Patents by Inventor Hsin-Hsien Lin

Hsin-Hsien Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11216671
    Abstract: An environment monitoring system includes N sensors, a server and a monitoring device, where N?3. The sensors respectively generate multiple pieces of sense data related to a monitoring area. The server determines whether at least three of the pieces of sense data are abnormal, and generates position data based on the at least three pieces of abnormal sense data when the determination is affirmative. The monitoring device includes a body that is movable in the monitoring area, an image capturing module and a control module. The control module controls the body to move to a position corresponding to the position data, and the image capturing module captures an image at said position.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: January 4, 2022
    Assignee: NATIONAL FORMOSA UNIVERSITY
    Inventors: Tzu-Chi Chan, Hsin-Hsien Lin
  • Publication number: 20080045353
    Abstract: A golf club head includes a golf club head body and at least one weight-adjusting member mounted thereto. The golf club head body is provided with at least one assembling portion to combine the club weight-adjusting member. The club weight-adjusting member is made from a material selected from a mixture of macromolecular materials and metal powders such that the club weight-adjusting member functions to adjust a center of gravity of the golf club head and to absorb vibrations in striking a golf ball.
    Type: Application
    Filed: August 15, 2006
    Publication date: February 21, 2008
    Inventors: Lai-Fa Lo, Hsin-Hsien Lin
  • Publication number: 20030045038
    Abstract: A method of forming a low-temperature polysilicon, comprising steps of: providing a substrate with a surface on which a buffer layer, an amorphous silicon layer and a metal silicide layer are sequentially formed; forming a plurality of metal pads on predetermined regions of the metal silicide layer; and providing a current on the metal pads to transform the amorphous silicon layer into a polysilicon layer.
    Type: Application
    Filed: October 29, 2001
    Publication date: March 6, 2003
    Inventors: Hsin-Hsien Lin, Jam-Wem Lee, Shao-Liang Cheng, Lih-Juann Chen, Yuan-Ching Peng, Wen-Tung Wang