Patents by Inventor Hsin Hsu

Hsin Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12372728
    Abstract: An optical fiber connector includes a connecting unit, an adapter unit, and an attenuation unit. The adapter unit includes an insertion seat connected removably to a main housing of the connecting unit, and two guide frame bodies located respectively at two opposite sides of the insertion seat in a transverse direction. The insertion seat has two insertion holes spaced apart in the transverse direction and extending in a front-rear direction. Each guide frame body extends in the front-rear direction away from the connecting unit. The attenuation unit includes two attenuation components, two rear ferrules, and two front ferrules. The attenuation components are arranged in the transverse direction and disposed within the main housing. The rear ferrules respectively extend rearwardly from rear ends of the attenuation components into the insertion holes. The front ferrules respectively extend forwardly from front ends of the attenuation components through and outwardly of the main housing.
    Type: Grant
    Filed: January 19, 2023
    Date of Patent: July 29, 2025
    Assignees: GLORIOLE ELECTROPTIC TECHNOLOGY CORP., SHEN ZHEN WONDERWIN TECHNOLOGY CO., LTD.
    Inventors: Hsien-Hsin Hsu, Yu Cheng Chen, Ke Xue Ning, Shu Bin Li
  • Publication number: 20250216791
    Abstract: A method for manufacturing a photomask is provided. The method includes: forming a target layer over a substrate; forming a patterned photoresist layer over the target layer; applying ozonated deionized water to oxidize organic materials over the substrate; applying an alkaline solution to soften the patterned photoresist layer after applying the ozonated deionized water; and removing the softened patterned photoresist layer by mechanical impact.
    Type: Application
    Filed: March 18, 2025
    Publication date: July 3, 2025
    Inventors: YU-HSIN HSU, HAO-MING CHANG, SHAO-CHI WEI, SHENG-CHANG HSU, CHENG-MING LIN
  • Patent number: 12347225
    Abstract: An under-display optical fingerprint sensors employing microlens arrays (MLAs) and an opaque aperture layer includes high aspect-ratio metal aperture structures for efficient angular signal filtering and stray light control. Instead of relying on one or more opaque aperture baffle-layers, embodiments disclosed herein utilize an image sensor's inherent metal layers for filtering signals originated from unwanted angular ranges and blocking undesired stray light could achieve similar or better performance with simplified process flow and lower cost. Layers from the sensors' inherent metal layers are brought into the sensing area on purpose to form the high aspect-ratio metal aperture structure. The metal layers in the sensing area may include apertures aligned to apertures in the opaque layer, and may also be grounded.
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: July 1, 2025
    Assignee: OmniVision Technologies, Inc.
    Inventors: Shih-Hsin Hsu, Jau-Jan Deng
  • Publication number: 20250210593
    Abstract: A stacked package has a first package and a second package vertically stacked and electrically connected to each other. Any one or each of the first package and the second package includes a first substrate and a second substrate, wherein a chip cavity is formed on an inner surface of the first substrate and a first flip-chip is mounted in the chip cavity. A second flip-chip facing the chip cavity is mounted on an inner surface of the second substrate. Multiple inner pads are respectively formed on opposite surfaces of the first and the second substrates for interconnecting the substrates electrically. Because no encapsulant is provided to cover the first flip-chip and the second flip-chip, the problem of separation between the encapsulant and the substrates is avoided.
    Type: Application
    Filed: November 5, 2024
    Publication date: June 26, 2025
    Applicant: POWERTECH TECHNOLOGY INC.
    Inventors: HUNG HSIN HSU, LIEN CHIA CHANG
  • Publication number: 20250208358
    Abstract: An optical fiber accessory includes a front housing, a rear housing sleeve, and a loopback module. The front housing defines two insertion slots extending in a front-rear direction and spaced apart from each other in a first direction perpendicular to the front-rear direction, and two core slots being respectively in spatial communication with the insertion slots. The rear housing sleeve is sleeved on a rear end of the front housing and defines a receiving space in spatial communication with the core slots. The loopback module is disposed in the rear housing sleeve, and includes two ferrules fixed onto the rear housing sleeve, and an optical fiber loop having two ends respectively connected to the ferrules and disposed in the receiving space. The ferrules project toward the front housing in the front-rear direction and extend respectively into the core slots.
