Abstract: The disclosure provides a semiconductor structure and a method of forming the same. The semiconductor structure includes a base pattern including a channel region and a drain region, a first semiconductor layer on the channel region of the base pattern, and a gate structure on the first semiconductor layer. The gate structure includes a first stack disposed on the first semiconductor layer and a second stack disposed on the first stack. The first stack includes a first sidewall adjacent to the drain region and a second sidewall opposite to the first sidewall in a first direction parallel to a top surface of the base pattern. The first sidewall is at a first distance from the second stack in the first direction, and the second sidewall is at a second distance from the second stack in the first direction. The first distance is greater than the second distance.

Abstract: A heat dissipation structure and an electronic apparatus having the heat dissipation structure are provided. The electronic apparatus includes a printed circuit board, a high thermal-resisting housing, a thermal pad and a metal bracket. Heat is transferred between the thermal pad and an electronic component mounted on the printed circuit board. The high thermal-resisting housing defines an inner space for accommodating the printed circuit board. A columnar space is formed in the high thermal-resisting housing, and a metal layer is arranged outside the columnar space. The thermal conductivity of the high thermal-resisting housing is not greater than 1 W/m·K. The metal bracket and the printed circuit board are disposed at two opposite sides of the high thermal-resisting housing, respectively. A fastening member penetrates through the metal bracket and is inserted into the columnar space to urge the metal bracket to be in contact with the metal layer.

Abstract: A high electron mobility transistor device including a channel layer, a first barrier layer, a gate structure, and a spacer is provided. The first barrier layer is disposed on the channel layer. The gate structure is disposed on the first barrier layer. The gate structure includes a first P-type gallium nitride layer, a second barrier layer, and a second P-type gallium nitride layer. The first P-type gallium nitride layer is disposed on the first barrier layer. The second barrier layer is disposed on the first P-type gallium nitride layer. The second P-type gallium nitride layer is disposed on the second barrier layer. A width of the second P-type gallium nitride layer is smaller than a width of the first P-type gallium nitride layer. The spacer is disposed on a sidewall of the second P-type gallium nitride layer.

Abstract: This disclosure provides a semiconductor structure and a method of forming buried field plate structures. The semiconductor structure includes a substrate, buried field plate structures, and a gate. The substrate incudes a first surface and a second surface opposite the first surface. Each of the buried field plate structures include a conductive structure and an insulation structure surrounding the conductive structure. The gate is embedded in the substrate and extend into the substrate from the first surface of the substrate, wherein the gate is configured between the two neighboring buried field plate structures. The conductive structure includes portions arranging along a direction perpendicular to the first surface of the substrate and having different widths in a direction parallel to the first surface of the substrate.

Abstract: A heat dissipation structure and an electronic apparatus having the heat dissipation structure are provided. The electronic apparatus includes a printed circuit board, a high thermal-resisting housing, a thermal pad and a metal bracket. Heat is transferred between the thermal pad and an electronic component mounted on the printed circuit board. The high thermal-resisting housing defines an inner space for accommodating the printed circuit board. A columnar space is formed in the high thermal-resisting housing, and a metal layer is arranged outside the columnar space. The thermal conductivity of the high thermal-resisting housing is not greater than 1 W/m·K. The metal bracket and the printed circuit board are disposed at two opposite sides of the high thermal-resisting housing, respectively. A fastening member penetrates through the metal bracket and is inserted into the columnar space to urge the metal bracket to be in contact with the metal layer.

Abstract: The present disclosure provides an electronic module. The electronic module comprises an IC, a substrate and an antenna. The substrate has a top surface, a bottom surface and a lateral surface. The IC is electrically connected to the bottom surface. The antenna is disposed on at least two of the top surface, the bottom surface and the lateral surface.

Abstract: A dual-band antenna module is provided. The dual-band antenna module includes a circuit board, a ground coupling portion electrically connected to a reference ground plane of the circuit board, a first antenna, and a second antenna spaced from the first antenna. The first antenna and the ground coupling portion are disposed on the circuit board and configured to couple each other. The first antenna includes a first radiation unit, a U-shaped conductive frame, and a first feeding portion. The U-shaped conductive frame is disposed on the first radiation unit and opens toward the circuit board. The second antenna includes a second radiation unit, a high-frequency impedance portion, and a second feeding portion. The second radiation unit and the high-frequency impedance portion are respectively disposed on two opposite surfaces of the circuit board to resonate to each other. The second radiation unit includes a ground extension portion electrically grounded.

Abstract: A dual-band antenna module is provided. The dual-band antenna module includes a circuit board, a ground coupling portion electrically connected to a reference ground plane of the circuit board, a first antenna, and a second antenna spaced from the first antenna. The first antenna and the ground coupling portion are disposed on the circuit board and configured to couple each other. The first antenna includes a first radiation unit, a U-shaped conductive frame, and a first feeding portion. The U-shaped conductive frame is disposed on the first radiation unit and opens toward the circuit board. The second antenna includes a second radiation unit, a high-frequency impedance portion, and a second feeding portion. The second radiation unit and the high-frequency impedance portion are respectively disposed on two opposite surfaces of the circuit board to resonate to each other. The second radiation unit includes a ground extension portion electrically grounded.

Abstract: The present disclosure provides an electronic module. The electronic module comprises an IC, a substrate and an antenna. The substrate has a top surface, a bottom surface and a lateral surface. The IC is electrically connected to the bottom surface. The antenna is disposed on at least two of the top surface, the bottom surface and the lateral surface.

