Abstract: A wafer-level full-color display device and a method for manufacturing the same are provided. In the method, a plurality of LED structures arranged into an array and a peripheral electrode layer surrounding the LED structures are formed on a front side of a wafer substrate. Next, one or more insulating layers are formed to flatten the stepped difference of each of the LED structures and fill up the height difference between the LED structures and the wafer substrate. Afterwards, conductive lines are formed on the one or more insulating layers to provide a reliable electrical connection between the LED structures and the peripheral electrode layer.

Abstract: An electronic device may have a display with an array of inorganic light-emitting diodes. The array of inorganic light-emitting diodes may be overlapped by a polarizer layer such as a circular polarizer. Alternatively, the display may be a polarizer-free display without any polarizer layer over the array of inorganic light-emitting diodes. Each inorganic light-emitting diode may be surrounded by a diffuser that redirects edge-emissions towards a viewer. A top diffuser, a color filter layer, a microlens, and/or a microlens with color filtering and/or diffusive properties may also optionally overlap each inorganic light-emitting diode. The inorganic light-emitting diodes may have reflective sidewalls to mitigate edge-emissions. In this type of arrangement, the array of inorganic light-emitting diodes may be coplanar with one or more opaque masking layers. To mitigate reflections, the display may include two opaque masking layers having differing properties or a single phase separated opaque masking layer.

Abstract: An electronic device may have a display with an array of inorganic light-emitting diodes. The array of inorganic light-emitting diodes may be overlapped by a polarizer layer such as a circular polarizer. Alternatively, the display may be a polarizer-free display without any polarizer layer over the array of inorganic light-emitting diodes. Each inorganic light-emitting diode may be surrounded by a diffuser that redirects edge-emissions towards a viewer. A top diffuser, a color filter layer, a microlens, and/or a microlens with color filtering and/or diffusive properties may also optionally overlap each inorganic light-emitting diode. The inorganic light-emitting diodes may have reflective sidewalls to mitigate edge-emissions. In this type of arrangement, the array of inorganic light-emitting diodes may be coplanar with one or more opaque masking layers. To mitigate reflections, the display may include two opaque masking layers having differing properties or a single phase separated opaque masking layer.

Abstract: A water filter cartridge having an ultraviolet sterilizing function and a water purifier are provided. The water filter cartridge includes a housing, a filtering component, a plurality of flow channels, and an ultraviolet module. The housing has an upper chamber and a lower chamber in fluid communication with the upper chamber. The filtering component is disposed in the upper chamber. The flow channels are arranged in the lower chamber and stacked in a multi-layered arrangement. The ultraviolet module includes an ultraviolet light emitting element disposed in the lower chamber.

Abstract: Disclosed embodiments include vacuum electronic devices, methods of operating a vacuum electronic device, and methods of fabricating a vacuum electronic device. In a non-limiting embodiment, a vacuum electronics device includes a cathode and an anode. At least one focus grid is disposed between the cathode and the anode, and the at least one focus grid is physically disconnected from the cathode. The at least one acceleration grid is disposed between the cathode and the anode, and the at least one acceleration grid is further disposed adjacent the at least one focus grid. The at least one acceleration grid is physically disconnected from the cathode.

Abstract: Various disclosed embodiments include thermionic energy converters and electronic circuitry for generating pulses for igniting plasma in a hermetic package of a thermionic energy converter. In various embodiments, an illustrative thermionic energy converter includes a hermetic package charged with a non-cesium gas additive. The hermetic package is configured to route into the hermetic package pulses for igniting plasma in the hermetic package. A cesium reservoir is disposed in the hermetic package. A cathode is disposed in the hermetic package and an anode is disposed in the hermetic package.

Abstract: Various disclosed embodiments include elements for mitigating electron reflection in a vacuum electronic device, vacuum electronic devices that incorporate elements for mitigating electron reflection, and methods of fabricating elements for reducing reflection of electrons off an electrode. An illustrative electrode assembly includes an electrode. Elements are configured to reduce reflection of electrons off the electrode.

Abstract: An electronic device including a luminous strip is provided, including a housing, a first light guiding strip, a second light guiding strip, a light-transmissive structure, a first light-emitting element, a second light-emitting element and a third light-emitting element. The housing includes a first side wall and a second side wall, where a corner area exists between the first side wall and the second side wall. The first light guiding strip is disposed on the first side wall. The second light guiding strip is disposed on the second side wall. The light-transmissive structure is disposed in the corner area, and connected to the first light guiding strip and the second light guiding strip. The first light-emitting element is disposed at a first end of the first light guiding strip. The second light-emitting element is disposed at a second end of the second light guiding strip.

Abstract: An electronic device including a luminous strip is provided, including a housing, a first light guiding strip, a second light guiding strip, a light-transmissive structure, a first light-emitting element, a second light-emitting element and a third light-emitting element. The housing includes a first side wall and a second side wall, where a corner area exists between the first side wall and the second side wall. The first light guiding strip is disposed on the first side wall. The second light guiding strip is disposed on the second side wall. The light-transmissive structure is disposed in the corner area, and connected to the first light guiding strip and the second light guiding strip. The first light-emitting element is disposed at a first end of the first light guiding strip. The second light-emitting element is disposed at a second end of the second light guiding strip.

