Patents by Inventor Hsin-Hung Chen

Hsin-Hung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250006762
    Abstract: An optical device and a method of fabricating the same are disclosed. The optical device includes a first die layer and a second die layer. The first die layer includes a first substrate having a first surface and a second surface opposite to the first surface, first and second pixel structures, an inter-pixel isolation structure disposed in the first substrate and surrounding the first and second pixel structures, and a floating diffusion region disposed in the first substrate and between the first and second pixel structures. The second die layer includes a second substrate having a third surface and a fourth surface opposite to the third surface and a pixel transistor group disposed on the third surface of the second substrate and electrically connected to the first and second pixel structures.
    Type: Application
    Filed: January 12, 2024
    Publication date: January 2, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Chieh CHUANG, Hsin-Hung CHEN, Wen-I HSU, Peng-Chieh CHIN, Feng-Chi HUNG, Ming-En CHEN, Jen-Cheng LIU, Dun-Nian YAUNG
  • Publication number: 20240427076
    Abstract: An electronic device includes a light guide plate, a back plate, a plurality of light sources, an optical film and a buffer member. The back plate accommodates the light guide plate and includes a bottom plate, a side plate, a bending portion and a first notch portion, wherein a side of the bending portion and a side of the bottom plate are respectively connected to opposite sides of the side plate, the bending portion is overlapped with the bottom plate, the first notch portion is adjacent to the bending portion, and the first notch portion is overlapped with the bottom plate. The light sources are disposed between the bottom plate and the bending portion. The optical film is disposed on the light guide plate and is separated from the bending portion. The buffer member is overlapped with the first notch portion and the light guide plate.
    Type: Application
    Filed: September 3, 2024
    Publication date: December 26, 2024
    Inventors: Shih-Ching HSU, Hsin-Hung CHEN, Chia-Yu CHUNG
  • Patent number: 12152697
    Abstract: A control valve includes a valve body and a valve gate. The valve gate is movably located inside the inner space. The control valve has a lower flow rate limit which is greater than zero. That is, the lower flow rate limit has no necessary to be zero, thus it is acceptable to have a cylindrical valve gate but not a spherical valve gate, and a diameter of the cylindrical valve gate is be smaller than a caliber of an opening of the valve body. Therefore, the valve gate can be directly installed into the valve body via the opening, which allows the valve body to be made of a single piece so as to simplify the processes of manufacturing and assembly.
    Type: Grant
    Filed: June 13, 2023
    Date of Patent: November 26, 2024
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Shui-Fa Tsai, Sy-Chi Kuo, Hsin-Hung Chen
  • Patent number: 12132484
    Abstract: Whether a voltage difference reaches a hysteresis voltage of a hysteresis comparator is used to efficiently update a charge of a capacitor and achieve lower power consumption. On the other hand, since the advanced voltage holding circuit is designed to consume lower power, the refresh time must be designed longer, which makes it impossible to do a large number of yield tests. Thus, the test time in conjunction with the relevant application circuit can be greatly shortened, and the testability and reliability of a voltage holding device can be increased.
    Type: Grant
    Filed: February 10, 2023
    Date of Patent: October 29, 2024
    Assignee: NUVOTON TECHNOLOGY CORPORATION
    Inventors: Wei Min Hung, Hsin Hung Chen
  • Publication number: 20240355860
    Abstract: The present disclosure, in some embodiments, relates to an image sensor integrated chip. The image sensor integrated chip includes a plurality of gate structures arranged along a first side of a substrate within a plurality of pixel regions. An etch block structure is arranged on the first side of the substrate between neighboring ones of the plurality of gate structures. A contact etch stop layer (CESL) is arranged on the etch block structure between the neighboring ones of the plurality of gate structures. An isolation structure is disposed between one or more sidewalls of the substrate and extends from a second side of the substrate to the first side of the substrate. The etch block structure is vertically between the isolation structure and the CESL.
    Type: Application
    Filed: July 3, 2023
    Publication date: October 24, 2024
    Inventors: Hsin-Hung Chen, Wen-I Hsu, Wei Long Chen, Ming-En Chen, Feng-Chi Hung, Jen-Cheng Liu, Dun-Nian Yaung
  • Patent number: 12114457
    Abstract: A modular power supply is disclosed. The modular power supply includes a power supply unit and an expansion unit. The expansion unit is detachably disposed on the power supply unit and located on one side of the power supply unit in a thickness direction of the modular power supply.
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: October 8, 2024
    Assignee: COOLER MASTER TECHNOLOGY INC.
    Inventors: Hsin-Hung Chen, Jui-Tse Yin
  • Patent number: 12105317
    Abstract: An electronic device includes a light guide plate, a plurality of light sources, a sealant frame and at least an optical film. The light guide plate includes a first end portion and a second end portion opposite to each other. The plurality of light sources are disposed adjacent to the second end portion and are arranged along the first direction. The sealant frame is disposed adjacent to the first end portion. One of the at least an optical film includes a body portion and a lug portion connected to the body portion, and the lug portion is fixed on the sealant frame. The body portion includes a first side adjacent to the sealant frame and, in a second direction, a shortest distance between the first side and the sealant film is in a range of 0 mm to 0.4 mm.
