Abstract: A semiconductor device includes a first semiconductor fin that is formed over a substrate and extends along a first lateral axis. The semiconductor device includes a second semiconductor fin that is also formed over the substrate and extends along the first lateral axis. At least a tip portion of the first semiconductor fin and at least a tip portion of the second semiconductor fin bend toward each other along a second lateral axis that is perpendicular to the first lateral axis.

Abstract: A backlight module includes a light-emitting element, a quantum dot film, an optical film and a light adjusting element. The light-emitting element is adapted to emit a blue light. The quantum dot film is adapted to converting a first portion and a second portion of the blue light into a red light and a green light, respectively. The optical film is disposed on the quantum dot film. The light adjusting element is disposed between the optical film and the quantum dot film. The light adjusting element has a first surface and a second surface respectively facing the quantum dot film and the optical film. The first surface has multiple first optical microstructures. The first optical microstructures include multiple cones protruding toward the quantum dot film. Moreover, a display apparatus including the backlight module is also provided.

Abstract: A method includes cropping a plurality of images from a layout of an integrated circuit, generating a first plurality of hash values, each from one of the plurality of images, loading a second plurality of hash values stored in a hotspot library, and comparing each of the first plurality of hash values with each of the second plurality of hash values. The step of comparing includes calculating a similarity value between the each of the first plurality of hash values and the each of the second plurality of hash values. The method further includes comparing the similarity value with a pre-determined threshold similarity value, and in response to a result that the similarity value is greater than the pre-determined threshold similarity value, recording a position of a corresponding image that has the result. The position is the position of the corresponding image in the layout.

Abstract: A bonded assembly may be formed by: disposing a packaging substrate having substrate-side bonding structures over a transparent plate; heating the packaging substrate using radiative heating in which a radiative heating source provides radiation to a bottom surface of the packaging substrate through the transparent plate; attaching a semiconductor die having die-side bonding structures to a bottom of a thermocompressive bonding head; bringing the semiconductor die and the packaging substrate to indirect contact with each other with an array of solder material portions therebetween; and bonding the semiconductor die to the packaging substrate by reflowing and solidifying the solder material portions.

Abstract: A semiconductor device includes a first semiconductor fin that is formed over a substrate and extends along a first lateral axis. The semiconductor device includes a second semiconductor fin that is also formed over the substrate and extends along the first lateral axis. At least a tip portion of the first semiconductor fin and at least a tip portion of the second semiconductor fin bend toward each other along a second lateral axis that is perpendicular to the first lateral axis.

Abstract: A power converter is provided. The power converter includes first to fourth switches electrically connected in series, a flying capacitor and a controller. Positive and negative terminals of the flying capacitor are electrically connected to the second and third switches respectively. The controller operates the first and fourth switches to perform a first complementary switching with a first dead time, and operates the second and third switches to perform a second complementary switching with a second dead time. The controller determines to regulate the first or second dead time by detecting a capacitor voltage of the flying capacitor, such that the capacitor voltage of the flying capacitor is maintained within a balance voltage range.

Abstract: The present disclosure, in some embodiments, relates to an image sensor integrated chip. The image sensor integrated chip includes a plurality of gate structures arranged along a first side of a substrate within a plurality of pixel regions. An etch block structure is arranged on the first side of the substrate between neighboring ones of the plurality of gate structures. A contact etch stop layer (CESL) is arranged on the etch block structure between the neighboring ones of the plurality of gate structures. An isolation structure is disposed between one or more sidewalls of the substrate and extends from a second side of the substrate to the first side of the substrate. The etch block structure is vertically between the isolation structure and the CESL.

Abstract: A modular power supply is disclosed. The modular power supply includes a power supply unit and an expansion unit. The expansion unit is detachably disposed on the power supply unit and located on one side of the power supply unit in a thickness direction of the modular power supply.

Abstract: An electronic device includes a light guide plate, a plurality of light sources, a sealant frame and at least an optical film. The light guide plate includes a first end portion and a second end portion opposite to each other. The plurality of light sources are disposed adjacent to the second end portion and are arranged along the first direction. The sealant frame is disposed adjacent to the first end portion. One of the at least an optical film includes a body portion and a lug portion connected to the body portion, and the lug portion is fixed on the sealant frame. The body portion includes a first side adjacent to the sealant frame and, in a second direction, a shortest distance between the first side and the sealant film is in a range of 0 mm to 0.4 mm.

Abstract: An electronic device, including an active device substrate, an insulation film, a vertical wire, and an anisotropic conductive adhesive, is provided. The active device substrate includes a substrate, a first wire, and a second wire. The first wire is configured on a first surface of the substrate, the second wire is configured on a second surface of the substrate, and a side surface connects the first surface to the second surface that is opposite to the first surface. The insulation film is configured on the side surface of the substrate. The vertical wire is configured on a surface of the insulation film and is located between the insulation film and the side surface of the substrate. The anisotropic conductive adhesive is configured between the vertical wire and the side surface of the substrate and electrically connects the vertical wire to the first wire and the second wire.

