Abstract: A cell module is provided. The cell module includes a first substrate; a second substrate disposed opposite to the first substrate; a cell unit disposed between the first substrate and the second substrate; a first thermosetting resin layer disposed between the cell unit and the first substrate; a crosslinked polymer layer disposed between the cell unit and the first thermosetting resin layer; and a second thermosetting resin layer disposed between the cell unit and the second substrate. The crosslinked polymer layer includes a crosslinked polymer, and the crosslinked polymer has a crosslinking degree of from 35.4 to 67.4%.

Abstract: A cell module is provided. The cell module includes a first substrate; a second substrate disposed opposite to the first substrate; a cell unit disposed between the first substrate and the second substrate; a first thermosetting resin layer disposed between the cell unit and the first substrate; a first protective layer disposed between the cell unit and the first thermosetting resin layer; and a second thermosetting resin layer disposed between the cell unit and the second substrate. The first protective layer includes a first polymer, wherein the cross-linking degree of the first polymer is 0 to 42.3%.

Abstract: A photoelectric conversion compound is provided. The photoelectric conversion compound has a structure represented by formula (I): wherein D represents an inorganic luminescent group; each of R1, R2, and R3 independently represents a hydrogen atom or a C1-6 alkyl group; R4 represents a single bond or a C1-6 alkylene group; m represents an integer of 1-10; k represents an integer of 1-1,000; and n represents an integer of 1-10,000.

Abstract: A photoelectric conversion compound is provided. The photoelectric conversion compound has a structure represented by formula (I): wherein D represents an inorganic luminescent group; each of R1, R2, and R3 independently represents a hydrogen atom or a C1-6 alkyl group; R4 represents a single bond or a C1-6 alkylene group; m represents an integer of 1-10; k represents an integer of 1-1,000; and n represents an integer of 1-10,000.

Abstract: A solar cell module is provided. The solar cell module includes a first substrate, a second substrate opposite the first substrate, a cell unit disposed between the first and second substrates, a first thermosetting resin layer disposed between the cell unit and the first substrate, a first thermoplastic resin layer disposed between the cell unit and the first thermosetting resin layer, a second thermosetting resin layer disposed between the cell unit and the second substrate, and a second thermoplastic resin layer disposed between the cell unit and the second thermosetting resin layer.

Abstract: A solar cell module is provided. The solar cell module includes a first substrate, a second substrate opposite to the first substrate, a cell unit disposed between the first and second substrates, a first thermosetting resin layer disposed between the cell unit and the first substrate, a first thermoplastic resin layer disposed between the cell unit and the first thermosetting resin layer, a second thermosetting resin layer disposed between the cell unit and the second substrate, and a second thermoplastic resin layer disposed between the cell unit and the second thermosetting resin layer, wherein at least one of the first thermoplastic resin layer and the second thermoplastic resin layer contains 0.1% to 10% of light diffusion particles.

Abstract: A solar cell module is provided. The solar cell module includes a first substrate, a second substrate opposite the first substrate, a cell unit disposed between the first and second substrates, a first thermosetting resin layer disposed between the cell unit and the first substrate, a first thermoplastic resin layer disposed between the cell unit and the first thermosetting resin layer, a second thermosetting resin layer disposed between the cell unit and the second substrate, and a second thermoplastic resin layer disposed between the cell unit and the second thermosetting resin layer.

Abstract: The disclosure provides a solar cell encapsulating module including a first substrate, a first encapsulating material layer, a metal particle layer, multiple solar cells, a routing layer, a second encapsulating material layer and a second substrate. The first substrate is formed from a light transmittance material. The first encapsulating material layer is formed on the first substrate. The metal particle layer is formed on the first encapsulating material layer. The solar cells are disposed on the metal particle layer. The routing layer is disposed on the solar cells for being electrically connected to the plurality of solar cells. The second encapsulating material layer is formed on the routing layer. The second substrate is disposed on the second encapsulating material layer. The routing layer is disposed on only one side of the solar cells.

Abstract: The invention provides a semiconductor device module package structure and a series connection method thereof. The semiconductor device module package structure includes a wafer having a plurality through holes. A doped layer covers a top surface of the first electrode, and inner sidewalls extending to a bottom surface of the first electrode. At least two first electrodes are disposed adjacent to each other and on opposite sides of the through holes. A second electrode covers the doped layer and the through holes. At least two insulating layer patterns overlap with the first and second electrodes. A second electrode conductive pattern is disposed on the second electrode. The second electrode conductive pattern is disposed between the insulating layer patterns, electrically connecting to the second electrode.