Abstract: The present disclosure relates to a wireless communication structure, including a plate, a first antenna, a first magnetic material layer, and a second magnetic material layer. The plate has a first surface, a second surface opposite to the first surface, and a lateral surface extending between the first surface and the second surface. The first antenna is located in the plate. The first magnetic material layer is adjacent to the lateral surface of the plate. The second magnetic material layer is located on the second surface of the plate.

Abstract: The present invention provides an antenna module and an antenna thereof. The antenna includes a first radiation element, a second radiation element, a third radiation element, and a short-circuit portion. The second radiation element has one end connected with the first radiation element. The third radiation element connected with the other end of the second radiation element, and includes a first connection section, a second connection section, and a third connection section. The first connection section is perpendicular to the second radiation element. The second connection section connected with the first connection section. The third connection section is connected with the second connection section and located at an internal side of the second connection section. The short-circuit portion connected with the second connection section and located at an external side of the second connection portion.

Abstract: A wireless module includes a flex substrate, an antenna integrated in the flex substrate and electrically connected to a signal layer and a ground layer of the flex substrate, a first rigid substrate stacked on one side of the flex substrate remote from the antenna, and a communication unit mounted on the first rigid substrate and electrically connected to the signal layer. Thus, the flex substrate and the first rigid substrate are laminated into a Rigid-Flex board. Further, the signal layer and the ground layer are continuously arranged in the same flex substrate. It will be helpful in decreasing the uncertainty and loss of RF signal transmission path, reducing component costs, facilitating optimization of the antenna and reducing the module size.

Abstract: The present disclosure relates to a wireless communication structure, including a plate, a first antenna, a first magnetic material layer, and a second magnetic material layer. The plate has a first surface, a second surface opposite to the first surface, and a lateral surface extending between the first surface and the second surface. The first antenna is located in the plate. The first magnetic material layer is adjacent to the lateral surface of the plate. The second magnetic material layer is located on the second surface of the plate.

Abstract: A wireless module includes a flex substrate, an antenna integrated in the flex substrate and electrically connected to a signal layer and a ground layer of the flex substrate, a first rigid substrate stacked on one side of the flex substrate remote from the antenna, and a communication unit mounted on the first rigid substrate and electrically connected to the signal layer. Thus, the flex substrate and the first rigid substrate are laminated into a Rigid-Flex board. Further, the signal layer and the ground layer are continuously arranged in the same flex substrate, It will be helpful in decreasing the uncertainty and loss of RF signal transmission path, reducing component costs, facilitating optimization of the antenna and reducing the module size.

Abstract: The present invention provides an antenna module and an antenna thereof. The antenna includes a first radiation element, a second radiation element, a third radiation element, and a short-circuit portion. The second radiation element has one end connected with the first radiation element. The third radiation element connected with the other end of the second radiation element, and includes a first connection section, a second connection section, and a third connection section. The first connection section is perpendicular to the second radiation element. The second connection section connected with the first connection section. The third connection section is connected with the second connection section and located at an internal side of the second connection section. The short-circuit portion connected with the second connection section and located at an external side of the second connection portion.

Abstract: An LCD backboard module includes a backboard, at least one speaker installed on the backboard, and a main body. The main body is combined with the backboard, and includes a motherboard and a back cover, wherein the motherboard is placed inside the back cover.

Abstract: A fan includes a casing that is composed of a front cover and a rear cover, a base mounted under the casing, and blades rotatably mounted in the casing. The base includes support frames symmetrically mounted thereto. The front and rear covers are each composed of a plurality of circular frames of different diameters. The rear cover has a lower portion that forms slots corresponding to the support frames so that the support frames are movably received through the slots respectively. A connection bar is connected to the rear cover so that the casing may undergo vertical and horizontal rotations through the arrangement of the slots for adjusting direction of airstream generated by the fan, thereby realizing an effect of indoor air circulation. Further, due to the arrangement of the rotation structure inside the casing, the outside appearance of the fan shows a sense of completeness of aesthetics.

Abstract: A fuser assembly of an electrophotographic printing device for fusing toners on a medium. The fuser assembly includes a fuser roller, a driving mechanism, a fuser substrate and a heating source. The driving mechanism connected to the fuser roller drives the fuser roller to rotate and thus the medium is moved by the fuser roller. The fuser substrate, being stationary and disposed opposite the fuser roller, is in sliding contact with the medium. The heating source heats the fuser substrate such that the fuser substrate fuses the toners on the medium.

Abstract: A sheet feeder includes a separation roller, a friction roller, a shaft and an energy storing element. The energy storing element stores energy when the friction roller is driven by the separation roller to rotate in the sheet-feeding direction and releases energy to make the friction roller rotate in a direction opposite to the sheet-feeding direction.

Abstract: In a transmission device with switchable gear ratios, a driving gear is disposed onto an output shaft of a motor, a rocker arm is pivoted on the output shaft through an electromagnetic clutch, a rocker arm gear mounted on the rocker arm is driven by the driving gear, a first gear set is driven by the rocker arm gear when the rocker arm is at a first position, a second gear set is driven by the rocker arm gear when the rocker arm is at a second position, and the first gear set and the second gear set have different output rotating speeds. In addition, a first magnetic element attracts the rocker arm at the first position, and a second magnetic element attracts the rocker arm at the second position. Thus, the gear ratio may be switched according to interactions between the electromagnetic clutch and the magnetic elements.