Patents by Inventor Hsin-I CHUANG

Hsin-I CHUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit substrate and package structure
    Patent number: 9786588
    Abstract: The invention provides a circuit substrate and a package structure. The circuit substrate includes a molding compound having a chip-side surface and a solder ball-side surface opposite from the chip side surface. A first conductive bulk is formed embedded in the molding compound. The first conductive bulk has a first number of first chip-side bond pad surfaces and a second number of first solder ball-side surfaces exposed from the chip side surface and the ball-side surface, respectively. The width of the first conductive bulk is greater than the first width of the first chip-side bond pad surfaces and the second width of the first solder ball-side surfaces.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: October 10, 2017
    Assignee: VIA ALLIANCE SEMICONDUCTOR CO., LTD.
    Inventors: Chen-Yueh Kung, Hsin-I Chuang, Ting-You Wei
  • CIRCUIT SUBSTRATE AND PACKAGE STRUCTURE
    Publication number: 20160172289
    Abstract: The invention provides a circuit substrate and a package structure. The circuit substrate includes a molding compound having a chip-side surface and a solder ball-side surface opposite from the chip side surface. A first conductive bulk is formed embedded in the molding compound. The first conductive bulk has a first number of first chip-side bond pad surfaces and a second number of first solder ball-side surfaces exposed from the chip side surface and the ball-side surface, respectively. The width of the first conductive bulk is greater than the first width of the first chip-side bond pad surfaces and the second width of the first solder ball-side surfaces.
    Type: Application
    Filed: September 21, 2015
    Publication date: June 16, 2016
    Inventors: Chen-Yueh KUNG, Hsin-I CHUANG, Ting-You WEI