Abstract: A layer stack including a first bonding dielectric material layer, a dielectric metal oxide layer, and a second bonding dielectric material layer is formed over a top surface of a substrate including a substrate semiconductor layer. A conductive material layer is formed by depositing a conductive material over the second bonding dielectric material layer. The substrate semiconductor layer is thinned by removing portions of the substrate semiconductor layer that are distal from the layer stack, whereby a remaining portion of the substrate semiconductor layer includes a top semiconductor layer. A semiconductor device may be formed on the top semiconductor layer.

Abstract: An anti-peep display device includes a display module and an anti-peep module disposed on the display module. The anti-peep module includes the following features. The first light incident surface faces the display surface, the second and third light incident surfaces are located on opposite sides of the first light incident surface, the first condensing portion is disposed corresponding to the second light incident surface and the first light source, the second condensing portion is disposed corresponding to the third light incident surface and the second light source, the first and second condensing portions convert beams of the first and second light sources into anti-peep beams with a beam angle less than 10 degrees, and the optical microstructures reflect the anti-peep beams and exit the anti-peep beams from the light guide plate. The present invention also provides an anti-peep method applicable to the anti-peep display device.

Abstract: A light source module and a display device are provided. The light source module includes a light source, a light guide plate, and an optical film set including multiple first optical microstructures having a first surface, multiple second optical microstructures having a second surface, and multiple third optical microstructures having a third surface. Each of the multiple first optical microstructures has a first vertex angle, each of the multiple second optical microstructures has a second vertex angle, and each of the multiple third optical microstructures has a third vertex angle. The third vertex angle is less than the first vertex angle, and the first vertex angle is less than or equal to the second vertex angle. By configuring the aforementioned optical microstructures, the light source module of the disclosure may greatly improve the collimation of light and has favorable luminance.

Abstract: A semiconductor structure includes a substrate, a conductive via and a first insulation layer. The conductive via is through the substrate. The first insulation layer is between the substrate and the conductive via. A first surface of the first insulation layer facing the substrate and a second surface of the first insulation layer facing the conductive via are extended along different directions.

Abstract: A semiconductor die package includes a high dielectric constant (high-k) dielectric layer over a device region of a first semiconductor die that is bonded with a second semiconductor die in a wafer on wafer (WoW) configuration. A through silicon via (TSV) structure may be formed through the device region. The high-k dielectric layer has an intrinsic negative charge polarity that provides a coupling voltage to modify the electric potential in the device region. In particular, the electron carriers in high-k dielectric layer attracts hole charge carriers in device region, which suppresses trap-assist tunnels that result from surface defects formed during etching of the recess for the TSV structure. Accordingly, the high-k dielectric layer described herein reduces the likelihood of (and/or the magnitude of) current leakage in semiconductor devices that are included in the device region of the first semiconductor die.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: A backlight module applicable to a key module is provided, the key module includes a plurality of key units and a baseplate, and the plurality of key units are disposed on the baseplate. The backlight module includes a lower substrate, a plurality of periphery light sources disposed along the peripheral of the baseplate, and a shielding structure. The lower substrate is disposed below the baseplate, and there is an outer edge gap between an outer edge of the baseplate and the lower substrate. The periphery light sources are disposed between the baseplate and the lower substrate. The shielding structure is disposed outside those periphery light sources distributed, to prevent light provided by the plurality of light sources from being emitted out of the outer edge gap.

Abstract: A backlight module applicable to a key module is provided, the key module includes a plurality of key units and a baseplate, and the plurality of key units are disposed on the baseplate. The backlight module includes a lower substrate, a plurality of periphery light sources disposed along the peripheral of the baseplate, and a shielding structure. The lower substrate is disposed below the baseplate, and there is an outer edge gap between an outer edge of the baseplate and the lower substrate. The periphery light sources are disposed between the baseplate and the lower substrate. The shielding structure is disposed outside those periphery light sources distributed, to prevent light provided by the plurality of light sources from being emitted out of the outer edge gap.

