Abstract: A layer stack including a first bonding dielectric material layer, a dielectric metal oxide layer, and a second bonding dielectric material layer is formed over a top surface of a substrate including a substrate semiconductor layer. A conductive material layer is formed by depositing a conductive material over the second bonding dielectric material layer. The substrate semiconductor layer is thinned by removing portions of the substrate semiconductor layer that are distal from the layer stack, whereby a remaining portion of the substrate semiconductor layer includes a top semiconductor layer. A semiconductor device may be formed on the top semiconductor layer.

Abstract: A system performs a method of adaptive voltage scaling. The method includes generating a voltage adjustment signal based on a hint from a frequency-locked loop (FLL). The FLL includes an oscillator that generates a clock signal at a clock frequency. The voltage adjustment signal is sent to a power management unit (PMU) to cause the PMU to supply an adjusted operating voltage to the FLL. The method further includes updating a minimum code set according to the adjusted operating voltage and an operating temperature. The clock frequency of the oscillator is generated to match a target frequency according to the adjusted operating voltage and a code determined by the FLL from the minimum code set.

Abstract: A light source module and a display device are provided. The light source module includes a light source, a light guide plate, and an optical film set including multiple first optical microstructures having a first surface, multiple second optical microstructures having a second surface, and multiple third optical microstructures having a third surface. Each of the multiple first optical microstructures has a first vertex angle, each of the multiple second optical microstructures has a second vertex angle, and each of the multiple third optical microstructures has a third vertex angle. The third vertex angle is less than the first vertex angle, and the first vertex angle is less than or equal to the second vertex angle. By configuring the aforementioned optical microstructures, the light source module of the disclosure may greatly improve the collimation of light and has favorable luminance.

Abstract: A light-emitting device, including a first type semiconductor layer, a patterned insulating layer, a light-emitting layer, and a second type semiconductor layer, is provided. The patterned insulating layer covers the first type semiconductor layer and has a plurality of insulating openings. The insulating openings are separated from each other. The light-emitting layer is located in the plurality of insulating openings and covers a portion of the first type semiconductor layer. The second type semiconductor layer is located on the light-emitting layer.

Abstract: A semiconductor structure includes a substrate, a conductive via and a first insulation layer. The conductive via is through the substrate. The first insulation layer is between the substrate and the conductive via. A first surface of the first insulation layer facing the substrate and a second surface of the first insulation layer facing the conductive via are extended along different directions.

Abstract: An analysis method and an electronic apparatus for breast image are provided. The method includes the following steps. One or more breast ultrasound images are obtained. The breast ultrasound images are used for forming a three-dimensional (3D) breast model. A volume of interest (VOI) in the breast ultrasound image is obtained by applying a detection model on the 3D breast model. The VOI is compared with a tissue segmentation result. The VOI is determined as a false positive according to a compared result between the VOI and the tissue segmentation result. The compared result includes that the VOI is located at a glandular tissue based on the tissue segmentation result. In response to the VOI being located in the glandular tissue of the tissue segmentation result, the VOI is compared with the lactiferous duct in the 3D breast model.

Abstract: A semiconductor die package includes a high dielectric constant (high-k) dielectric layer over a device region of a first semiconductor die that is bonded with a second semiconductor die in a wafer on wafer (WoW) configuration. A through silicon via (TSV) structure may be formed through the device region. The high-k dielectric layer has an intrinsic negative charge polarity that provides a coupling voltage to modify the electric potential in the device region. In particular, the electron carriers in high-k dielectric layer attracts hole charge carriers in device region, which suppresses trap-assist tunnels that result from surface defects formed during etching of the recess for the TSV structure. Accordingly, the high-k dielectric layer described herein reduces the likelihood of (and/or the magnitude of) current leakage in semiconductor devices that are included in the device region of the first semiconductor die.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: A display including a screen, a bracket, a hanging element and a fixing element is provided. The support is connected to the screen and has a top end and a bottom end. The hanging element is disposed on the top end. The fixing element is disposed at the bottom end. When the hanging element is hung on an upper edge of a plate, the fixing element is fixed on a surface of the plate.

Abstract: The technical solution proposed by the present disclosure is to use whether a voltage difference reaches a hysteresis voltage of a hysteresis comparator to efficiently update a charge of a capacitor and achieve lower power consumption. On the other hand, since the advanced voltage holding circuit is designed to consume lower power, the refresh time must be designed longer, which makes it impossible to do a large number of yield tests. Thus, the technical solution proposed by the present disclosure can greatly shorten the test time in conjunction with the relevant application circuit, and increase the testability and reliability of a voltage holding device.

