Patents by Inventor Hsin-Hwa Chen

Hsin-Hwa Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lightning protection structure
    Patent number: 10753591
    Abstract: A lightning protection structure is provided, which includes an insulation bottom layer, a graphite layer on the insulation bottom layer, an insulation shell on the graphite layer, and an electrically conductive component. A part of the electrically conductive component is disposed on the insulation shell, and another part of the electrically conductive component is in contact with the graphite layer.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: August 25, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsiang-Cheng Kung, Hsien-Lin Hu, Hsin-Hwa Chen
  • LIGHTNING PROTECTION STRUCTURE
    Publication number: 20190170338
    Abstract: A lightning protection structure is provided, which includes an insulation bottom layer, a graphite layer on the insulation bottom layer, an insulation shell on the graphite layer, and an electrically conductive component. A part of the electrically conductive component is disposed on the insulation shell, and another part of the electrically conductive component is in contact with the graphite layer.
    Type: Application
    Filed: December 28, 2017
    Publication date: June 6, 2019
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsiang-Cheng Kung, Hsien-Lin Hu, Hsin-Hwa Chen
  • ELECTRICAL DEPOSITION APPARATUS
    Publication number: 20170159196
    Abstract: An electrical deposition apparatus includes a brush plating head. The brush plating head includes a plurality of channels, and there are openings at the same surface of the brush plating head. Each of the channels extends from within the brush plating head to each of the openings.
    Type: Application
    Filed: August 30, 2016
    Publication date: June 8, 2017
    Applicant: Industrial Technology Research Institute
    Inventors: Chun-Fu Lu, Ya-Ching Chou, Li-Wei Liu, Hsin-Hwa Chen
  • Electric conductive heat dissipation substrate
    Patent number: 9397279
    Abstract: An electric conduction heat dissipation substrate includes a ceramic substrate, and a seed layer, and a buffering material layer and a copper circuit layer formed thereon in order. The buffering material layer has a coefficient of thermal expansion between those of the ceramic substrate and the copper circuit layer. Moreover, the buffering material layer is composed of alloy material and ceramic material or composed of metal material and ceramic material.
    Type: Grant
    Filed: May 27, 2014
    Date of Patent: July 19, 2016
    Assignee: Industrial Technology Research Institute
    Inventors: Cheng-Chuan Wang, Cheng-Chou Wong, Chia-Ying Yen, Hsin-Hwa Chen
  • ELECTRIC CONDUCTIVE HEAT DISSIPATION SUBSTRATE
    Publication number: 20150188016
    Abstract: An electric conduction heat dissipation substrate includes a ceramic substrate, and a seed layer, and a buffering material layer and a copper circuit layer formed thereon in order. The buffering material layer has a coefficient of thermal expansion between those of the ceramic substrate and the copper circuit layer. Moreover, the buffering material layer is composed of alloy material and ceramic material or composed of metal material and ceramic material.
    Type: Application
    Filed: May 27, 2014
    Publication date: July 2, 2015
    Applicant: Industrial Technology Research Institute
    Inventors: Cheng-Chuan Wang, Cheng-Chou Wong, Chia-Ying Yen, Hsin-Hwa Chen
  • Heat sinking element and method of treating a heat sinking element
    Patent number: 8492003
    Abstract: A heat sinking element and a method of treating a heat sinking element are provided. The heat sinking element includes a metal substrate. The metal substrate is mainly composed of aluminium. A surface of the metal substrate has a plurality of micro-nano holes and a diameter of the micro-nano holes is smaller than 300 nm. The method of treating a heat sinking element includes performing an oxidation process and an etching process on the metal substrate so as to form the plurality of micro-nano holes.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: July 23, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Cheng-Chuan Wang, Chia-Ying Yen, Hsin-Hwa Chen
  • HEAT SINKING ELEMENT AND METHOD OF TREATING A HEAT SINKING ELEMENT
    Publication number: 20120125577
    Abstract: A heat sinking element and a method of treating a heat sinking element are provided. The heat sinking element includes a metal substrate. The metal substrate is mainly composed of aluminium. A surface of the metal substrate has a plurality of micro-nano holes and a diameter of the micro-nano holes is smaller than 300 nm. The method of treating a heat sinking element includes performing an oxidation process and an etching process on the metal substrate so as to form the plurality of micro-nano holes.
    Type: Application
    Filed: December 30, 2010
    Publication date: May 24, 2012
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Cheng-Chuan Wang, Chia-Ying Yen, Hsin-Hwa Chen