    Type: Application
    Filed: April 18, 2024
    Publication date: June 26, 2025
    Inventors: Hsien-Hsin HSU, Yu-Cheng CHEN, Jim LIN
  • Publication number: 20250210482
    Abstract: A stacked package device has a first package and a second package vertically stacked and electrically connected to each other. One or each of the first package and the second package includes a first substrate, a second substrate and multiple conductive bumps. A first flip-chip and a second flip-chip are respectively mounted on opposite surfaces of the first substrate and the second substrate. The multiple conductive bumps are electrically connected between the opposite surfaces of the first substrate and the second substrate to achieve signal transmission between the first flip-chip and the second flip-chip. The use of the multiple conductive bumps avoids the structure damage resulting from thermal stress. Since no encapsulant is provided to cover each flip-chip, the problem of separation between the encapsulant and the substrate is avoided.
    Type: Application
    Filed: November 5, 2024
    Publication date: June 26, 2025
    Applicant: POWERTECH TECHNOLOGY INC.
    Inventors: HUNG HSIN HSU, LIEN CHIA CHANG
  • Publication number: 20250134500
    Abstract: The present disclosure provides a bone harvester for harvesting a bone core from a bone. Also provided are tools operable with the bone harvester, including a pushing tool and a bone harvesting guide. The present disclosure also provides a method of processing a bone by using the bone harvester and/or other tools of the present disclosure. Bone cores having distorted cylindrical bodies are also described.
    Type: Application
    Filed: October 30, 2024
    Publication date: May 1, 2025
    Inventors: Chun-Jen Liao, Yung-Chih Wu, Pei Hsin Hsu, Zhi Yu Chen, Amarpreet S. Sawhney
  • Publication number: 20250130211
    Abstract: A method of screening new psychoactive substance is provided, including providing a sample; placing the sample on chromatographic paper; ionizing the sample on the chromatographic paper by a direct analysis in real time (DART); performing a mass spectrometry analysis on the ionized sample to obtain a sample mass spectrum; and comparing a known standard mass spectrum with the sample mass spectrum, in which when a profile of the known standard mass spectrum is the same as a profile of the sample mass spectrum and the known standard mass spectrum is not exactly the same as the sample mass spectrum, the sample is determined to be the new psychoactive substance. A platform for screening new psychoactive substance is also provided to quickly screen out the new psychoactive substance.
    Type: Application
    Filed: February 8, 2024
    Publication date: April 24, 2025
    Applicant: National Taiwan University
    Inventors: Cheng-Chih Hsu, Wei-Hsin Hsu, Kai-Wen Cheng, Hsin-Bai Zou, Tzu-Hsuan Feng
  • Patent number: 12282260
    Abstract: A method for cleaning is provided. The method includes: removing a pellicle frame from a top surface of a photomask by debonding an adhesive between the photomask and the pellicle frame, wherein a first portion of the adhesive is remained on the top surface of the photomask, and removing the first portion of the adhesive on the top surface of the photomask, including applying an alkaline solution to the top surface of the photomask, and performing a mechanical impact to the photomask.
    Type: Grant
    Filed: December 23, 2021
    Date of Patent: April 22, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yu-Hsin Hsu, Hao-Ming Chang, Shao-Chi Wei, Sheng-Chang Hsu, Cheng-Ming Lin
  • Publication number: 20250105928
    Abstract: A system for radio frequency (RF) residual sideband (RSB) calibration includes a complex (in phase/quadrature (I/Q)) signal receiver, a signal generator configured to generate a transmit (Tx) signal, a first phase shifter operably coupled to the real signal transmitter, a first signal combiner configured to combine a receive (Rx) signal with the transmit (Tx) signal to generate a first combined signal, a second phase shifter configured to provide a selected phase shift to the first combined signal, and a complex downconverter configured to generate an in phase Rx signal and a quadrature Rx signal alternatively using an in phase LO signal and a quadrature LO signal to generate one or more signals indicative of relative Tx-Rx LO phase (?), amplitude (A), Tx LO I/Q phase mismatch (?), Rx I/Q amplitude mismatch (?), and Rx I/Q phase mismatch (?) at the output of the complex receiver.
