Patents by Inventor Hsin-Hsing Wei

Hsin-Hsing Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package having a heat spreader capable of preventing being soldered and enhancing adhesion and electrical performance
    Patent number: 6093960
    Abstract: A semiconductor package has a die and a plurality of leads electrically connected to the die with bonding wires. A heat spreader has an upper face thermally contacted with the die. The heat spreader is formed by a copper core having at least a portion of surface sequentially coated with a metal medium layer and an insulation layer, wherein the metal medium layer has an adhesion degree with insulation material higher than copper. A package body encapsulates the die, the heat spreader and the plurality of leads, wherein the surface area of the heat spreader that contacts with the package body is coated with the metal medium layer and the insulation layer.
    Type: Grant
    Filed: June 11, 1999
    Date of Patent: July 25, 2000
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Su Tao, Kuang-Lin Lo, Hsin-Hsing Wei