    Type: Grant
    Filed: February 3, 2023
    Date of Patent: October 1, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Shih-Ching Hsu, Hsin-Hung Chen, Chia-Yu Chung
  • Publication number: 20240319474
    Abstract: A lens device includes a main body, a positioning magnet group, a shutter and a fixed magnet group. The main body includes first and second ends opposite to each other, and first and second sides opposite to each other. The positioning magnet group includes first, second and third positioning magnets. The first positioning magnet is close to the first end and the first side. The second positioning magnet is close to the second end and the second side. The third positioning magnet is located between the first and second positioning magnets. The shutter is movably disposed on the main body. The fixed magnet group is disposed on the shutter, and includes first and second fixed magnets. The first fixed magnet attracts with the first positioning magnet and repels with the third positioning magnet. The second fixed magnet attracts with the second positioning magnet.
    Type: Application
    Filed: February 14, 2024
    Publication date: September 26, 2024
    Inventor: HSIN-HUNG CHEN
  • Patent number: 12095020
    Abstract: A micro-light-emitting diode (microLED) display panel includes a substrate and a driver bonded on the substrate. The driver includes a signal terminal coupled with a signal wire disposed on the substrate; and a repair terminal associated with the signal terminal, the repair terminal coupled with a repair wire disposed on the substrate.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: September 17, 2024
    Assignee: Prilit Optronics, Inc.
    Inventors: Biing-Seng Wu, Hsin-Hung Chen
  • Patent number: 12094734
    Abstract: A wet etching control system includes a liquid level detector, an etching agent spraying component, a cleaning agent spraying component and controller. The liquid level detector is configured to detect a liquid level of leakage liquid in a leakage liquid collection tank, and the controller is configured to control the etching agent spraying component to stop a spraying of an etching agent onto a surface of a wafer, and control the cleaning agent spraying component to spray a cleaning agent onto the surface of the wafer when the liquid level of the leakage liquid is greater than a first preset value.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: September 17, 2024
    Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
    Inventors: Hsin-Hung Chen, Yen-Teng Huang
  • Patent number: 12074498
    Abstract: A fan stator structure includes a silicon steel sheet lamination formed of a plurality of laminated silicon steel sheets located between a set of insulating supports and having coils wound thereon; and a plurality of conducting coil end holders respectively including a fixing section and a connecting section, and a receiving zone located between the two sections. The fixing and the connecting section are located at two opposite ends of the conducting coil end holder, and the fixing section is connected to the set of insulating supports. The receiving zone is configured for receiving a front and a back end of the coils, so that the front and back ends of the coils are in contact with the conducting coil end holders. With the conducting coil end holders, the fan stator structure can be manufactured with simplified procedures, reduced time and labor costs, and upgraded good yield rate.
    Type: Grant
    Filed: October 8, 2020
    Date of Patent: August 27, 2024
    Assignee: ASIA VITAL COMPONENTS (CHINA) CO., LTD.
    Inventors: Yeh-Chih Lu, Hsin-Hung Chen
  • Publication number: 20240236257
    Abstract: A method, a processing device, and a system for information display are proposed. The information display system is installed on a mobile vehicle and includes a light transmitting display, an image capturing device configured to capture a target image of a target object, a positioning device configured to generate position information of the mobile vehicle, and a processing device configured to perform the following operations. First reference position information of the target object is calculated according to the position information of the mobile vehicle. Object recognition processing is performed on the target image. A display position of virtual information of the target object is determined using a recognition result of the object recognition processing or the first reference position information according to the recognition result of the object recognition processing.
    Type: Application
    Filed: March 3, 2023
    Publication date: July 11, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Yu-Hsuan Su, Hsin-Hung Chen, Ting-Hsun Cheng, Yu-Ju Chao, Chi-Wen Jung, Chia-Hsun Tu
  • Patent number: 11980338
    Abstract: An endoscope device includes a hollow tube, a thermal-conductive member, an image-capturing module, and a heat-dissipation tube. The hollow tube includes an insertion end. The thermal-conductive member is in the hollow tube and adjacent to the insertion end. The thermal-conductive member includes a first end, a second end, and a receiving groove. The first end is near to the insertion end as compared with the second end, and the receiving groove is between the first end and the second end. The image-capturing module includes a camera module and a circuit board in the receiving groove. The camera module is at the insertion end and electrically connected to the circuit board. The first end contacts the camera module. The heat-dissipation tube is in the hollow tube. One end of the heat-dissipation tube contacts the thermal conductive member, and the other end of the heat-dissipation tube extends away from the insertion end.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: May 14, 2024
    Assignee: CHICONY ELECTRONICS CO., LTD.
    Inventor: Hsin-Hung Chen
  • Patent number: 11955428
    Abstract: A semiconductor structure includes a substrate, a conductive via and a first insulation layer. The conductive via is through the substrate. The first insulation layer is between the substrate and the conductive via. A first surface of the first insulation layer facing the substrate and a second surface of the first insulation layer facing the conductive via are extended along different directions.
