Patents by Inventor Hsin-Hung Sung

Hsin-Hung Sung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11764229
    Abstract: A pixel array substrate, including a substrate, multiple conductors, a pixel driving circuit, a first pad, and a second pad, is provided. The substrate has a first surface, a second surface, and multiple through holes. The through holes extend from the first surface to the second surface. The conductors are respectively disposed in the through holes. The pixel driving circuit is disposed on the first surface of the substrate. The first pad and the second pad are disposed on the second surface of the substrate. The conductors include a first conductor, a second conductor, and a first dummy conductor. The first conductor is electrically connected to the pixel driving circuit and the first pad. The second conductor is electrically connected to the pixel driving circuit and the second pad. The first dummy conductor is overlapped with and electrically isolated from the pixel driving circuit.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: September 19, 2023
    Assignee: Au Optronics Corporation
    Inventors: Hsiu-Chun Hsieh, Hsin-Hung Sung, Shu-Hui Huang, Chih-Chung Su, Yi-Wei Chen, Fang-Hui Chan
  • Publication number: 20220254968
    Abstract: An electronic device, including an active device substrate, an insulation film, a vertical wire, and an anisotropic conductive adhesive, is provided. The active device substrate includes a substrate, a first wire, and a second wire. The first wire is configured on a first surface of the substrate, the second wire is configured on a second surface of the substrate, and a side surface connects the first surface to the second surface that is opposite to the first surface. The insulation film is configured on the side surface of the substrate. The vertical wire is configured on a surface of the insulation film and is located between the insulation film and the side surface of the substrate. The anisotropic conductive adhesive is configured between the vertical wire and the side surface of the substrate and electrically connects the vertical wire to the first wire and the second wire.
    Type: Application
    Filed: July 8, 2021
    Publication date: August 11, 2022
    Applicant: Au Optronics Corporation
    Inventors: Hsin-Hung Sung, Yi-Wei Chen
  • Publication number: 20220165755
    Abstract: A pixel array substrate, including a substrate, multiple conductors, a pixel driving circuit, a first pad, and a second pad, is provided. The substrate has a first surface, a second surface, and multiple through holes. The through holes extend from the first surface to the second surface. The conductors are respectively disposed in the through holes. The pixel driving circuit is disposed on the first surface of the substrate. The first pad and the second pad are disposed on the second surface of the substrate. The conductors include a first conductor, a second conductor, and a first dummy conductor. The first conductor is electrically connected to the pixel driving circuit and the first pad. The second conductor is electrically connected to the pixel driving circuit and the second pad. The first dummy conductor is overlapped with and electrically isolated from the pixel driving circuit.
    Type: Application
    Filed: June 28, 2021
    Publication date: May 26, 2022
    Applicant: Au Optronics Corporation
    Inventors: Hsiu-Chun Hsieh, Hsin-Hung Sung, Shu-Hui Huang, Chih-Chung Su, Yi-Wei Chen, Fang-Hui Chan