    Type: Application
    Filed: September 21, 2023
    Publication date: March 27, 2025
    Inventors: Cheng-Han WANG, Varun Amar REDDY, Qi ZHOU, Hsin-Hsu CHEN, Liang ZHAO, Koorosh AKHAVAN, Yi ZENG, Chan Hong PARK, Le Nguyen LUONG
  • Publication number: 20250085485
    Abstract: An optical fiber connector includes a fastener member threadedly connected to a main housing. A resilient member is received in the main housing and the fastener member, and abuts against the fastener member. A rotatable tube seat is sleeved by the resilient member, and is positioned by the main housing and the resilient member. A turning member is sleeved on the rotatable tube seat, and is sleeved by the fastener member. The rotatable tube seat is co-rotatable with the turning member. When the fastener member is loosened from the main housing, the turning member is rotatable relative to the fastener member to drive rotation of the rotatable tube seat relative to the main housing.
    Type: Application
    Filed: December 15, 2023
    Publication date: March 13, 2025
    Inventors: Hsien-Hsin HSU, Yu-Cheng CHEN, Yen-Chang LEE
  • Publication number: 20250040276
    Abstract: An image sensor package includes an image sensor chip having a chip body, a metal dam, and a transparent substrate having a surface. The chip body has an active surface including a photosensitive area and a non-sensitive area surrounding the photosensitive area. The metal dam is formed on the non-sensitive area of the active surface, surrounds a photosensitive layer formed on the photosensitive area at intervals, is electrically insulated from the chip body, and has a thickness. A glue dam is formed on the surface and is aligned with and is bonded to the metal dam. A thickness of the glue dam is less than the thickness of the metal dam. Accordingly, the metal dam and the glue dam are combined to form a dam structure, and the quantity of liquid glue to form the glue dam is decreased. Thus, the yield of the image sensor package is enhanced.
    Type: Application
    Filed: September 6, 2023
    Publication date: January 30, 2025
    Applicant: Powertech Technology Inc.
    Inventor: Hung-Hsin HSU
  • Publication number: 20250025028
    Abstract: A multichannel endoscope system includes a light module configured to emit illumination light on an object, an image module configured to capture an image of the object, and a multichannel sensor module configured to obtain a spectral information of the object. The multichannel sensor module includes an image lens, a light homogenizer and a multichannel array sensor, where the light homogenizer is formed between the multichannel array sensor and the image lens.
    Type: Application
    Filed: July 18, 2023
    Publication date: January 23, 2025
    Inventors: Jau-Jan Deng, Chang-Long Chen, Shih-Hsin Hsu
  • Patent number: 12198540
    Abstract: A message transmission method for a roadside equipment includes the following steps. A plurality of external sensor information is received. A road intersection sign phase information and a road map information are inputted. An object position analysis, a speed analysis, and an sign analysis in object moving direction are performed based on the external sensor information, the road intersection sign phase information, and the road map information, and a classification of dangerous objects in different groups is outputted. According to a current transmission bandwidth limitation and the classification of the dangerous objects, a dangerous object message with a higher classification of the dangerous objects is preferentially selected and transmitted within available transmission bandwidth.
    Type: Grant
    Filed: December 23, 2021
    Date of Patent: January 14, 2025
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Shi-Xin Chen, Te-Hsuan Liu, Wei-Hsin Hsu, Qin Wang, Chun-Che Chang, Jing-Shyang Hwu
  • Patent number: 12154863
    Abstract: A fan-out semiconductor package includes: a redistribution structure; a functional chip coupled to the redistribution structure; an isolation structure disposed on the redistribution structure and including a body formed with through-holes; a shielding structure disposed on the isolation structure and the redistribution structure; a first conductive pattern structure disposed on the isolation structure and extending through the through-holes of the isolation structure; an encapsulating structure disposed on the isolation structure, the shielding structure and the first conductive pattern structure; and a second conductive pattern structure disposed on the encapsulating structure. A method for manufacturing the fan-out semiconductor package is also disclosed.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: November 26, 2024
    Assignee: Powertech Technology Inc.
