Patents by Inventor Hsin-Hsien Yeh

Hsin-Hsien Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250095917
    Abstract: An inductive component and a method for fabricating the same are provided. The method includes: filling a mold with a first magnetic powder to form a base layer; forming a cavity in the base layer; inserting a coil corresponding to the cavity; filling the mold with a second magnetic powder to form a cover layer, in which the cover layer fills a space between the cavity and the corresponding coil and covers the base layer and the coil; executing a compression molding process to form a to-be-sliced package and taking the to-be-sliced package out; slicing the to-be-sliced package to obtain a to-be-packaged body; and forming a protective layer and an electrode part electrically connected to the coil on a surface of the to-be-packaged body.
    Type: Application
    Filed: September 16, 2024
    Publication date: March 20, 2025
    Inventors: CHUN-CHIH LIN, HSIN HSIEN YEH
  • Patent number: 12020838
    Abstract: An inductive device and a manufacturing method thereof are provided. The inductive device includes a magnetic base, a coil structure, and a package structure. The magnetic base has an assembling surface, and an arrangement region is defined thereon. The coil structure is assembled to the magnetic base and includes a coil body, a first extending section, and a second extending section. The coil body has a though hole corresponding in position to the arrangement region, and the first and second extending sections both extend from the coil body toward the magnetic base and are wound on the magnetic base. The package structure covers the magnetic base and the coil structure. The package structure includes a magnetic molding main body, and a portion of the magnetic molding main body fills into the through hole of the coil body and is connected to the magnetic base.
    Type: Grant
    Filed: May 31, 2021
    Date of Patent: June 25, 2024
    Assignee: CHILISIN ELECTRONICS CORP.
    Inventors: Chia-Chen Chen, Yu-Cheng Chang, Hsin Hsien Yeh
  • Publication number: 20240194388
    Abstract: A composite inductor includes a coil structure and a magnetic packaging structure. The coil structure has a through hole, and the coil structure is embedded in the magnetic packaging structure. The magnetic packaging structure contains at least a first magnetic body and a second magnetic body. Based on a total thickness of the magnetic packaging structure being 100%, a thickness of each of the first magnetic body and the second magnetic body is higher than or equal to 16%.
    Type: Application
    Filed: May 15, 2023
    Publication date: June 13, 2024
    Inventors: CHAU-CHYUN CHUNG, CHI-FENG LI, HSIN HSIEN YEH
  • Publication number: 20210383954
    Abstract: An inductive device and a manufacturing method thereof are provided. The inductive device includes a magnetic base, a coil structure, and a package structure. The magnetic base has an assembling surface, and an arrangement region is defined thereon. The coil structure is assembled to the magnetic base and includes a coil body, a first extending section, and a second extending section. The coil body has a though hole corresponding in position to the arrangement region, and the first and second extending sections both extend from the coil body toward the magnetic base and are wound on the magnetic base. The package structure covers the magnetic base and the coil structure. The package structure includes a magnetic molding main body, and a portion of the magnetic molding main body fills into the through hole of the coil body and is connected to the magnetic base.
    Type: Application
    Filed: May 31, 2021
    Publication date: December 9, 2021
    Inventors: CHIA-CHEN CHEN, YU-CHENG CHANG, HSIN HSIEN YEH
  • Patent number: 9724675
    Abstract: The disclosure provides a photocatalyst material and a method for fabricating the same. The photocatalyst material includes a zinc oxide material doped with metal, wherein the zinc oxide material has a lattice structure including a plurality of defects. A part of the defects are filled with a metal.
    Type: Grant
    Filed: November 1, 2013
    Date of Patent: August 8, 2017
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jyh Ming Wu, Lu-Chih Wang, Hong-Ching Lin, Hsin-Hsien Yeh, Wei-Tsung Kao
  • Patent number: 9019678
    Abstract: A protection component includes: a package substrate; a first fuse unit disposed in the package substrate, having a first fusing region; a second fuse unit disposed in the package substrate, having a second fusing region which is close to the first fusing region; and a first buried cave disposed in the package substrate corresponding to the first and second fusing regions. When one of the first and second fusing regions is blown out, the first buried cave assists energy of fuse melting to break the other of the first and second fusing regions.