Abstract: A backlight module applicable to a key module is provided, the key module includes a plurality of key units and a baseplate, and the plurality of key units are disposed on the baseplate. The backlight module includes a lower substrate, a plurality of periphery light sources disposed along the peripheral of the baseplate, and a shielding structure. The lower substrate is disposed below the baseplate, and there is an outer edge gap between an outer edge of the baseplate and the lower substrate. The periphery light sources are disposed between the baseplate and the lower substrate. The shielding structure is disposed outside those periphery light sources distributed, to prevent light provided by the plurality of light sources from being emitted out of the outer edge gap.

Abstract: A keyboard with light-emitting and touch functions includes a keyswitch, a backlight module having a light source and a light guide plate, a membrane, a capacitive touch sensing sheet disposed on the membrane and the light guide plate, and a board. The keyswitch includes a cap and a support mechanism movably connected to the cap. Light of the light source is incident into the light guide plate and is emitted toward the cap. The membrane has a switch and is selectively disposed on or under the backlight module. The board is disposed under the backlight module and the membrane and has first and second connection members. The first and second connection members pass through the membrane, the light guide plate and the capacitive touch sensing sheet to be movably connected to the support mechanism, so as to make the cap movable downward relative to the board for triggering the switch.

Abstract: A receiving device is provided. The receiving device includes an antenna device, a filter circuit, a transceiver, an adjustable attenuator, a circulator, and a processor. The antenna device receives a received signal. The filter circuit separates an in-band signal and an out-band signal from the received signal. The adjustable attenuator adjusts the attenuation value corresponding to the in-band signal and transmits the adjusted in-band signal to the transceiver. The circulator receives the received signal from the antenna device and transmits the received signal to the filter circuit, and the circulator receives a reflected signal from the filter circuit. The processor determines how to adjust the attenuation value corresponding to the in-band signal according to information related to the out-band signal and information related to the in-band signal that has been processed by the adjustable attenuator and the transceiver.

Abstract: A receiving device is provided. The receiving device includes an antenna device, a filter circuit, a transceiver, an adjustable attenuator, a circulator, and a processor. The antenna device receives a received signal. The filter circuit separates an in-band signal and an out-band signal from the received signal. The adjustable attenuator adjusts the attenuation value corresponding to the in-band signal and transmits the adjusted in-band signal to the transceiver. The circulator receives the received signal from the antenna device and transmits the received signal to the filter circuit, and the circulator receives a reflected signal from the filter circuit. The processor determines how to adjust the attenuation value corresponding to the in-band signal according to information related to the out-band signal and information related to the in-band signal that has been processed by the adjustable attenuator and the transceiver.

Abstract: A keyboard with light-emitting and touch functions includes a keyswitch, a backlight module having a light source and a light guide plate, a membrane, a capacitive touch sensing sheet disposed on the membrane and the light guide plate, and a board. The keyswitch includes a cap and a support mechanism movably connected to the cap. Light of the light source is incident into the light guide plate and is emitted toward the cap. The membrane has a switch and is selectively disposed on or under the backlight module. The board is disposed under the backlight module and the membrane and has first and second connection members. The first and second connection members pass through the membrane, the light guide plate and the capacitive touch sensing sheet to be movably connected to the support mechanism, so as to make the cap movable downward relative to the board for triggering the switch.

Abstract: A key switch includes a base, a key cap, a supporting mechanism, a link bar and a buffer member. The key cap is disposed above the base. The supporting mechanism is connected to the key cap and the base to allow the key cap to move relative to the base upwardly and downwardly. The link bar includes a lower linking end. The buffer member and the base are two independent components. The buffer member is disposed on the base and made of material softer than material of the base. A restraining structure is formed on the buffer member. The lower linking end movably passes through the restraining structure. When the key cap moves relative to the base upwardly and downwardly, the lower linking end is driven to move within the restraining structure correspondingly, so as to reduce noise during movement of the lower linking end relative to the base.

