Abstract: A manufacturing method of semiconductor device is provided. In the manufacturing method, a tunneling dielectric layer, floating gates on the tunneling dielectric layer, an ONO layer on the floating gates, and control gates on the ONO layer are formed. During the formation of the floating gates and the control gates, reactive-ion etching (R.I.E.) is not used at all, and thus damage to the floating and control gates from high-density plasma is prevented, such as charge trap in the floating gates may be significantly reduced to improve the reliability of data storage.

Abstract: A manufacturing method of semiconductor device is provided. In the manufacturing method, a tunneling dielectric layer, floating gates on the tunneling dielectric layer, an ONO layer on the floating gates, and control gates on the ONO layer are formed. During the formation of the floating gates and the control gates, reactive-ion etching (R.I.E.) is not used at all, and thus damage to the floating and control gates from high-density plasma is prevented, such as charge trap in the floating gates may be significantly reduced to improve the reliability of data storage.

Abstract: A semiconductor device and a manufacturing method of the same are provided. The semiconductor device includes a substrate, a plurality of floating gates, a tunneling dielectric layer, a plurality of control gates, and an ONO layer. The floating gates are located on the substrate, and the tunneling dielectric layer is located between the substrate and each of the floating gates. The control gates are located on the floating gates, and the ONO layer is located on two sidewalls of each of the control gates and between each of the control gates and each of the floating gates.

Abstract: A method for forming a semiconductor structure includes forming a gate electrode layer over a semiconductor substrate, forming a first spacer layer to cover a sidewall of the gate electrode layer, recessing the first spacer layer to expose an upper portion of the sidewall of the gate electrode layer, forming a metal material to cover an upper surface and the upper portion of the sidewall of the gate electrode layer; reacting a semiconductor material of the gate electrode layer with the metal material using an anneal process to form a silicide layer, and removing the metal material after the anneal process.

Abstract: A method for forming a semiconductor structure includes forming a gate electrode layer over a semiconductor substrate, forming a first spacer layer to cover a sidewall of the gate electrode layer, recessing the first spacer layer to expose an upper portion of the sidewall of the gate electrode layer, forming a metal material to cover an upper surface and the upper portion of the sidewall of the gate electrode layer; reacting a semiconductor material of the gate electrode layer with the metal material using an anneal process to form a silicide layer, and removing the metal material after the anneal process.

Abstract: A semiconductor device and a manufacturing method of the same are provided. The semiconductor device includes a substrate, a plurality of floating gates, a tunneling dielectric layer, a plurality of control gates, and an ONO layer. The floating gates are located on the substrate, and the tunneling dielectric layer is located between the substrate and each of the floating gates. The control gates are located on the floating gates, and the ONO layer is located on two sidewalls of each of the control gates and between each of the control gates and each of the floating gates.