    Type: Grant
    Filed: August 16, 2012
    Date of Patent: April 28, 2015
    Assignee: Industrial Technology Research Institute
    Inventors: Hsin-Hsien Yeh, Hong-Ching Lin, Tsung-Wen Chen, Wen-Hao Deng
  • Publication number: 20140141968
    Abstract: The disclosure provides a photocatalyst material and a method for fabricating the same. The photocatalyst material includes a zinc oxide material doped with metal, wherein the zinc oxide material has a lattice structure including a plurality of defects.
    Type: Application
    Filed: November 1, 2013
    Publication date: May 22, 2014
    Applicant: Industrial Technology Research Institute
    Inventors: Jyh Ming WU, Lu-Chih WANG, Hong-Ching LIN, Wei-Tsung KAO, Hsin-Hsien YEH
  • Patent number: 8582307
    Abstract: A wireless communication apparatus in one embodiment includes a bag body and a radio frequency device. The bag body has at least a first slot, which extends to an edge of the bag body. The radio frequency device including a wireless integrated circuit chip is for radio-frequency signal transmission or receiving, and is disposed across a portion of the first slot and coupled to two connection ends of the bag body so that the bag body between the two connection ends serves as an inductance circuit. The inductance circuit of the two connection ends of the bag body is based on metallic material. An impedance of the inductance circuit is for conjugate matching with that of the radio frequency device and is determined according to a plurality of geometric parameters including: a distance from the edge to the wireless integrated circuit chip, and size of the first slot.
    Type: Grant
    Filed: November 17, 2010
    Date of Patent: November 12, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Jiun-Jang Yu, Hsin-Hsien Yeh, Hong-Ching Lin
  • Publication number: 20130044401
    Abstract: A protection component includes: a package substrate; a first fuse unit disposed in the package substrate, having a first fusing region; a second fuse unit disposed in the package substrate, having a second fusing region which is close to the first fusing region; and a first buried cave disposed in the package substrate corresponding to the first and second fusing regions. When one of the first and second fusing regions is blown out, the first buried cave assists energy of fuse melting to break the other of the first and second fusing regions.
    Type: Application
    Filed: August 16, 2012
    Publication date: February 21, 2013
    Inventors: Hsin-Hsien Yeh, Hong-Ching Lin, Tsung-Wen Chen, Wen-Hao Deng
  • Patent number: 8042744
    Abstract: A radio frequency identification (RFID) tag including a substrate, an RFID chip, a chip contact part, a folding circuit and a radiation part is provided. The chip contact part is formed on the substrate and electrically coupled to the RFID chip. The folding circuit is formed on the substrate and electrically coupled to the chip contact part. The folding circuit has a winding part, which forms a hollow region, for compensating the antenna electric length. The radiation part is formed on the substrate and electrically coupled to the folding circuit, wherein one terminal of the winding part of the folding circuit is open, and the other terminal is electrically coupled to the radiation part. At least one of the folding circuit and the radiation part is asymmetric to the chip contact part.
    Type: Grant
    Filed: July 21, 2009
    Date of Patent: October 25, 2011
    Assignee: Industrial Technology Research Institute
    Inventors: Jiun-Jang Yu, Hsin-Hsien Yeh, Hong-Ching Lin, Chiung-Hsiung Chen
  • Publication number: 20110134622
    Abstract: A wireless communication apparatus in one embodiment includes a bag body and a radio frequency device. The bag body has at least a first slot, which extends to an edge of the bag body. The radio frequency device including a wireless integrated circuit chip is for radio-frequency signal transmission or receiving, and is disposed across a portion of the first slot and coupled to two connection ends of the bag body so that the bag body between the two connection ends serves as an inductance circuit. The inductance circuit of the two connection ends of the bag body is based on metallic material. An impedance of the inductance circuit is for conjugate matching with that of the radio frequency device and is determined according to a plurality of geometric parameters including: a distance from the edge to the wireless integrated circuit chip, and size of the first slot.