Abstract: A lens device includes a main body, a positioning magnet group, a shutter and a fixed magnet group. The main body includes first and second ends opposite to each other, and first and second sides opposite to each other. The positioning magnet group includes first, second and third positioning magnets. The first positioning magnet is close to the first end and the first side. The second positioning magnet is close to the second end and the second side. The third positioning magnet is located between the first and second positioning magnets. The shutter is movably disposed on the main body. The fixed magnet group is disposed on the shutter, and includes first and second fixed magnets. The first fixed magnet attracts with the first positioning magnet and repels with the third positioning magnet. The second fixed magnet attracts with the second positioning magnet.

Abstract: The present invention relates to an extension structure of flexible substrates with conductive wires thereon. In a first embodiment, three flexible substrates are prepared, each having multiple conductive wires configured on their front surfaces. The third flexible substrate is flipped over, with its conductive wires facing downwards, and bonded across a boundary formed by the first and second flexible substrates. As a result, the corresponding conductive wires between the first and second flexible substrates are electrically coupled with each other through being physically pressed by corresponding conductive wires in the third flexible substrate.

Abstract: A wet etching control system includes a liquid level detector, an etching agent spraying component, a cleaning agent spraying component and controller. The liquid level detector is configured to detect a liquid level of leakage liquid in a leakage liquid collection tank, and the controller is configured to control the etching agent spraying component to stop a spraying of an etching agent onto a surface of a wafer, and control the cleaning agent spraying component to spray a cleaning agent onto the surface of the wafer when the liquid level of the leakage liquid is greater than a first preset value.

Abstract: A micro-light-emitting diode (microLED) display panel includes a substrate and a driver bonded on the substrate. The driver includes a signal terminal coupled with a signal wire disposed on the substrate; and a repair terminal associated with the signal terminal, the repair terminal coupled with a repair wire disposed on the substrate.

Abstract: A detection device, including a substrate, a switch element, a photosensitive element, and a planarization layer, is provided. The switch element is disposed on the substrate. The photosensitive element includes a bottom electrode, a top electrode, and a first semiconductor disposed between the bottom electrode and the top electrode. The planarization layer is disposed between the bottom electrode and the switch element. The bottom electrode is coupled to the switch element.

Abstract: A fan stator structure includes a silicon steel sheet lamination formed of a plurality of laminated silicon steel sheets located between a set of insulating supports and having coils wound thereon; and a plurality of conducting coil end holders respectively including a fixing section and a connecting section, and a receiving zone located between the two sections. The fixing and the connecting section are located at two opposite ends of the conducting coil end holder, and the fixing section is connected to the set of insulating supports. The receiving zone is configured for receiving a front and a back end of the coils, so that the front and back ends of the coils are in contact with the conducting coil end holders. With the conducting coil end holders, the fan stator structure can be manufactured with simplified procedures, reduced time and labor costs, and upgraded good yield rate.

Abstract: A fixing module suitable for fixing to one of a first end and a second end of a screen bracket is provided. The fixing module includes a first part and a second part. The second part is slidably connected to the first part. The fixing module is configured to be fixed to the first end of the screen bracket by the first part or fixed to the second end of the screen bracket by the second part.

Abstract: A HEMT device including a substrate structure, a channel layer, a barrier layer, a gate electrode, a drain electrode, a first source field plate, a second source field plate, and a dielectric structure is provided. The first source field plate extends from the second side of the gate electrode to the first side of the gate electrode. The second source field plate is located on the first side of the gate electrode and is located between the drain electrode and the first source field plate. There is a gap between the first source field plate and the second source field plate. The first source field plate has an end adjacent to the gap. The thickness of the dielectric structure located directly below the second source field plate is greater than the thickness of the dielectric structure located directly below the end of the first source field plate.

Abstract: Provided is a bioreactor apparatus including: a liquid storage chamber for storing a liquid containing a first ion; a pump; a culture chamber for accommodating the liquid and cells to be cultured; and an ion-exchange chamber accommodating an ion-exchange substrate containing a second ion. Affinity of the second ion to the ion-exchange substrate is lower than affinity of the first ion to the ion-exchange substrate, or molar concentration of the second ion far outweigh molar concentration of the first ion. The storage chamber, the pump, the culture chamber and the ion-exchange chamber are connected via pipelines to form a closed loop, and the pump is configured to provide pressure to drive flow of the liquid in the closed loop. Also provided are a method for regulating ion concentration by the ion-exchange substrate and a method for cell culture by the bioreactor apparatus.

Abstract: A display includes a screen, a stand and a hanging element. The stand is connected to the screen and has a first end and a second end. The hanging element is selectively disposed on the first end or the second end. When the hanging element is disposed on the first end, the hanging element could clamp a first plate; when the hanging element is disposed on the second end, the hanging piece could clamp a second plate, wherein the first plate is perpendicular to the second plate.