Patents by Inventor Hsin-Hung Shen

Hsin-Hung Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11343448
    Abstract: A method of operating an HDR pixel circuit includes: establishing a calibration full-well capacity of a photodiode according to a first predetermined voltage level; over-charging both the photodiode and a floating diffusion node; dissipating the charges of the floating diffusion node and the charges on the photodiode so that the charges on the photodiode are substantially equal to the calibration full-well capacity; transferring the charges on the photodiode to the floating diffusion node; and sensing a voltage on the floating diffusion node to generate a calibration signal related to the calibration full-well capacity.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: May 24, 2022
    Assignee: PIXART IMAGING INCORPORATION
    Inventors: Ren-Chieh Liu, Wen-Cheng Yen, Hsin-Hung Shen
  • Publication number: 20210352231
    Abstract: A method of operating an HDR pixel circuit includes: establishing a calibration full-well capacity of a photodiode according to a first predetermined voltage level; over-charging both the photodiode and a floating diffusion node; dissipating the charges of the floating diffusion node and the charges on the photodiode so that the charges on the photodiode are substantially equal to the calibration full-well capacity; transferring the charges on the photodiode to the floating diffusion node; and sensing a voltage on the floating diffusion node to generate a calibration signal related to the calibration full-well capacity.
    Type: Application
    Filed: May 5, 2020
    Publication date: November 11, 2021
    Inventors: Ren-Chieh Liu, Wen-Cheng Yen, Hsin-Hung Shen
  • Patent number: 8886996
    Abstract: A debugging device for performing a debugging process through an electronic device external connector system is provided. The debugging device performs the debugging process to a target system, and the device comprises a first external connector, a switch, and a debugging module. The first external connector is connected to the external port of the target system. The switch is connected to the first external connector, and the switch chooses to activate the debugging process. The debugging module is connected to the switch, and the debugging module receives a universal asynchronous receiver/transmitter (UART) signal provided by the target system.
    Type: Grant
    Filed: April 2, 2012
    Date of Patent: November 11, 2014
    Assignee: Compal Electronics, Inc.
    Inventors: Chih-Chung Yang, Chun-Sheng Chen, Hsin-Hung Shen
  • Patent number: 8607077
    Abstract: A multi-function integrated device and an operating method thereof are provided. The multi-function integrated device includes a data reading module, a network access module, and a power control module. The network access module includes a first network component corresponding to a LAN and a second network component corresponding to a WLAN. The power control module turns on the function of the data reading module and/or the network access module according to a control signal received from a host. When the function of the network access module is determined to be turned on, the power control module supplies power to the first network component or the second network component according to the control signal.
    Type: Grant
    Filed: February 3, 2010
    Date of Patent: December 10, 2013
    Assignee: Compal Electronics, Inc.
    Inventors: Chun-Yen Lu, Hsin-Hung Shen
  • Publication number: 20130262928
    Abstract: A debugging device for performing a debugging process through an electronic device external connector system is provided. The debugging device performs the debugging process to a target system, and the device comprises a first external connector, a switch, and a debugging module. The first external connector is connected to the external port of the target system. The switch is connected to the first external connector, and the switch chooses to activate the debugging process. The debugging module is connected to the switch, and the debugging module receives a universal asynchronous receiver/transmitter (UART) signal provided by the target system.
    Type: Application
    Filed: April 2, 2012
    Publication date: October 3, 2013
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chih-Chung YANG, Chun-Sheng CHEM, Hsin-Hung SHEN
  • Patent number: 8307228
    Abstract: An integrated network chip and an electronic device using the chip are illustrated. The integrated network chip includes at least a first access interface, at least a second access interface, a power management unit (PMU) and an interface bridge. The first access interface and second access interface respectively provides the electronic device with a local area network connection function and a memory card access function. The interface bridge integrates the first access interface and second access interface by providing a hub-like functionality. The PMU provides the power and the ground to the first access interface, second access interface and the interface bridge. When the PMU detects the second access interface enters a power saving mode, the PMU provides a lower operation voltage to the second access interface.
    Type: Grant
    Filed: February 25, 2010
    Date of Patent: November 6, 2012
    Assignee: Compal Electronics, Inc.
    Inventor: Hsin-Hung Shen
  • Patent number: 8193457
    Abstract: A stack structure of a circuit board includes a first substrate, a second substrate and a fixing element. The first substrate has a first component area, a plurality of supporting solder elements, and a plurality of signal solder elements, wherein the plurality of signal elements is disposed in the first component area. The first substrate stacks on the second substrate. The plurality of supporting solder elements is disposed between the first and the second substrates for providing a supporting force. The fixing element secures the first substrate and the second substrate, and the supporting solder elements are disposed around the fixing element.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: June 5, 2012
    Assignee: Compal Electronics, Inc.
    Inventor: Hsin-Hung Shen
  • Publication number: 20110210754
    Abstract: A capacitance sensing module adapted to an electronic apparatus having a first body and a second body hinged to the first body is provided. The capacitance sensing module includes a capacitance sensor and a metal conductor. The capacitance sensor is adapted to be fixed in the first body. The metal conductor is adapted to be fixed in the second body. When the metal conductor is moved towards the capacitance sensor along with the movement of the second body with respect to the first body and thus a capacitance sensed by the capacitance sensor changes, the capacitance sensor generates a command to start a default function of the electronic apparatus.
    Type: Application
    Filed: October 8, 2010
    Publication date: September 1, 2011
    Applicant: COMPAL ELECTRONICS, INC.
    Inventor: Hsin-Hung Shen
  • Publication number: 20110087902
    Abstract: A multi-function integrated device and an operating method thereof are provided. The multi-function integrated device includes a data reading module, a network access module, and a power control module. The network access module includes a first network component corresponding to a LAN and a second network component corresponding to a WLAN. The power control module turns on the function of the data reading module and/or the network access module according to a control signal received from a host. When the function of the network access module is determined to be turned on, the power control module supplies power to the first network component or the second network component according to the control signal.
    Type: Application
    Filed: February 3, 2010
    Publication date: April 14, 2011
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chun-Yen Lu, Hsin-Hung Shen
  • Publication number: 20110056741
    Abstract: A stack structure of a circuit board includes a first substrate, a second substrate and a fixing element. The first substrate has a first component area, a plurality of supporting solder elements, and a plurality of signal solder elements, wherein the plurality of signal elements is disposed in the first component area. The first substrate stacks on the second substrate. The plurality of supporting solder elements is disposed between the first and the second substrates for providing a supporting force. The fixing element secures the first substrate and the second substrate, and the supporting solder elements are disposed around the fixing element.
    Type: Application
    Filed: December 18, 2009
    Publication date: March 10, 2011
    Applicant: COMPAL ELECTRONICS, INC.
    Inventor: Hsin-Hung Shen
  • Publication number: 20100226388
    Abstract: An integrated network chip and an electronic device using the chip are illustrated. The integrated network chip includes at least a first access interface, at least a second access interface, a power management unit (PMU) and an interface bridge. The first access interface and second access interface respectively provides the electronic device with a local area network connection function and a memory card access function. The interface bridge integrates the first access interface and second access interface by providing a hub-like functionality. The PMU provides the power and the ground to the first access interface, second access interface and the interface bridge. When the PMU detects the second access interface enters a power saving mode, the PMU provides a lower operation voltage to the second access interface.
    Type: Application
    Filed: February 25, 2010
    Publication date: September 9, 2010
    Applicant: COMPAL ELECTRONICS, INC.
    Inventor: Hsin-Hung Shen