Abstract: A key switch includes a base, a key cap, a supporting mechanism, a link bar and a buffer member. The key cap is disposed above the base. The supporting mechanism is connected to the key cap and the base to allow the key cap to move relative to the base upwardly and downwardly. The link bar includes a lower linking end. The buffer member and the base are two independent components. The buffer member is disposed on the base and made of material softer than material of the base. A restraining structure is formed on the buffer member. The lower linking end movably passes through the restraining structure. When the key cap moves relative to the base upwardly and downwardly, the lower linking end is driven to move within the restraining structure correspondingly, so as to reduce noise during movement of the lower linking end relative to the base.

Abstract: A key switch includes a base, a key cap, a link bar and a buffer member. A first hook of a first extending arm of the base and a second hook of a second extending arm of the base extend toward opposite directions respectively. An upper linking end of the link bar is movably connected to the key cap. The buffer member is made of material softer than material of the base. When the first hook and the second hook engage with a first engaging portion and a second engaging portion of the buffer member respectively, a recess structure of the buffer member is adjacent to the base to form a restraining structure. A lower linking end of the link bar is movably disposed through the restraining structure. Therefore, the key switch of the present invention has noise reduction capability.

Abstract: A key switch includes a base, a key cap, a link bar and a buffer member. A first hook of a first extending arm of the base and a second hook of a second extending arm of the base extend toward opposite directions respectively. An upper linking end of the link bar is movably connected to the key cap. The buffer member is made of material softer than material of the base. When the first hook and the second hook engage with a first engaging portion and a second engaging portion of the buffer member respectively, a recess structure of the buffer member is adjacent to the base to form a restraining structure. A lower linking end of the link bar is movably disposed through the restraining structure. Therefore, the key switch of the present invention has noise reduction capability.

Abstract: A keyswitch includes a cap, a support structure, a first magnet, and a baseplate having a bending arm protruding from the baseplate and a support rib extending horizontally to form a receiving space with the bending arm. The support structure includes a first support member pivoted to the baseplate and against the cap and a magnetic permeable plate extending from the first support member and being above the receiving space. The first magnet is inserted into the receiving space to be supported by the support rib and be pressed by the bending arm. When the cap is pressed to make the magnetic permeable plate away from the first magnet as the first support member rotates, the cap moves to a pressed position. When the cap is released, a magnetic attraction force between the magnetic permeable plate and the first magnet drives the magnetic permeable plate to approach the first magnet.

Abstract: A keyswitch includes a cap, a support structure, a first magnet, and a baseplate having a bending arm protruding from the baseplate and a support rib extending horizontally to form a receiving space with the bending arm. The support structure includes a first support member pivoted to the baseplate and against the cap and a magnetic permeable plate extending from the first support member and being above the receiving space. The first magnet is inserted into the receiving space to be supported by the support rib and be pressed by the bending arm. When the cap is pressed to make the magnetic permeable plate away from the first magnet as the first support member rotates, the cap moves to a pressed position. When the cap is released, a magnetic attraction force between the magnetic permeable plate and the first magnet drives the magnetic permeable plate to approach the first magnet.

Abstract: A keyswitch includes a cap, a support structure, a first magnet, and a baseplate having a bending arm protruding from the baseplate and a support rib extending horizontally to form a receiving space with the bending arm. The support structure includes a first support member pivoted to the baseplate and against the cap and a magnetic permeable plate extending from the first support member and being above the receiving space. The first magnet is inserted into the receiving space to be supported by the support rib and be pressed by the bending arm. When the cap is pressed to make the magnetic permeable plate away from the first magnet as the first support member rotates, the cap moves to a pressed position. When the cap is released, a magnetic attraction force between the magnetic permeable plate and the first magnet drives the magnetic permeable plate to approach the first magnet.