterocyclic compound and the DOPO-based compound, and the amounts of the DOPO-based compound and the hardener are as defined in the specification.

Abstract: A stable solution of a ring-opened polymer is provided. The stable solution can be prepared using the following steps: (d) adding an N,O-heterocyclic compound of formula I or II and a DOPO-based compound into an organic solvent to provide a reaction solution: wherein R1 to R3, W1, W2, m, n, p and q are as defined in the specification. (e) heating the reaction solution to carry out a ring-opening reaction to provide a polymer solution; and (f) cooling the polymer solution to obtain the stable solution, wherein the organic solvent is unreactive to the N,O-heterocyclic compound and the DOPO-based compound, and the amount of the DOPO-based compound is about 0.01 wt % to about 50 wt % based on the total weight of the N,O-heterocyclic compound and the DOPO-based compound. The stable solution is useful as a self-crosslinkable resin or a hardener for hardening epoxies.

Abstract: A resin composition is provided. The resin composition comprises: an epoxy resin; a hardener, which comprises a melamine derivative of Formula I: wherein, R is the same with or different from each other and has the formula of R1 and R2 are individually selected from a group consisting of H, a halogen, a substituted or unsubstituted C1-C15 alkyl group, a substituted or unsubstituted C1-C15 aloxy group, a substituted or unsubstituted. C3-C15 cycloalkyl group, a substituted or unsubstituted C6-C20 aryl group, a substituted or unsubstituted C6-C20 aryloxy group, a substituted or unsubstituted C1-C15 unsaturated hydrocarbyl group, a naphthol group, a phenanthrenol group, and a dicyclopentadiene group, with a proviso that R2 is not H; and m is 1 or 2, wherein the amount of the hardener is about 20 parts by weight to about 150 parts by weight per 100 parts by weight of the epoxy resin.

Abstract: A melamine derivative of Formula I and its preparing method are provided: wherein, R is the same with or different from each other and has the formula of R1 and R2 are independently selected from a group consisting of H, a halogen, a substituted or unsubstituted C1-C15 alkyl, a substituted or unsubstituted C1-C15 alkoxy, a substituted or unsubstituted C3-C15 cycloalkyl, a substituted or unsubstituted C6-C20 aryl, a substituted or unsubstituted C6-C20 aryloxy, a substituted or unsubstituted C1-C15 unsaturated hydrocarbyl, a naphthol group, a phenanthrenol group, and a dicyclopentadiene group, with a proviso that R2 is not H; and m is 1 or 2.

Abstract: Disclosed is a flame retardant crosslink agent free of halogen and phosphorous. The crosslink agent can be applied in epoxy resin composition, such that the composition achieves V0 under UL-94 standard after curing. The crosslink agent, a novolac structure modified by nitrogen-containing and/or silicon containing compound, may collocate with inorganic powder, such that the thermal cured epoxy resin composition contains thermal retardancy, low expansion, low water uptake, and high glass transfer temperature properties. The epoxy resin composition including the crosslink agent of the invention can be applied in a prepreg used in copper clad laminates or printed circuit plates.

Abstract: A method embodiment of the invention includes a scheme for trimming and compensation of a laser emitter in a fiber optic link. A laser emitter is provided. Also a reference optical power value is determined using data models of laser emitter performance generated by statistical analysis of sample population of lasers that are similar to the subject laser emitter. The performance of the subject laser is measured and qualified optical power levels for the subject laser emitter are determined using the reference operating power value and measured performance of the subject laser emitter. The driving current of the subject laser emitter is adjusted to compensate for changes in temperature until the optical power of the subject laser emitter obtains a desired qualified optical power level. Related methods of determining qualified optical power levels for a laser emitter in a fiber optic link are also disclosed.

Abstract: A method includes a scheme for trimming and compensation for a laser emitter in a fiber optic link. Data models of laser performance are provided and used to determine a base power level. It is then confirmed that the base power level is satisfactory. If necessary, adjustments are made to a set of user specified performance parameters until a satisfactory base power level is obtained. Then a table or relation of temperatures and associated current and target average optical power values is generated such that they can be used to regulate laser emitter performance over a range of temperature. Additionally, fiber optic links capable of trimming and compensation are also disclosed.

Abstract: A relatively constant average optical power is provided over a user-defined range of temperatures by detecting the temperature, and adjusting the bias currents input to the laser diodes in an array of laser diodes based on the temperature and the channel loss of the channel connected to each diode.

Abstract: A method includes a scheme for trimming and compensation for a laser emitter in a fiber optic link. Data models of laser performance are provided and used to determine a base power level. It is then confirmed that the base power level is satisfactory. If necessary, adjustments are made to a set of user specified performance parameters until a satisfactory base power level is obtained. Then a table or relation of temperatures and associated current and target average optical power values is generated such that they can be used to regulate laser emitter performance over a range of temperature. Additionally, fiber optic links capable of trimming and compensation are also disclosed.

Abstract: A method embodiment of the invention includes a scheme for trimming and compensation of a laser emitter in a fiber optic link. A laser emitter is provided. Also a reference optical power value is determined using data models of laser emitter performance generated by statistical analysis of sample population of lasers that are similar to the subject laser emitter. The performance of the subject laser is measured and qualified optical power levels for the subject laser emitter are determined using the reference operating power value and measured performance of the subject laser emitter. The driving current of the subject laser emitter is adjusted to compensate for changes in temperature until the optical power of the subject laser emitter obtains a desired qualified optical power level. Related methods of determining qualified optical power levels for a laser emitter in a fiber optic link are also disclosed.