Patents by Inventor Hsin-Hsie Lee

Hsin-Hsie Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate, semiconductor construction, and manufacturing method thereof
    Patent number: 8866313
    Abstract: A substrate includes a die-bonding zone and a glue spreading pattern. The die-bonding zone is set to bond a die. The glue spreading pattern is placed in the die-bonding zone and includes a containing space. The die is placed on the glue spreading pattern, an area of a bottom of the die is greater than an area of an opening of the glue spreading pattern, the containing room of the glue spreading pattern is filled with a glue, and the die is bonded to the substrate by means of the glue.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: October 21, 2014
    Assignee: Unistars Corporation
    Inventors: Tien-Hao Huang, Hsin-Hsie Lee, Yi-Chun Wu, Shang-Yi Wu
  • Substrate, Semiconductor Construction, and Manufacturing Method Thereof
    Publication number: 20140191274
    Abstract: A substrate includes a die-bonding zone and a glue spreading pattern. The die-bonding zone is set to bond a die. The glue spreading pattern is placed in the die-bonding zone and includes a containing space. The die is placed on the glue spreading pattern, an area of a bottom of the die is greater than an area of an opening of the glue spreading pattern, the containing room of the glue spreading pattern is filled with a glue, and the die is bonded to the substrate by means of the glue.
    Type: Application
    Filed: March 13, 2013
    Publication date: July 10, 2014
    Applicant: Unistars Corporation
    Inventors: Tien-Hao Huang, Hsin-Hsie Lee, Yi-Chun Wu, Shang-Yi Wu