Abstract: The present invention provides a light emitting diode (LED) package, which includes a carrier substrate having a first surface and a second surface; a metal layer formed in the first surface of the carrier substrate, and a through hole formed in the central area of the metal layer to expose the portion of the first surface of the carrier substrate; a LED having a semiconductor layer capable of light emitting, and an N electrode and a P electrode on the two sides of the semiconductor layer, in which P electrode is electrically connected to the first surface of the metal layer; a first connecting element is electrically connected to the metal layer; a second connecting element is electrically connected to the N electrode; and an encapsulated material is formed to cover the LED, the metal layer, the exposed first connecting element and the second connecting element.

Abstract: The present invention provides erected LED package structure, which includes: a carrier substrate having a first surface, a second surface and a plurality of through holes passed through the first surface and the second surface of the carrier substrate, and the conductive material filled with each of the through holes; a LED having a semiconductor layer capable of the light emitting and an N electrode and a P electrode formed on the two sides of the semiconductor layer thereon; a first transparent carrier substrate having a metal layer thereon, in which the metal layer electrically connected to the N electrode of the LED and to the conductive material which is formed on the first surface of the carrier substrate; a second transparent carrier substrate having another metal layer thereon, in which another metal layer electrically connected to the P electrode of the LED and to another conductive material which is formed on the first surface of the carrier substrate; and a plurality of connecting elements electri