    Inventors: Shang-Yu Chang Chien, Nan-Chun Lin, Hung-Hsin Hsu
  • Patent number: 12111503
    Abstract: The fiber optic connector includes a connector head module, a mounting seat, a rear boot, an engaging module and a sheath member. The mounting seat is mounted to a rear end of the connector head module, and includes an external threaded portion. The rear boot is connected to a rear end of the mounting seat. The engaging module is removably coupled to the connector head module. The sheath member includes an internal threaded portion that is formed in an inner surface of the sheath member. When the engaging module is removed from the connector head module, the sheath member can be attachable to the mounting seat with the external threaded portion being threadedly engaged with the external threaded portion of the mounting seat.
    Type: Grant
    Filed: April 20, 2022
    Date of Patent: October 8, 2024
    Assignees: Gloriole Electroptic Technology Corp., Shen Zhen Wonderwin Technology Co., Ltd.
    Inventors: Hsien-Hsin Hsu, Yen-Chang Lee, Ke Xue Ning
  • Publication number: 20240329327
    Abstract: A fiber optic adapter includes a shielding casing that is connected to a casing body and that defines a through channel. Two engagement members extend from a casing body and extend through the through channel. A pivot shaft engages the shielding casing. A shielding plate is connected to the pivot shaft. A restoring member is sleeved on the pivot shaft. The shielding plate is pivotable about the pivot shaft against a resilient force of the restoring member from a shielding position to an open position relative to the shielding casing. When the shielding plate is in the shielding position, the shielding plate is disposed between the engagement members and shields the through channel. When the shielding plate is in the open position, the shielding plate opens the through channel.
    Type: Application
    Filed: June 16, 2023
    Publication date: October 3, 2024
    Inventors: Hsien-Hsin HSU, Wu-Li CHU, Yen-Chang LEE, Shu-Bin LI
  • Patent number: 12092886
    Abstract: An optical fiber distribution frame includes a casing and a plurality of tray units disposed in the casing. Each tray unit includes a partition plate, a plurality of inner guiding rails disposed on the partition plate, a plurality of mounting seats each removably disposed between adjacent two of the inner guiding rails, and a plurality of cable management members disposed respectively in front of the inner guiding rails and each including a lower clamp portion fixed to the partition plate, and an upper clamp portion cooperating with the lower clamp portion to define a cable accommodating space, having one end that cooperates with one end of the lower clamp portion to define an open slot in spatial communication with the cable accommodating space, and operable to adjust a dimension of the open slot to allow or prevent removal of optical fibers from the cable accommodating space.
    Type: Grant
    Filed: June 14, 2022
    Date of Patent: September 17, 2024
    Assignee: GLORIOLE ELECTROPTIC TECHNOLOGY CORP.
    Inventor: Hsien-Hsin Hsu
  • Patent number: 12092887
    Abstract: A fiber optic distribution frame includes a casing and a plurality of tray units disposed in the casing. Each tray unit includes a partition plate, a plurality of inner guiding rails disposed on the partition plate, and a plurality of mounting seats each disposed between adjacent two of the inner guiding rails and movable forwardly and rearwardly to be removed from the adjacent two of the inner guiding rails.
    Type: Grant
    Filed: June 14, 2022
    Date of Patent: September 17, 2024
    Assignee: GLORIOLE ELECTROPTIC TECHNOLOGY CORP.
    Inventor: Hsien-Hsin Hsu
  • Patent number: D1047897
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: October 22, 2024
    Assignee: GOGORO INC.
    Inventors: Chien-Chih Weng, Chen-Hsin Hsu, Yu-Jung Wang