Abstract: A manufacturing method of fan stator structure includes the steps of providing a fan stator; providing a plurality of coil lead wire holders at an end of the fan stator; and winding lead wires on the fan stator to form coils, and setting and connecting a front end and a back end of each of the lead wires to the coil lead wire holders. The above method eliminates the drawbacks of the conventional fan stator coil winding operation, such as requiring manual twisting and trimming of the lead wire front ends and back ends and leaking of tin solder occurred during welding of the lead wires to a circuit board.

Abstract: Various embodiments of the present disclosure are directed towards an image sensor including a plurality of photodetectors disposed within a substrate. The photodetectors are disposed respectively within a plurality of pixel regions. A floating diffusion node is disposed along a front-side surface of the substrate at a middle region of the plurality of pixel regions. A plurality of well regions is disposed within the substrate at corners of the plurality of pixel regions. An isolation structure extends into a back-side surface of the substrate. The isolation structure comprises a plurality of elongated isolation components disposed between adjacent pixel regions, a middle isolation component aligned with the floating diffusion node, and multiple peripheral isolation components aligned with the plurality of well regions. The elongated isolation components have a first height and the middle and peripheral isolation components have a second height less than the first height.

Abstract: A method for inferring device fingerprint, performed by a processor, includes: obtaining a current device dataset including current device features from a user interface operating on a user device, when the current device dataset further includes a current protocol address and a device fingerprint pointer table does not include a current number of a target device fingerprint pointer corresponding to the current protocol address, obtaining a history protocol address, first history device features and first history number of the target device fingerprint pointer, when the current protocol address matches the history protocol address and the current device features matches the first history device features, using one first history number as the current number, and when the current protocol address does not match the history protocol address and the current device features matches the first history device features, setting the current number to point to a new device fingerprint.

Abstract: In some embodiments, the present disclosure relates to a method for forming an image sensor and associated device structure. A backside deep trench isolation (BDTI) structure is formed in a substrate separating a plurality of pixel regions. The BDTI structure encloses a plurality of photodiodes and comprising a first BDTI component arranged at a crossroad of the plurality of pixel regions and a second BDTI component arranged at remaining peripheries of the plurality of pixel regions. The first BDTI component has a first depth from a backside of the substrate smaller than a second depth of the second BDTI component.

Abstract: A micro-light-emitting diode (microLED) display panel includes a display area divided into a plurality of blocks; a plurality of drivers that drive microLEDs of the blocks respectively; and at least one timing controller that controls the drivers. In each block, anodes of microLEDs in a same row are connected to a corresponding data line, and cathodes of microLEDs in a same column are connected to a corresponding common line.

Abstract: The disclosure provides a control valve which includes a valve body and a valve gate. The valve gate is movably located inside the inner space. The control valve has a lower flow rate limit which is greater than zero. That is, the lower flow rate limit has no necessary to be zero, thus it is acceptable to have a cylindrical valve gate but not a spherical valve gate, and a diameter of the cylindrical valve gate is be smaller than a caliber of an opening of the valve body. Therefore, the valve gate can be directly installed into the valve body via the opening, which allows the valve body to be made of a single piece so as to simplify the processes of manufacturing and assembly.

Abstract: A micro-light-emitting diode (microLED) display panel includes a substrate and a driver bonded on the substrate. The driver includes a signal terminal coupled with a signal wire disposed on the substrate; and a repair terminal associated with the signal terminal, the repair terminal coupled with a repair wire disposed on the substrate.

Abstract: A micro-light-emitting diode (microLED) display panel includes a plurality of microLEDs arranged in rows and columns. Anodes of microLEDs in a same row are connected to a corresponding data line, and cathodes of pixels in a same column are connected to a corresponding group of common lines, each of which is connected to cathodes of microLEDs of different colors.

Abstract: An electronic device is disclosed, which includes: a support unit; a display panel disposed on the support unit; a first circuit board, wherein the support unit is disposed between the display panel and the first circuit board; an electronic component disposed on the first circuit board; and a second circuit board electrically connected to the display panel, wherein the first circuit board is electrically connected to the display panel through the second circuit board, wherein the first circuit board includes a protruding section, and the electronic component is disposed on the protruding section.

Abstract: An electronic device includes a light guide plate, a plurality of light sources, a sealant frame and at least an optical film. The light guide plate includes a first end portion and a second end portion opposite to each other. The plurality of light sources are disposed adjacent to the second end portion and are arranged along the first direction. The sealant frame is disposed adjacent to the first end portion. One of the at least an optical film includes a body portion and a lug portion connected to the body portion, and the lug portion is fixed on the sealant frame. The body portion includes a first side adjacent to the sealant frame and, in a second direction, a shortest distance between the first side and the sealant film is in a range of 0 mm to 0.4 mm.