Abstract: The disclosure provides a semiconductor structure and a method of forming the same. The semiconductor structure includes a base pattern including a channel region and a drain region, a first semiconductor layer on the channel region of the base pattern, and a gate structure on the first semiconductor layer. The gate structure includes a first stack disposed on the first semiconductor layer and a second stack disposed on the first stack. The first stack includes a first sidewall adjacent to the drain region and a second sidewall opposite to the first sidewall in a first direction parallel to a top surface of the base pattern. The first sidewall is at a first distance from the second stack in the first direction, and the second sidewall is at a second distance from the second stack in the first direction. The first distance is greater than the second distance.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: A focus has an opening and an upper surface surrounding the opening. The opening is configured to accommodate a SiC wafer. The SiC wafer has a first surface and a second surface opposite to the first surface. When the focus ring is mounted in a semiconductor wafer processing apparatus and the SiC wafer is positioned in the opening of the focus ring, the upper surface of the focus ring is lower than the first surface of the SiC wafer and is higher than the second surface of the SiC wafer.

Abstract: The present disclosure provides a biofragmentable sponge, comprising a three-dimensional porous scaffold formed by freeze-drying a mixture of about 5% to about 20% (w/w) of silk protein, about 5% to about 85% (w/w) of a water soluble synthetic polymer or a mixture of water soluble synthetic polymers, and about 10% to about 90% (w/w) of a polysaccharide.

Abstract: A method of preparing a slow releasing fertilizer, including the steps of: I) putting twenty parts of inorganic fertilizer and one part of water by weight into a mixer for mixing into a mixture; II) heating the mixture to 105.degree. C.-115.degree. C. and continuously mixing it, therefore causing the mixture to change to liquid state; III) putting zeolite into the liquefied mixture at a volume of about 3 times of that of the inorganic fertilizer by weight, and then continuously heating and mixing until the liquefied fertilizer is absorbed completely by zeolite; IV) cooling down the liquefied mixture with air to below 80.degree. C., causing the mixture to return to the solid state condition; VI) continuously cooling solid state mixture with air to below 50.degree. C., then adding gelatinous substance to the mixture and continuously mixing it; VII) air drying the mixture into the desired finished product.