Patents by Inventor Hsin-I Cheng

Hsin-I Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240100147
    Abstract: The present disclosure relates to a chimeric influenza virus hemagglutinin (HA) polypeptide, comprising one or more stem domain sequence, each having at least 60% homology with a stem domain consensus sequence of H1 subtype HA (H1 HA) and/or H5 subtype HA (H5 HA), fused with one or more globular head domain sequence, each having at least 60% homology with a globular head domain consensus sequence of H1 subtype HA (H1 HA) or H5 subtype HA (H5 HA).
    Type: Application
    Filed: November 3, 2023
    Publication date: March 28, 2024
    Inventors: Chi-Huey WONG, Hsin-Yu LIAO, Shih-Chi WANG, Yi-An KO, Kuo-I LIN, Che MA, Ting-Jen CHENG
  • Publication number: 20240088025
    Abstract: The present disclosure provides a method for forming an integrated circuit (IC) structure. The method comprises providing a substrate including a conductive feature; forming aluminum (Al)-containing dielectric layer on the conductive feature; forming a low-k dielectric layer on the Al-containing dielectric layer; and etching the low-k dielectric layer to form a contact trench aligned with the conductive feature. A bottom of the contact trench is on a surface of the Al-containing dielectric layer.
    Type: Application
    Filed: November 27, 2023
    Publication date: March 14, 2024
    Inventors: Hsin-Yen Huang, Kai-Fang Cheng, Chi-Lin Teng, Hai-Ching Chen, Tien-I Bao
  • Patent number: 11918641
    Abstract: The present disclosure relates to a chimeric influenza virus hemagglutinin (HA) polypeptide, comprising one or more stem domain sequence, each having at least 60% homology with a stem domain consensus sequence of H1 subtype HA (H1 HA) and/or H5 subtype HA (H5 HA), fused with one or more globular head domain sequence, each having at least 60% homology with a globular head domain consensus sequence of H1 subtype HA (H1 HA) or H5 subtype HA (H5 HA).
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: March 5, 2024
    Assignee: ACADEMIA SINICA
    Inventors: Chi-Huey Wong, Hsin-Yu Liao, Shih-Chi Wang, Yi-An Ko, Kuo-I Lin, Che Ma, Ting-Jen Cheng
  • Patent number: 10106802
    Abstract: The present invention relates to the application of isolated promoters and synthetic constructs for efficient production of genetically modified cells in a species selected from the Pucciniomycotina and Ustilaginomycotina subphyla, in particular, species selected from the Rhodosporidium, Rhodotourla, Sporobolomyces or Pseudozyma genus.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: October 23, 2018
    Assignee: TEMASEK LIFE SCIENCES LABORATORY LIMITED
    Inventors: Hsin I. Cheng, Ni Peng, Lianghui Ji
  • Publication number: 20160032296
    Abstract: The present invention relates to the application of isolated promoters and synthetic constructs for efficient production of genetically modified cells in a species selected from the Pucciniomycotina and Ustilaginomycotina subphyla, in particular, species selected from the Rhodosporidium, Rhodotourla, Sporobolomyces or Pseudozyma genus.
    Type: Application
    Filed: March 10, 2014
    Publication date: February 4, 2016
    Applicant: TEMASEK LIFE SCIENCES LABORATORY LIMITED
    Inventors: Hsin I. CHENG, Ni PENG, Lianghui JI
  • Publication number: 20080202800
    Abstract: A re-routing method and the circuit thereof, used to rearrange the external circuit coupled with the integrated circuit (IC), comprises the steps of providing a plurality of first conductive plate on the substrate of the IC to form an isolation layer; providing a plurality of second conductive plates on the isolation layer, wherein each of the second conductive plates is moved in isovector with each of the corresponding first conductive plates as the center, each of the second conductive plates electrically connected with each of the first conductive plates. Therefore, according to move the second conductive plates in isovector, the probe card may be reused for circuit testing to save the cost and reduce the material management.
    Type: Application
    Filed: April 25, 2008
    Publication date: August 28, 2008
    Inventors: Ming-Hong Kuo, Bor-Doou Rong, Yi-Chen Wu, Hsin-I Cheng
  • Publication number: 20060284635
    Abstract: A re-routing method and the circuit thereof, used to rearrange the external circuit coupled with the integrated circuit (IC), comprises the steps of providing a plurality of first conductive plate on the substrate of the IC to form an isolation layer; providing a plurality of second conductive plates on the isolation layer, wherein each of the second conductive plates is moved in isovector with each of the corresponding first conductive plates as the center, each of the second conductive plates electrically connected with each of the first conductive plates. Therefore, according to move the second conductive plates in isovector, the probe card may be reused for circuit testing to save the cost and reduce the material management.
    Type: Application
    Filed: January 3, 2006
    Publication date: December 21, 2006
    Inventors: Ming-Hong Kuo, Bor-Doou Rong, Yi-Chen Wu, Hsin-I Cheng