Abstract: A method for fabricating a semiconductor device is provided. The method includes depositing a ferroelectric layer over the substrate; performing a first ionized physical deposition process to deposit a top electrode layer over the ferroelectric layer; patterning the top electrode layer into a top electrode; and patterning the ferroelectric layer to into a ferroelectric element below the top electrode.

Abstract: A method includes cropping a plurality of images from a layout of an integrated circuit, generating a first plurality of hash values, each from one of the plurality of images, loading a second plurality of hash values stored in a hotspot library, and comparing each of the first plurality of hash values with each of the second plurality of hash values. The step of comparing includes calculating a similarity value between the each of the first plurality of hash values and the each of the second plurality of hash values. The method further includes comparing the similarity value with a pre-determined threshold similarity value, and in response to a result that the similarity value is greater than the pre-determined threshold similarity value, recording a position of a corresponding image that has the result. The position is the position of the corresponding image in the layout.

Abstract: A light-emitting device includes a semiconductor stack including a first semiconductor layer, a second semiconductor layer and an active area between the first semiconductor layer and the second semiconductor layer, wherein the first semiconductor layer including an upper surface; an exposed region formed in the semiconductor stack to expose the upper surface; a first protective layer covering the exposed region and a portion of the second semiconductor layer, wherein the first protective layer includes a first part with a first thickness formed on the upper surface and a second part with a second thickness formed on the second semiconductor layer, the first thickness is smaller than the second thickness; a first reflective structure formed on the second semiconductor layer and including one or multiple openings; and a second reflective structure formed on the first reflective structure and electrically connected to the second semiconductor layer through the one or multiple openings.

Abstract: A package includes a first package component; a second package component bonded to the first package component by a first plurality of solder connectors; and a first plurality of spacer connectors extending from the first package component to the second package component. A diameter of a spacer connector the first plurality of spacer connectors is larger than a height of a solder connector of the first plurality of solder connectors, and the first plurality of spacer connectors comprises a different material than the first plurality of solder connectors.

Abstract: A semiconductor structure includes substrate, semiconductor layers, source/drain features, metal oxide layers, and a gate structure. The semiconductor layers extend in an X-direction and over the substrate. The semiconductor layers are spaced apart from each other in a Z-direction. The source/drain features are on opposite sides of the semiconductor layers in the X-direction. The metal oxide layers cover bottom surfaces of the semiconductor layers. The gate structure wraps around the semiconductor layers and the metal oxide layers. The metal oxide layers are in contact with the gate structure.

Abstract: An optical device and a method of fabricating the same are disclosed. The optical device includes a first die layer and a second die layer. The first die layer includes a first substrate having a first surface and a second surface opposite to the first surface, first and second pixel structures, an inter-pixel isolation structure disposed in the first substrate and surrounding the first and second pixel structures, and a floating diffusion region disposed in the first substrate and between the first and second pixel structures. The second die layer includes a second substrate having a third surface and a fourth surface opposite to the third surface and a pixel transistor group disposed on the third surface of the second substrate and electrically connected to the first and second pixel structures.

Abstract: An electronic device includes a light guide plate, a back plate, a plurality of light sources, an optical film and a buffer member. The back plate accommodates the light guide plate and includes a bottom plate, a side plate, a bending portion and a first notch portion, wherein a side of the bending portion and a side of the bottom plate are respectively connected to opposite sides of the side plate, the bending portion is overlapped with the bottom plate, the first notch portion is adjacent to the bending portion, and the first notch portion is overlapped with the bottom plate. The light sources are disposed between the bottom plate and the bending portion. The optical film is disposed on the light guide plate and is separated from the bending portion. The buffer member is overlapped with the first notch portion and the light guide plate.

Abstract: A control valve includes a valve body and a valve gate. The valve gate is movably located inside the inner space. The control valve has a lower flow rate limit which is greater than zero. That is, the lower flow rate limit has no necessary to be zero, thus it is acceptable to have a cylindrical valve gate but not a spherical valve gate, and a diameter of the cylindrical valve gate is be smaller than a caliber of an opening of the valve body. Therefore, the valve gate can be directly installed into the valve body via the opening, which allows the valve body to be made of a single piece so as to simplify the processes of manufacturing and assembly.

Abstract: Whether a voltage difference reaches a hysteresis voltage of a hysteresis comparator is used to efficiently update a charge of a capacitor and achieve lower power consumption. On the other hand, since the advanced voltage holding circuit is designed to consume lower power, the refresh time must be designed longer, which makes it impossible to do a large number of yield tests. Thus, the test time in conjunction with the relevant application circuit can be greatly shortened, and the testability and reliability of a voltage holding device can be increased.

Abstract: The present disclosure, in some embodiments, relates to an image sensor integrated chip. The image sensor integrated chip includes a plurality of gate structures arranged along a first side of a substrate within a plurality of pixel regions. An etch block structure is arranged on the first side of the substrate between neighboring ones of the plurality of gate structures. A contact etch stop layer (CESL) is arranged on the etch block structure between the neighboring ones of the plurality of gate structures. An isolation structure is disposed between one or more sidewalls of the substrate and extends from a second side of the substrate to the first side of the substrate. The etch block structure is vertically between the isolation structure and the CESL.

