Patents by Inventor HSIN-HUA TSAI

HSIN-HUA TSAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136280
    Abstract: A method includes forming a dielectric layer over a contact pad of a device, forming a first polymer layer over the dielectric layer, forming a first conductive line and a first portion of a second conductive line over the first polymer layer, patterning a photoresist to form an opening over the first portion of the second conductive feature, wherein after patterning the photoresist the first conductive line remains covered by photoresist, forming a second portion of the second conductive line in the opening, wherein the second portion of the second conductive line physically contacts the first portion of the second conductive line, and forming a second polymer layer extending completely over the first conductive line and the second portion of the second conductive line.
    Type: Application
    Filed: January 2, 2024
    Publication date: April 25, 2024
    Inventors: Chao-Wen Shih, Chen-Hua Yu, Han-Ping Pu, Hsin-Yu Pan, Hao-Yi Tsai, Sen-Kuei Hsu
  • Patent number: 11923455
    Abstract: A semiconductor device and method of forming the same are disclosed. The semiconductor device includes a fin structure, a gate electrode, a source-drain region, a plug and a hard mask structure. The gate electrode crosses over the fin structure. The source-drain region in the fin structure is aside the gate electrode. The plug is disposed over and electrically connected to the gate electrode. The hard mask structure surrounds the plug and is disposed over the gate electrode, wherein the hard mask structure includes a first hard mask layer and a second hard mask layer, the second hard mask layer covers a sidewall and a top surface of the first hard mask layer, and a material of the first hard mask layer is different from a material of the second hard mask layer.
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Sheng Liang, Kuo-Hua Pan, Hsin-Che Chiang, Ming-Heng Tsai
  • Publication number: 20210361469
    Abstract: A liquid absorbing bag adapted to be disposed on an excretory portion is provided, the excretory portion has an excretory outlet, and the liquid absorbing bag includes a liquid collecting bag and an absorbing pad. The liquid collecting bag defines a liquid accommodating space, and an opening communicating with the liquid accommodating space and allowing the excretory portion to enter the liquid accommodating space. The absorbing pad is arranged in the liquid accommodating space, and includes an absorbing sheet body. The absorbing sheet body has a folded portion disposed at an end of the liquid collecting bag away from the opening. The folded portion is folded along a plurality of substantially parallel fold lines and is expandable and compressible along a length direction perpendicular to the fold lines.
    Type: Application
    Filed: May 20, 2020
    Publication date: November 25, 2021
    Inventors: Yi-Ching Liu, Hsin-Hua Tsai
  • Publication number: 20210236793
    Abstract: The invention discloses a multi-tube body adapter which is connected to a plurality of outer tubes for application to a digestive system and a respiratory system of a human body. The multi-tube body adapter includes a housing to form an accommodating space of the multi-chamber. The plurality of chambers is not in communication with each other. One end of the plurality of chambers respectively provides a connection port and the other end of the plurality of chambers is commonly connected to an extension having a plurality of openings. By connecting with the chamber, the connection port and the opening, a supply path for separately providing the supply path of the respiratory system and the digestive system can be formed.
    Type: Application
    Filed: February 5, 2020
    Publication date: August 5, 2021
    Inventors: YI-CHING LIU, HSIN-HUA TSAI, CHIA-FANG CHANG