Abstract: Disclosed embodiments include vacuum electronics devices and methods of fabricating a vacuum electronics device. In a non-limiting embodiment, a vacuum electronics device includes: an electrode; a plurality of grid supports disposed on the electrode, each of the plurality of grid supports having a first width; and a plurality of grid lines, each of the plurality of grid lines being supported on an associated one of the plurality of grid supports, each of the plurality of grid lines having a second width that is wider than the first width.

Abstract: Disclosed embodiments include vacuum electronics devices and methods of fabricating a vacuum electronics device. In a non-limiting embodiment, a vacuum electronics device includes: an electrode; a plurality of grid supports disposed on the electrode, each of the plurality of grid supports having a first width; and a plurality of grid lines, each of the plurality of grid lines being supported on an associated one of the plurality of grid supports, each of the plurality of grid lines having a second width that is wider than the first width.

Abstract: An LED package structure without pre-stored power sources includes a substrate unit and a LED chip. The substrate unit includes a carrier substrate, a positive conductive pin, and a negative conductive pin. The positive conductive pin is made of a first predetermined material with positive oxidation-reduction potential. The negative conductive pin is made of a second predetermined material with negative oxidation-reduction potential. The LED chip is disposed on the carrier substrate and electrically connected between the positive conductive pin and the negative conductive pin. Both the positive conductive pin and the negative conductive pin concurrently contact a predetermined liquid for generating oxidation-reduction reaction so as to generate electric powers with a predetermined driving voltage, and the LED chip is driven by the electric powers with the predetermined driving voltage for generating an indicator light source.

Abstract: A light emitting diode device including a substrate, a plurality of light emitting elements, and an encapsulant. The substrate has a front surface and a back surface opposite to the front surface. The substrate includes a first portion and a second portion. The first portion has a plurality of light-penetrating holes. The second portion is separated from the first portion. The light emitting elements are disposed adjacent to the light-penetrating holes and on the front surface of the first portion. The encapsulant is disposed on the front surface of the substrate, and covers the light emitting elements.

Abstract: An LED package structure without pre-stored power sources includes a substrate unit and a LED chip. The substrate unit includes a carrier substrate, a positive conductive pin, and a negative conductive pin. The positive conductive pin is made of a first predetermined material with positive oxidation-reduction potential. The negative conductive pin is made of a second predetermined material with negative oxidation-reduction potential. The LED chip is disposed on the carrier substrate and electrically connected between the positive conductive pin and the negative conductive pin. Both the positive conductive pin and the negative conductive pin concurrently contact a predetermined liquid for generating oxidation-reduction reaction so as to generate electric powers with a predetermined driving voltage, and the LED chip is driven by the electric powers with the predetermined driving voltage for generating an indicator light source.

Abstract: A light emitting diode device including a substrate, a plurality of light emitting elements, and an encapsulant. The substrate has a front surface and a back surface opposite to the front surface. The substrate includes a first portion and a second portion. The first portion has a plurality of light-penetrating holes. The second portion is separated from the first portion. The light emitting elements are disposed adjacent to the light-penetrating holes and on the front surface of the first portion. The encapsulant is disposed on the front surface of the substrate, and covers the light emitting elements.

Abstract: The present invention relates to provide an anticorrosive layer having a biomimetic surface nano microstructure and the application. The anticorrosive layer comprises a polymer and a nano-particle. Both of the nano-particle and the biomimetic surface nano microstructure are required for the anticorrosive layer to effectively enhance the anticorrosive performance.

Abstract: The present invention provides a polymer and graphene blended electroactive composite coating material and method for preparing the same. The composite coating material is a composite material formed by blending a specific polymer and graphene; where the specific polymer is formed by polymerization of (A) aniline oligomer and (B) amino reactive monomer together with (C) modified graphene and is a kind of polymer selected by the group consisting of the following: epoxy resin, polyimide, polyamide, polyurethane, polylactic acid; (C) modified graphene is uniformly dispersed in the matrix of the specific polymer but not involved in polymerization; and the composite coating material is electroactive.

Abstract: The invention discloses a spiral electrical connection device and a slide-type electronic device therewith. The slide-type electronic device includes a base, a cover, and the spiral electrical connection device. The cover is slidably connected to the base. The spiral electrical connection device includes an electrical connection member having a first end and a second end and two connecting portions. The two connecting portions are connected to the first end and the second end of the electrical connection member, respectively. The connecting portions are electrically connected to each other via the electrical connection member, and they are connected to the cover and the base, respectively. The electrical connection member winds around a winding direction to the first end. When the cover moves away from the base, the electrical connection member extends. When the cover moves toward the base, the electrical connection member gathers around.

Abstract: A connector includes a main body, two fixing arms and a plurality of signal transmission pins. The main body has a socket and an outer wall, wherein the outer wall surrounds the socket. The two fixing arms are connected to two sides of the outer wall for attaching the main body to a circuit board. The signal transmission pins are connected to the outer wall for electrically connecting with the circuit board.