    Type: Grant
    Filed: February 6, 2021
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Hsin-Hung Chen, Min-Feng Kao, Hsing-Chih Lin, Jen-Cheng Liu, Dun-Nian Yaung
  • Patent number: 11929767
    Abstract: A transmission interface between at least a first module and a second module is proposed. The transmission interface includes at least two physical transmission mediums. Each physical transmission medium is arranged to carry a multiplexed signal in which at least two signals are integrated. The at least two physical transmission mediums include a first physical transmission medium arranged to carry a first multiplexed signal including a first IF signal and a reference clock signal. The first IF signal and the reference clock signal are at different frequencies.
    Type: Grant
    Filed: August 16, 2022
    Date of Patent: March 12, 2024
    Assignee: MEDIATEK INC.
    Inventors: Chieh-Hsun Hsiao, Ming-Chou Wu, Wen-Chang Lee, Narayanan Baskaran, Wei-Hsin Tseng, Jenwei Ko, Po-Sen Tseng, Hsin-Hung Chen, Chih-Yuan Lin, Caiyi Wang
  • Publication number: 20240048129
    Abstract: The technical solution proposed by the present disclosure is to use whether a voltage difference reaches a hysteresis voltage of a hysteresis comparator to efficiently update a charge of a capacitor and achieve lower power consumption. On the other hand, since the advanced voltage holding circuit is designed to consume lower power, the refresh time must be designed longer, which makes it impossible to do a large number of yield tests. Thus, the technical solution proposed by the present disclosure can greatly shorten the test time in conjunction with the relevant application circuit, and increase the testability and reliability of a voltage holding device.
    Type: Application
    Filed: February 10, 2023
    Publication date: February 8, 2024
    Inventors: WEI MIN HUNG, HSIN HUNG CHEN
  • Patent number: 11894735
    Abstract: A manufacturing method of fan stator structure includes the steps of providing a fan stator; providing a plurality of coil lead wire holders at an end of the fan stator; and winding lead wires on the fan stator to form coils, and setting and connecting a front end and a back end of each of the lead wires to the coil lead wire holders. The above method eliminates the drawbacks of the conventional fan stator coil winding operation, such as requiring manual twisting and trimming of the lead wire front ends and back ends and leaking of tin solder occurred during welding of the lead wires to a circuit board.
    Type: Grant
    Filed: October 8, 2020
    Date of Patent: February 6, 2024
    Assignee: ASIA VITAL COMPONENTS (CHINA) CO., LTD.
    Inventors: Yeh-Chih Lu, Hsin-Hung Chen
  • Publication number: 20240030261
    Abstract: Various embodiments of the present disclosure are directed towards an image sensor including a plurality of photodetectors disposed within a substrate. The photodetectors are disposed respectively within a plurality of pixel regions. A floating diffusion node is disposed along a front-side surface of the substrate at a middle region of the plurality of pixel regions. A plurality of well regions is disposed within the substrate at corners of the plurality of pixel regions. An isolation structure extends into a back-side surface of the substrate. The isolation structure comprises a plurality of elongated isolation components disposed between adjacent pixel regions, a middle isolation component aligned with the floating diffusion node, and multiple peripheral isolation components aligned with the plurality of well regions. The elongated isolation components have a first height and the middle and peripheral isolation components have a second height less than the first height.
    Type: Application
    Filed: January 5, 2023
    Publication date: January 25, 2024
    Inventors: Wen-I Hsu, Hsin-Hung Chen, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Wen-Chang Kuo
  • Publication number: 20230401465
    Abstract: A method for inferring device fingerprint, performed by a processor, includes: obtaining a current device dataset including current device features from a user interface operating on a user device, when the current device dataset further includes a current protocol address and a device fingerprint pointer table does not include a current number of a target device fingerprint pointer corresponding to the current protocol address, obtaining a history protocol address, first history device features and first history number of the target device fingerprint pointer, when the current protocol address matches the history protocol address and the current device features matches the first history device features, using one first history number as the current number, and when the current protocol address does not match the history protocol address and the current device features matches the first history device features, setting the current number to point to a new device fingerprint.
    Type: Application
    Filed: September 8, 2022
    Publication date: December 14, 2023
    Applicant: HITRUST.COM INCORPORATED
    Inventors: Hsin-Hung CHEN, Jen-Hao TSAI, See Sang HO
  • Publication number: 20230361149
    Abstract: In some embodiments, the present disclosure relates to a method for forming an image sensor and associated device structure. A backside deep trench isolation (BDTI) structure is formed in a substrate separating a plurality of pixel regions. The BDTI structure encloses a plurality of photodiodes and comprising a first BDTI component arranged at a crossroad of the plurality of pixel regions and a second BDTI component arranged at remaining peripheries of the plurality of pixel regions. The first BDTI component has a first depth from a backside of the substrate smaller than a second depth of the second BDTI component.
    Type: Application
    Filed: August 8, 2022
    Publication date: November 9, 2023
    Inventors: Hsin-Hung Chen, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Wen-Chang Kuo, Hung-Wen Hsu, Shih-Chang Liu