    Type: Application
    Filed: November 17, 2010
    Publication date: June 9, 2011
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jiun-Jang Yu, Hsin-Hsien Yeh, Hong-Ching Lin
  • Publication number: 20100116893
    Abstract: A radio frequency identification (RFID) tag including a substrate, an RFID chip, a chip contact part, a folding circuit and a radiation part is provided. The chip contact part is formed on the substrate and electrically coupled to the RFID chip. The folding circuit is formed on the substrate and electrically coupled to the chip contact part. The folding circuit has a winding part, which forms a hollow region, for compensating the antenna electric length. The radiation part is formed on the substrate and electrically coupled to the folding circuit, wherein one terminal of the winding part of the folding circuit is open, and the other terminal is electrically coupled to the radiation part. At least one of the folding circuit and the radiation part is asymmetric to the chip contact part.
    Type: Application
    Filed: July 21, 2009
    Publication date: May 13, 2010
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jiun-Jang Yu, Hsin-Hsien Yeh, Hong-Ching Lin, Chiung-Hsiung Chen
  • Patent number: 7711118
    Abstract: The security system for a protected object comprises a first wireless module, a central controller, and a remote authorization server. The first wireless module and the central controller are disposed in the protected object. The first wireless module transmits an authorization request with an authorization ID (identification) of the protected object, and receives an authorization response. The central controller is coupled to the first wireless module, and allows the protected object to operate in accordance with the authorization response. The remote authorization server, responsive to the authorization request, generates the authorization response from an authorization record thereof in accordance with the authorization ID, and transmits the authorization response.
    Type: Grant
    Filed: December 28, 2005
    Date of Patent: May 4, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Yuh-Fwu Chou, Hsin-Hsien Yeh, Mo-Hua Yang, Horng-Yuan Wen, Jing-Pin Pan, Ying-Chang Hung
  • Publication number: 20090160653
    Abstract: An anti-metal radio frequency identification (RFID) tag and a manufacturing method thereof are described. The anti-metal RFID tag includes a substrate having a first surface and a second surface on an opposite side thereof; a planar integral antenna formed on the first surface of the substrate; a RFID transceiver chip (i.e., RFID chip) disposed on the surface of the substrate and coupled to a signal feed point of the planar integral antenna. The flexible planar integral antenna and substrate are folded and then fixed by a fixing mechanism to form an anti-metal RFID tag with a feed-in structure, a RFID transceiver chip, and a radiator on one side, and a ground plane on the opposite side. A spacer is further sandwiched in the center of the folded structure, which is helpful for improving the antenna gain of the anti-metal RFID tag.
    Type: Application
    Filed: December 28, 2007
    Publication date: June 25, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsin-Hsien Yeh, Ying-Chang Hung, Jiun-Jang Yu, Hong-Ching Lin, Chiung-Hsiung Chen
  • Publication number: 20080183407
    Abstract: The invention provides a system and method for testing the power intensity of RFID tags. The method is applicable to the system for testing power intensity, which comprises a RFID reading device, a signal transmitting device electrically coupled to the RFID reading device, a signal separating device electrically coupled to the signal transmitting device and a control analysis device electrically coupled to the signal separating device. The system is applicable to a RFID tag or a test object attached with a RFID tag in a non-shielded or shielded room.
    Type: Application
    Filed: December 26, 2007
    Publication date: July 31, 2008
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsin-Hsien Yeh, Ying-Chang Hung, Hong-Ching Lin
  • Publication number: 20070147615
    Abstract: A security system. The security system for a protected object comprises a first wireless module, a central controller, and a remote authorization server. The first wireless module and the central controller are disposed in the protected object. The first wireless module transmits an authorization request with an authorization ID (identification) of the protected object, and receives an authorization response. The central controller is coupled to the first wireless module, and allows the protected object to operate in accordance with the authorization response. The remote authorization server, responsive to the authorization request, generates the authorization response from an authorization record thereof in accordance with the authorization ID, and transmits the authorization response.
    Type: Application
    Filed: December 28, 2005
    Publication date: June 28, 2007
    Inventors: Yuh-Fwu Chou, Hsin-Hsien Yeh, Mo-Hua Yang, Horng-Yuan Wen, Jing-Pin Pan, Ying-Chang Hung