Patents by Inventor Hsin-Jen Lin

Hsin-Jen Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240184354
    Abstract: In example implementations, an apparatus is provided. The apparatus includes an interface, an integrated graphical processing unit (GPU), a discrete GPU, and a controller. The interface is to receive a connection to an external display device. The integrated GPU and the discrete GPU are communicatively coupled to the interface. The controller is communicatively coupled to the integrated GPU and the discrete GPU and is to deactivate the discrete GPU and activate the integrated GPU in response to detection of the external display device connected to the interface.
    Type: Application
    Filed: June 29, 2021
    Publication date: June 6, 2024
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chia-Cheng Lin, Hsin-Jen Lin, Heng-Fu Chang, Chao-Shen Chen
  • Patent number: 11992525
    Abstract: The present disclosure relates to a chimeric influenza virus hemagglutinin (HA) polypeptide, comprising one or more stem domain sequence, each having at least 60% homology with a stem domain consensus sequence of H1 subtype HA (H1 HA) and/or H5 subtype HA (H5 HA), fused with one or more globular head domain sequence, each having at least 60% homology with a globular head domain consensus sequence of H1 subtype HA (H1 HA) or H5 subtype HA (H5 HA).
    Type: Grant
    Filed: November 3, 2023
    Date of Patent: May 28, 2024
    Assignee: ACADEMIA SINICA
    Inventors: Chi-Huey Wong, Hsin-Yu Liao, Shih-Chi Wang, Yi-An Ko, Kuo-I Lin, Che Ma, Ting-Jen Cheng
  • Patent number: 11982936
    Abstract: A method of fabricating a photomask includes selectively exposing portions of a photomask blank to radiation to change an optical property of the portions of the photomask blank exposed to the radiation, thereby forming a pattern of exposed portions of the photomask blank and unexposed portions of the photomask blank. The pattern corresponds to a pattern of semiconductor device features.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsin-Chang Lee, Ping-Hsun Lin, Yen-Cheng Ho, Chih-Cheng Lin, Chia-Jen Chen
  • Publication number: 20240154642
    Abstract: The present disclosure provides an electronic module including a circuit including a transmitting part and a receiving part physically separated from the transmitting part. The electronic module also includes an element isolated from the circuit and configured to block electrical interference between the transmitting part and the receiving part.
    Type: Application
    Filed: January 16, 2024
    Publication date: May 9, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shih-Wen LU, Chun-Jen CHEN, Po-Hsiang TSENG, Hsin-Han LIN, Ming-Lun YU
  • Publication number: 20240100553
    Abstract: A sprayer, comprising: a container, configured to contain liquid; a passage, comprising a first opening, a second opening, a resonator and a mesh, when the liquid is passed through the resonator, the liquid is emitted as a gas; a first optical sensor, configured to sense first optical data of at least portion of the mesh or at least portion of a surface of the container; and a processing circuit, configured to compute a foaming level of the mesh or of the surface according to the first optical data, and configured to determine whether the resonator should be turned off or not according to the foaming level. In another aspect, the processing circuit estimates a liquid level of the liquid but does not correspondingly turn off the resonator. By this way, the resonator may be turned on or turned off more properly and the liquid level may be more precisely estimated.
    Type: Application
    Filed: December 5, 2023
    Publication date: March 28, 2024
    Applicant: PixArt Imaging Inc.
    Inventors: Shih-Jen Lu, Yang-Ming Chou, Chih-Hao Wang, Chien-Yi Kao, Hsin-Yi Lin
  • Publication number: 20240100147
    Abstract: The present disclosure relates to a chimeric influenza virus hemagglutinin (HA) polypeptide, comprising one or more stem domain sequence, each having at least 60% homology with a stem domain consensus sequence of H1 subtype HA (H1 HA) and/or H5 subtype HA (H5 HA), fused with one or more globular head domain sequence, each having at least 60% homology with a globular head domain consensus sequence of H1 subtype HA (H1 HA) or H5 subtype HA (H5 HA).
    Type: Application
    Filed: November 3, 2023
    Publication date: March 28, 2024
    Inventors: Chi-Huey WONG, Hsin-Yu LIAO, Shih-Chi WANG, Yi-An KO, Kuo-I LIN, Che MA, Ting-Jen CHENG
  • Publication number: 20240094625
    Abstract: A method of making a semiconductor device includes forming at least one fiducial mark on a photomask. The method further includes defining a pattern including a plurality of sub-patterns on the photomask in a pattern region. The defining the pattern includes defining a first sub-pattern of the plurality of sub-patterns having a first spacing from a second sub-pattern of the plurality of sub-patterns, wherein the first spacing is different from a second spacing between the second sub-pattern and a third sub-pattern of the plurality of sub-patterns.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 21, 2024
    Inventors: Hsin-Chang LEE, Ping-Hsun LIN, Chih-Cheng LIN, Chia-Jen CHEN
  • Publication number: 20240096781
    Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.
    Type: Application
    Filed: March 20, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
  • Patent number: 11918641
    Abstract: The present disclosure relates to a chimeric influenza virus hemagglutinin (HA) polypeptide, comprising one or more stem domain sequence, each having at least 60% homology with a stem domain consensus sequence of H1 subtype HA (H1 HA) and/or H5 subtype HA (H5 HA), fused with one or more globular head domain sequence, each having at least 60% homology with a globular head domain consensus sequence of H1 subtype HA (H1 HA) or H5 subtype HA (H5 HA).
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: March 5, 2024
    Assignee: ACADEMIA SINICA
    Inventors: Chi-Huey Wong, Hsin-Yu Liao, Shih-Chi Wang, Yi-An Ko, Kuo-I Lin, Che Ma, Ting-Jen Cheng
  • Publication number: 20230237153
    Abstract: An example computing device comprises: a media capture device to capture media; a pin coupled to the media capture device to communicate an unlock signal to the media capture device; and a basic input/output system interconnected with the pin, wherein, to control activation of the media capture device, the basic input/output system is to: store an authentication parameter, receive, from the media capture device, an unlock request; in response to the unlock request, verify an authentication input against the authentication parameter, and in response to a successful verification, send the unlock signal to unlock the media capture device via the pin.
    Type: Application
    Filed: July 22, 2020
    Publication date: July 27, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: YI-FAN HSIA, CHIH-KAI CHANG, HUNG-LUNG CHEN, CHIA-CHENG LIN, HSIN-JEN LIN, HENG-FU CHANG
  • Publication number: 20230122719
    Abstract: In some examples, a method includes receiving, by a timing controller of a display device, an indication from an embedded controller of a computing device during a computing device startup procedure. In some examples, the method includes determining, by the timing controller, whether to access display image memory or computing device image memory based on the indication. In some examples, the method includes accessing, by the display device, the computing device image memory in response to determining to access the computing device image memory. In some examples, the method includes causing the display device to display an image from the computing device image memory in response to determining to access the computing device image memory.
    Type: Application
    Filed: October 15, 2021
    Publication date: April 20, 2023
    Inventors: Chia-Cheng Lin, Thong Thai, Hsin-Jen Lin, Super Liao
  • Publication number: 20220270538
    Abstract: Examples for generating a common video signal for an integrated GPU and the graphical processing device, based on a common display mode setting, are described. In an example, a common display mode setting is determined based on a first set of display mode settings supported by the integrated GPU and a second set of display mode settings supported by the graphical processing device. Based on the common display mode setting, video signals for the integrated GPU and the graphical processing device are generated.
    Type: Application
    Filed: October 18, 2019
    Publication date: August 25, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chia-Cheng Lin, Hsin-Jen Lin, Heng-Fu Chang, Tsue-Yi Huang