Patents by Inventor Hsin - Jen Cheng

Hsin - Jen Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CHIMERIC INFLUENZA VACCINES
    Publication number: 20240100147
    Abstract: The present disclosure relates to a chimeric influenza virus hemagglutinin (HA) polypeptide, comprising one or more stem domain sequence, each having at least 60% homology with a stem domain consensus sequence of H1 subtype HA (H1 HA) and/or H5 subtype HA (H5 HA), fused with one or more globular head domain sequence, each having at least 60% homology with a globular head domain consensus sequence of H1 subtype HA (H1 HA) or H5 subtype HA (H5 HA).
    Type: Application
    Filed: November 3, 2023
    Publication date: March 28, 2024
    Inventors: Chi-Huey WONG, Hsin-Yu LIAO, Shih-Chi WANG, Yi-An KO, Kuo-I LIN, Che MA, Ting-Jen CHENG
  • Chimeric influenza vaccines
    Patent number: 11918641
    Abstract: The present disclosure relates to a chimeric influenza virus hemagglutinin (HA) polypeptide, comprising one or more stem domain sequence, each having at least 60% homology with a stem domain consensus sequence of H1 subtype HA (H1 HA) and/or H5 subtype HA (H5 HA), fused with one or more globular head domain sequence, each having at least 60% homology with a globular head domain consensus sequence of H1 subtype HA (H1 HA) or H5 subtype HA (H5 HA).
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: March 5, 2024
    Assignee: ACADEMIA SINICA
    Inventors: Chi-Huey Wong, Hsin-Yu Liao, Shih-Chi Wang, Yi-An Ko, Kuo-I Lin, Che Ma, Ting-Jen Cheng
  • Masking layer formed by applying developable photosensitive resin compositions on panel structure
    Patent number: 9049790
    Abstract: The invention relates to a masking layer. The masking layer produced by coating a white-color photosensitive resin composition on a peripheral region of a transparent substrate, developing the white-color photosensitive resin composition to obtain a patterned composition layer, coating a gray-color photosensitive resin composition on the cured composition layer and developing the gray-color photosensitive resin composition, so that the gray-color photosensitive resin composition is cured to obtain the masking layer having an optical density (O.D.) of ?3.5. The masking layer is adapted for use on a touch panel or a flat panel display device. The masking layer shows a white color appearance when viewed from outside and serves as a white color decoration around the peripheral region of the device. The masking layer further comprises a gray colored sub-layer to mask the electrical circuitry disposed beneath the masking layer.
    Type: Grant
    Filed: August 13, 2013
    Date of Patent: June 2, 2015
    Assignee: ECHEM SOLUTIONS CORP.
    Inventors: Shih-Peng Lin, Yu-cheng Lai, Hsin-Jen Cheng, Yan-fu Pan, Yi-Lun Chiu, Tsung-Mu Yang, Chen-Wen Chiu, Chia-Ling Luo
  • MASKING LAYER FORMED BY APPLYING DEVELOPABLE PHOTOSENSITIVE RESIN COMPOSITIONS ON PANEL STRUCTURE
    Publication number: 20150047881
    Abstract: The invention relates to a masking layer. The masking layer produced by coating a white-color photosensitive resin composition on a peripheral region of a transparent substrate, developing the white-color photosensitive resin composition to obtain a patterned composition layer, coating a gray-color photosensitive resin composition on the cured composition layer and developing the gray-color photosensitive resin composition, so that the gray-color photosensitive resin composition is cured to obtain the masking layer having an optical density (O.D.) of ?3.5. The masking layer is adapted for use on a touch panel or a flat panel display device. The masking layer shows a white color appearance when viewed from outside and serves as a white color decoration around the peripheral region of the device. The masking layer further comprises a gray colored sub-layer to mask the electrical circuitry disposed beneath the masking layer.
    Type: Application
    Filed: August 13, 2013
    Publication date: February 19, 2015
    Applicant: eChem Solutions Corp.
    Inventors: Shih-Peng Lin, Yu-cheng Lai, Hsin - Jen Cheng, Yan-fu Pan, Yi-Lun Chiu, Tsung-Mu Yang, Chen-Wen Chiu, Chia-Ling Luo