Abstract: A modular power supply is disclosed. The modular power supply includes a power supply unit and an expansion unit. The expansion unit is detachably disposed on the power supply unit and located on one side of the power supply unit in a thickness direction of the modular power supply.

Abstract: An electronic device includes a light guide plate, a plurality of light sources, a sealant frame and at least an optical film. The light guide plate includes a first end portion and a second end portion opposite to each other. The plurality of light sources are disposed adjacent to the second end portion and are arranged along the first direction. The sealant frame is disposed adjacent to the first end portion. One of the at least an optical film includes a body portion and a lug portion connected to the body portion, and the lug portion is fixed on the sealant frame. The body portion includes a first side adjacent to the sealant frame and, in a second direction, a shortest distance between the first side and the sealant film is in a range of 0 mm to 0.4 mm.

Abstract: A lens device includes a main body, a positioning magnet group, a shutter and a fixed magnet group. The main body includes first and second ends opposite to each other, and first and second sides opposite to each other. The positioning magnet group includes first, second and third positioning magnets. The first positioning magnet is close to the first end and the first side. The second positioning magnet is close to the second end and the second side. The third positioning magnet is located between the first and second positioning magnets. The shutter is movably disposed on the main body. The fixed magnet group is disposed on the shutter, and includes first and second fixed magnets. The first fixed magnet attracts with the first positioning magnet and repels with the third positioning magnet. The second fixed magnet attracts with the second positioning magnet.

Abstract: A wet etching control system includes a liquid level detector, an etching agent spraying component, a cleaning agent spraying component and controller. The liquid level detector is configured to detect a liquid level of leakage liquid in a leakage liquid collection tank, and the controller is configured to control the etching agent spraying component to stop a spraying of an etching agent onto a surface of a wafer, and control the cleaning agent spraying component to spray a cleaning agent onto the surface of the wafer when the liquid level of the leakage liquid is greater than a first preset value.

Abstract: A micro-light-emitting diode (microLED) display panel includes a substrate and a driver bonded on the substrate. The driver includes a signal terminal coupled with a signal wire disposed on the substrate; and a repair terminal associated with the signal terminal, the repair terminal coupled with a repair wire disposed on the substrate.

Abstract: A fan stator structure includes a silicon steel sheet lamination formed of a plurality of laminated silicon steel sheets located between a set of insulating supports and having coils wound thereon; and a plurality of conducting coil end holders respectively including a fixing section and a connecting section, and a receiving zone located between the two sections. The fixing and the connecting section are located at two opposite ends of the conducting coil end holder, and the fixing section is connected to the set of insulating supports. The receiving zone is configured for receiving a front and a back end of the coils, so that the front and back ends of the coils are in contact with the conducting coil end holders. With the conducting coil end holders, the fan stator structure can be manufactured with simplified procedures, reduced time and labor costs, and upgraded good yield rate.

Abstract: A method, a processing device, and a system for information display are proposed. The information display system is installed on a mobile vehicle and includes a light transmitting display, an image capturing device configured to capture a target image of a target object, a positioning device configured to generate position information of the mobile vehicle, and a processing device configured to perform the following operations. First reference position information of the target object is calculated according to the position information of the mobile vehicle. Object recognition processing is performed on the target image. A display position of virtual information of the target object is determined using a recognition result of the object recognition processing or the first reference position information according to the recognition result of the object recognition processing.

Abstract: An endoscope device includes a hollow tube, a thermal-conductive member, an image-capturing module, and a heat-dissipation tube. The hollow tube includes an insertion end. The thermal-conductive member is in the hollow tube and adjacent to the insertion end. The thermal-conductive member includes a first end, a second end, and a receiving groove. The first end is near to the insertion end as compared with the second end, and the receiving groove is between the first end and the second end. The image-capturing module includes a camera module and a circuit board in the receiving groove. The camera module is at the insertion end and electrically connected to the circuit board. The first end contacts the camera module. The heat-dissipation tube is in the hollow tube. One end of the heat-dissipation tube contacts the thermal conductive member, and the other end of the heat-dissipation tube extends away from the insertion end.

Abstract: A semiconductor structure includes a substrate, a conductive via and a first insulation layer. The conductive via is through the substrate. The first insulation layer is between the substrate and the conductive via. A first surface of the first insulation layer facing the substrate and a second surface of the first insulation layer facing the conductive via are extended along different directions.

Abstract: A transmission interface between at least a first module and a second module is proposed. The transmission interface includes at least two physical transmission mediums. Each physical transmission medium is arranged to carry a multiplexed signal in which at least two signals are integrated. The at least two physical transmission mediums include a first physical transmission medium arranged to carry a first multiplexed signal including a first IF signal and a reference clock signal. The first IF signal and the reference clock signal are at different frequencies.